公开(公告)号：US20200095479A1

公开(公告)日：2020-03-26

申请号：US16497042

申请日：2017-05-09

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jing Fang ,  Dong Yang ,  Jeffrey W. McCutcheon

IPC: C09J9/02 ,  C09J201/02

Abstract: An electrically conductive adhesive layer is described. The adhesive layer includes an adhesive material and pluralities of electrically conductive at least first and second particles. The adhesive layer may have a thickness less than about 35 micrometers and an electrical resistance in the thickness direction of less than about 30 milliohms. A total volume of the pluralities of particles may be greater than 40% of a total volume of the adhesive layer. The first and second particles may have different shapes.

公开(公告)号：US09920226B2

公开(公告)日：2018-03-20

申请号：US15022003

申请日：2014-09-23

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Qing Wu ,  Jing Fang ,  Fei Gao ,  Guannan Yin ,  Hui Zong ,  Jianda Zhang ,  Yuting Wan

IPC: C09J133/08 ,  C09J4/06 ,  C09J133/06 ,  C09J9/02

CPC classification number: C09J133/08 ,  C09J4/06 ,  C09J9/02 ,  C09J133/06 ,  C09J133/064 ,  C09J133/068

Abstract: The present invention provides a thermally curable pressure-sensitive adhesive composition, which, based on the total weight of the composition, comprises the following components: a) 35-99% by weight of a reactive polymethacrylate component having a glass transition temperature Tg of −35° C. to 32° C., and having a reactive functional group which can react with benzoxazine to form an interpenetrating polymer network; and b) 1-65% by weight of a benzoxazine component of the following formula: wherein: X is selected from the group consisting of a covalent bond, C1-C6 alkylene, C3-C10 cycloalkylene group, C═O, S, S═O or O═S═O R1 and R2 are the same or different and independently of each other selected from the group consisting of hydrogen, C1-C6 alkyl, or C5-C14 aryl, and R4 is selected from the group consisting of hydrogen, halogen or C1-C6 alkyl. The present invention also provides an electrically conductive adhesive composition and an adhesive tape comprising the above-described composition, and provides for the use of the composition for preparing membranes used for electronic and electrical products, automobile products and new energy equipment.

公开(公告)号：US20140216807A1

公开(公告)日：2014-08-07

申请号：US14116932

申请日：2011-05-23

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Weide Liu ,  Jing Fang

IPC: H05K9/00

CPC classification number: H05K9/0088 ,  H05K9/0015

Abstract: The present invention provides an electromagnetic shielding gasket and a method for making the same, wherein good electrical conductivity and magnetic diffusivity are achieved by electroplating a layer of Co/Ni alloy according to an appropriate ratio on an open-cell foam, and the gasket can accomplish shielding function for electrical field and magnetic field at the same time.

Abstract translation: 本发明提供一种电磁屏蔽垫圈及其制造方法，其中通过在开孔泡沫上以适当的比例电镀一层Co / Ni合金来实现良好的导电性和磁扩散性，并且垫圈可以 同时实现电场和磁场的屏蔽功能。

公开(公告)号：US12241008B2

公开(公告)日：2025-03-04

申请号：US18560465

申请日：2021-05-26

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Hongyu Gan ,  Yan Wu ,  Jie Huang ,  Jing Fang ,  Jeffrey W. McCutcheon

IPC: C09J9/02 ,  C09J7/21 ,  C09J7/22

Abstract: A tape includes an electrically conductive adhesive first layer having opposite outermost first and second major surfaces. The first layer includes an electrically conductive porous medium and an adhesive disposed in, and extending through a thickness of, the porous medium to define at the first major surface, first regions of exposed adhesive and first regions of exposed porous medium and to define at the second major surface, second regions of exposed adhesive and second regions of exposed porous medium. The second major surface has a higher fraction of exposed porous medium than the first major surface. The porous medium can be a nonwoven fabric and the regions of exposed porous medium can be regions of exposed fibers.

公开(公告)号：US11744055B2

公开(公告)日：2023-08-29

申请号：US17606697

申请日：2019-05-13

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Bing Huang ,  Su Zhang ,  Xin Zhang ,  Jing Fang ,  Fan Gao

IPC: H05K9/00

CPC classification number: H05K9/0015 ,  H05K9/0084

Abstract: An electrically conductive multilayer film for providing an electrical path between two conductive surfaces includes a plastic backing layer, an electrically conductive layer disposed on a first side of the plastic backing layer, and a recovery layer disposed on an opposite second side of the plastic backing layer. An average thickness of the multilayer film is less than about 100 microns. A hollow gasket can be formed from the multilayer film by winding or bending the multilayer film into a flexible hollow closed loop. When the multilayer film is wound to form a flexible closed loop having an outside diameter of no more than about 7 mm with the conductive layer forming an outside layer of the loop, a resistance of the closed loop across a diameter of the closed loop remains less than about 2Ω when the loop is compressed across the diameter by at least 20%.

公开(公告)号：US20230002646A1

公开(公告)日：2023-01-05

申请号：US17784786

申请日：2020-12-15

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jie Huang ,  Jing Fang ,  Jeffrey W. McCutcheon ,  Su Zhang ,  Dong Yang

IPC: C09J7/38 ,  B32B1/00 ,  B32B7/12 ,  C23C16/04 ,  C23C16/02 ,  C23C16/50 ,  C23C16/56 ,  C09J9/02 ,  C09J7/28 ,  C09J133/08

Abstract: Electrically conductive masking tapes include an electrically conductive backing and an electrically conductive pressure sensitive adhesive layer. The pressure sensitive adhesive contains an acrylate-based copolymeric matrix, a crosslinker, an electrically conductive filler, and at least one antioxidant. The acrylate-based copolymeric matrix is the reaction product of a polymerizable mixture including at least one first alkyl(meth)acrylate monomer with a homopolymer Tg of less than −50° C., and at least one hydroxyl-functional alkyl(meth)acrylate with a homopolymer Tg of less than −10° C. The electrically conductive tape is capable of being laminated to and cleanly removed from a substrate surface, after being subjected to harsh conditions such as plasma vapor deposition conditions.