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    Determining a thickness of individual layers of a plurality of metal layers
    13.
    发明授权
    Determining a thickness of individual layers of a plurality of metal layers 有权

    公开(公告)号：US09791257B1

    公开(公告)日：2017-10-17

    申请号：US14813227

    申请日：2015-07-30

    Applicant: Amazon Technologies, Inc.

    Inventor： Mohammed Aftab Alam ,  Ramez Nachman ,  David Eric Peters ,  John Espinoza Sanchez, Jr.

    IPC: G01B7/06

    CPC classification number: G01B7/06

    Abstract: Techniques are described to determine a thickness of individual layers of a plurality of metal layers that include a first metal layer disposed on a polymer material and a second metal layer disposed on the first layer, such that the first layer is between the polymer material and the second layer. A measurement device may determine a resistance of the plurality of metal layers and calculate (e.g., estimate) a thickness of the individual layers based on the resistance of the individual layers and based on a resistivity of individual metals used in the plurality of metal layers. The measurement device may determine whether the individual thicknesses are within predetermined thickness ranges to determine whether to pass a quality control test.

    Variable plated device enclosure
    15.
    发明授权
    Variable plated device enclosure 有权
    可变电镀设备外壳

    公开(公告)号：US09529389B1

    公开(公告)日：2016-12-27

    申请号：US14496450

    申请日：2014-09-25

    Applicant: Amazon Technologies, Inc.

    Inventor： David Eric Peters ,  Shankar Ganapathysubramanian ,  Mohammed Aftab Alam ,  Vikram Srinivas

    IPC: G06F1/16 ,  B32B38/10

    CPC classification number: G06F1/1637 ,  C25D3/00 ,  C25D7/00 ,  G06F1/1601 ,  G06F1/1626 ,  G06F1/1656 ,  G06F1/1698 ,  G06F1/182 ,  G06F2200/1633

    Abstract: A housing of a computing device, such as a computer, laptop computer, cellular phone, personal digital assistant (PDA), tablet computer, electronic reader or e-reader, or other mobile device constructed using a combination of a metal material and a lightweight core material. The housing includes a front housing component including a display and a rear housing coupled to the front housing component with an internal side of the rear housing facing the front housing. The rear housing component includes a core material and a structural material coupled to the core material at strategic locations. For example, the structural material may be located around a periphery of the rear housing, around connection ports of the electronic device, and diagonally across the external side to provide strength and stiffness to the rear housing.

    Abstract translation: 诸如计算机，膝上型计算机，蜂窝电话，个人数字助理（PDA），平板计算机，电子阅读器或电子阅读器之类的计算设备的壳体或使用金属材料和轻量级 核心材料。 壳体包括前壳体部件，其包括显示器和联接到前壳体部件的后壳体，后壳体的内侧面向前壳体。 后壳体部件包括芯材料和在重要位置处连接到芯材料的结构材料。 例如，结构材料可以位于后壳体的周边周围，围绕电子设备的连接端口并且对角地位于外侧，以向后壳体提供强度和刚度。

    Solid structures for thermal management
    16.
    发明授权
    Solid structures for thermal management 有权
    固体结构用于热管理

    公开(公告)号：US09312200B1

    公开(公告)日：2016-04-12

    申请号：US13801406

    申请日：2013-03-13

    Applicant: Amazon Technologies, Inc.

    Inventor： David Eric Peters ,  Ross Kenneth Thayer ,  John Avery Howard

    IPC: H01L23/373 ,  H05K7/20

    CPC classification number: H01L23/3733 ,  H01L23/3731 ,  H01L23/3736 ,  H01L23/42 ,  H01L2924/0002 ,  H05K7/2039 ,  H01L2924/00

    Abstract: Solid structures for thermal management are provided. In one aspect, the solid structures can comprise a metal-ceramic composite member assembled to be in thermal contact with a heat source. The metal-ceramic composite member can be mechanically coupled to an assembly (e.g., an electronic assembly) containing the heat source, and can provide mechanical stability to such assembly. In another aspect, the solid structures can comprise an oxide member that covers a surface of the metal-ceramic composite member, forming a metal-ceramic-oxide interface at the surface. The thickness of the oxide member combined with the magnitude of its thermal conductivity relative to the thermal conductivity of the metal-ceramic composite member can permit heat transport substantially along a direction substantially parallel to the metal-ceramic-oxide interface, and can reduce heat transfer through such interface.

    Abstract translation: 提供了用于热管理的固体结构。 一方面，固体结构可以包括组装成与热源热接触的金属 - 陶瓷复合构件。 金属 - 陶瓷复合构件可以机械地联接到包含热源的组件（例如，电子组件），并且可以为这种组件提供机械稳定性。 另一方面，固体结构可以包括覆盖金属 - 陶瓷复合构件的表面的氧化物构件，在表面​​形成金属 - 陶瓷 - 氧化物界面。 氧化物构件的厚度与其导热系数相对于金属 - 陶瓷复合构件的热导率的大小相结合可以允许基本上沿着基本上平行于金属 - 陶瓷 - 氧化物界面的方向进行热传递，并且可以减少热传递 通过这样的界面。

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