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    SEALING ELEMENT AND WOUND-TYPE SOLID STATE ELECTROLYTIC CAPACITOR THEREOF
    13.
    发明申请
    SEALING ELEMENT AND WOUND-TYPE SOLID STATE ELECTROLYTIC CAPACITOR THEREOF 有权
    密封元件及其类型固体电解电容器

    公开(公告)号：US20160118196A1

    公开(公告)日：2016-04-28

    申请号：US14594602

    申请日：2015-01-12

    Applicant: APAQ TECHNOLOGY CO., LTD.

    Inventor： CHING-FENG LIN ,  MING-TSUNG CHEN

    IPC: H01G9/10 ,  H01G9/15

    CPC classification number: H01G9/10 ,  H01G9/151

    Abstract: A sealing element of the instant disclosure includes a cover body, an exterior convex portion, and an interior convex portion. The cover body has a first surface, a second surface arranged opposite to the first surface, and a pair of terminal holes formed on the cover body and extending through the first and second surfaces. The exterior convex portion has at least one first abutting surface arranged on the first surface of the cover body and an expansion space formed concavely in the exterior convex portion. The interior convex portion has at least one second abutting surface arranged on the second surface of the cover body. Specifically, the sealing element is configured to prevent the capacitor element from swaying, so that the electrical property of the wound-type solid state electrolytic capacitor with the sealing element can be improved.

    Abstract translation: 本公开的密封元件包括盖体，外凸部和内凸部。 盖主体具有第一表面，与第一表面相对布置的第二表面，以及形成在盖体上并延伸穿过第一表面和第二表面的一对端子孔。 外凸部具有布置在盖主体的第一表面上的至少一个第一邻接表面和在外凸部中凹陷地形成的膨胀空间。 所述内部凸部具有布置在所述盖体的第二表面上的至少一个第二抵接面。 具体地，密封元件被配置为防止电容器元件摇摆，从而可以提高卷绕型固态电解电容器与密封元件的电气性能。

    METHOD FOR FABRICATING SOLID ELECTROLYTIC CAPACITORS
    14.
    发明申请
    METHOD FOR FABRICATING SOLID ELECTROLYTIC CAPACITORS 有权
    制造固体电解电容器的方法

    公开(公告)号：US20150318116A1

    公开(公告)日：2015-11-05

    申请号：US14797610

    申请日：2015-07-13

    Applicant: APAQ TECHNOLOGY CO., LTD.

    Inventor： CHING-FENG LIN ,  MING-TSUNG CHEN

    IPC: H01G9/00 ,  C22C21/00 ,  B22F3/02

    CPC classification number: H01G9/151 ,  B22F3/02 ,  C22C21/00 ,  H01G9/0029 ,  H01G9/0032 ,  H01G9/0036 ,  H01G9/0425 ,  H01G9/045 ,  H01G9/052 ,  H01G9/0525 ,  H01G9/07 ,  H01G9/15 ,  Y10T29/417

    Abstract: The instant disclosure relates to an improved method for the production of solid electrolytic capacitor, comprising the following steps. First, provide an insulating substrate. Next, form a plurality of conducting gels including aluminum powder on the insulating substrate. Thirdly, execute a high-temperature sintering process to metalize the conducting gels to form a plurality of aluminum plates. Next, form a dielectric layer on every aluminum plate. Then form an isolation layer on every dielectric layer to define an anodic region and a cathodic region. Lastly, form a conductive layer on the dielectric layer of every cathodic region, thus defining a solid electrolytic capacitor unit.

    Abstract translation: 本公开涉及一种用于生产固体电解电容器的改进方法，包括以下步骤。 首先，提供绝缘基板。 接下来，在绝缘基板上形成包括铝粉末的多个导电凝胶。 第三，执行高温烧结工艺以使导电凝胶金属化以形成多个铝板。 接下来，在每个铝板上形成电介质层。 然后在每个电介质层上形成隔离层，以限定阳极区域和阴极区域。 最后，在每个阴极区域的电介质层上形成导电层，由此限定了一个固体电解电容器单元。

    METHOD FOR FABRICATING SOLID ELECTROLYTIC CAPACITORS
    15.
    发明申请
    METHOD FOR FABRICATING SOLID ELECTROLYTIC CAPACITORS 有权
    制造固体电解电容器的方法

    公开(公告)号：US20140259580A1

    公开(公告)日：2014-09-18

    申请号：US13803064

    申请日：2013-03-14

    Applicant: APAQ TECHNOLOGY CO., LTD.

    Inventor： CHING-FENG LIN ,  MING-TSUNG CHEN ,  SHU-YU LIN

    IPC: H01G9/00

    CPC classification number: H01G9/151 ,  B22F3/02 ,  C22C21/00 ,  H01G9/0029 ,  H01G9/0032 ,  H01G9/0036 ,  H01G9/0425 ,  H01G9/045 ,  H01G9/052 ,  H01G9/0525 ,  H01G9/07 ,  H01G9/15 ,  Y10T29/417

    Abstract: The instant disclosure relates to an improved method for the production of solid electrolytic capacitor, comprising the following steps. First, provide an insulating substrate. Next, form a plurality of conducting gels including aluminum powder on the insulating substrate. Thirdly, execute a high-temperature sintering process to metalize the conducting gels to form a plurality of aluminum plates. Next, form a dielectric layer on every aluminum plate. Then form an isolation layer on every dielectric layer to define an anodic region and a cathodic region. Lastly, form a conductive layer on the dielectric layer of every cathodic region, thus defining a solid electrolytic capacitor unit.

    Abstract translation: 本公开涉及一种用于生产固体电解电容器的改进方法，包括以下步骤。 首先，提供绝缘基板。 接下来，在绝缘基板上形成包括铝粉末的多个导电凝胶。 第三，执行高温烧结工艺以使导电凝胶金属化以形成多个铝板。 接下来，在每个铝板上形成电介质层。 然后在每个电介质层上形成隔离层，以限定阳极区域和阴极区域。 最后，在每个阴极区域的电介质层上形成导电层，由此限定了一个固体电解电容器单元。

    CAPACITOR ASSEMBLY HAVING A NON-SYMMETRICAL ELECTRODE STRUCTURE AND CAPACITOR SEAT STRUCTURE THEREOF
    16.
    发明申请
    CAPACITOR ASSEMBLY HAVING A NON-SYMMETRICAL ELECTRODE STRUCTURE AND CAPACITOR SEAT STRUCTURE THEREOF 审中-公开

    公开(公告)号：US20180269001A1

    公开(公告)日：2018-09-20

    申请号：US15644994

    申请日：2017-07-10

    Applicant: APAQ TECHNOLOGY CO., LTD.

    Inventor： MING-TSUNG CHEN ,  HSI-DUNG LIN ,  CHING-FENG LIN

    IPC: H01G4/32 ,  H01G4/008 ,  H01G4/232 ,  H01G4/236

    CPC classification number: H01G9/008 ,  H01G9/06 ,  H01G9/151

    Abstract: The present disclosure provides a capacitor assembly having a non-symmetrical electrode structure and a capacitor seat structure thereof. The capacitor assembly includes a capacitor seat structure and a capacitor package structure. The capacitor seat structure includes a capacitor seat, a first electrode layer and a second electrode layer. The capacitor seat has a first through hole, a first groove, a second through hole and a second groove. The capacitor package structure includes a first conductive pin and a second conductive pin. The first conductive pin passes through the first through hole and is disposed inside the first groove to electrically contact the first electrode layer. The second conductive pin passes through the second through hole and is disposed inside the second groove to electrically contact the second electrode layer.

    CAPACITOR UNIT WITH HIGH-ENERGY STORAGE
    18.
    发明申请
    CAPACITOR UNIT WITH HIGH-ENERGY STORAGE 审中-公开
    具有高能量存储的电容器

    公开(公告)号：US20160240327A1

    公开(公告)日：2016-08-18

    申请号：US14753202

    申请日：2015-06-29

    Applicant: APAQ TECHNOLOGY CO., LTD.

    Inventor： CHING-FENG LIN ,  MING-TSUNG CHEN ,  CHI-HAO CHIU ,  CHAI-CHING SUNG

    IPC: H01G11/46 ,  H01G11/56 ,  H01G11/68 ,  H01G11/26

    CPC classification number: H01G11/46 ,  H01G11/28 ,  H01G11/56 ,  H01G11/68 ,  H01G11/70 ,  Y02E60/13

    Abstract: The present invention provides a capacitor unit with high-energy storage which includes an electrolyte, a positive electrode, and a negative electrode. The electrolyte includes an electrically conductive polymer composition. The positive and negative electrodes are arranged in the electrolyte. The positive electrode includes a substrate and a transition metal oxide layer formed on the substrate, resulting in the highest possible capacitance density.

    Abstract translation: 本发明提供一种具有高能量存储的电容器单元，其包括电解质，正极和负极。 电解质包括导电聚合物组合物。 正电极和负极布置在电解质中。 正极包括在基板上形成的基板和过渡金属氧化物层，导致最高的电容密度。

    METHOD OF MANUFACTURING A WINDING-TYPE SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE USING A LEAD FRAME
    19.
    发明申请
    METHOD OF MANUFACTURING A WINDING-TYPE SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE USING A LEAD FRAME 有权
    使用引线框架制造卷绕型固体电解电容器封装结构的方法

    公开(公告)号：US20150364262A1

    公开(公告)日：2015-12-17

    申请号：US14834896

    申请日：2015-08-25

    Applicant: APAQ TECHNOLOGY CO., LTD.

    Inventor： MING-TSUNG CHEN ,  CHING-FENG LIN

    IPC: H01G9/00 ,  H01G9/15

    CPC classification number: H01G9/0029 ,  H01G4/232 ,  H01G9/008 ,  H01G9/012 ,  H01G9/10 ,  H01G9/151 ,  Y10T29/417 ,  Y10T29/42

    Abstract: A winding-type solid electrolytic capacitor package structure includes a winding capacitor unit, a package body and a conductive unit. The winding capacitor has a winding body enclosed by the package body, a positive conductive lead pin having a cutting surface, and a negative conductive lead pin having a grinding surface. The conductive unit includes a positive conductive terminal electrically connected to the positive conductive lead pin and a negative conductive terminal electrically connected to the negative conductive lead pin. The positive conductive terminal has a first embedded portion enclosed by the package body and a first exposed portion exposed outside the package body. The negative conductive terminal has a second embedded portion enclosed by the package body and a second exposed portion exposed outside the package body. The first and the second exposed portions are extended along the outer surface of the package body.

    Abstract translation: 绕组式固体电解电容器封装结构包括绕组电容器单元，封装体和导电单元。 绕组电容器具有由封装体包围的绕组体，具有切割表面的正导电引脚和具有研磨表面的负导电引脚。 导电单元包括电连接到正导电引线引线的正导电端子和电连接到负导电引脚的负导电端子。 正极导电端子具有由封装主体包围的第一嵌入部分和暴露在封装主体外部的第一暴露部分。 负极导电端子具有由封装主体包围的第二嵌入部分和暴露在封装主体外部的第二暴露部分。 第一和第二暴露部分沿包装体的外表面延伸。

    SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE FOR DECREASING EQUIVALENT SERIES RESISTANCE AND METHOD OF MANUFACTURING THE SAME
    20.
    发明申请
    SOLID ELECTROLYTIC CAPACITOR PACKAGE STRUCTURE FOR DECREASING EQUIVALENT SERIES RESISTANCE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    用于降低等效串联电阻的固体电解电容器封装结构及其制造方法

    公开(公告)号：US20140307365A1

    公开(公告)日：2014-10-16

    申请号：US13860602

    申请日：2013-04-11

    Applicant: APAQ TECHNOLOGY CO., LTD.

    Inventor： CHI-HAO CHIU ,  CHING-FENG LIN ,  KUN-HUANG CHANG ,  CHUN-CHIA HUANG

    IPC: H01G9/15 ,  H01G9/00

    CPC classification number: H01G9/15 ,  H01G9/0029 ,  H01G9/012 ,  Y10T29/302

    Abstract: A solid electrolytic capacitor package structure for decreasing equivalent series resistance (ESR), includes a capacitor unit, a package unit and a conductive unit. The capacitor unit includes a plurality of first stacked-type capacitors sequentially stacked on top of one another and electrically connected with each other. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal having a through hole, and the stacked-type capacitors are electrically connected between the first and the second conductive terminals. The bottommost first stacked-type capacitor is positioned on the top surface of the second conductive terminal through conductive paste that has a first conductive portion disposed between the bottommost first stacked-type capacitors and the top surface of the second conductive terminal and a second conductive portion filling in the through groove to connect with the first conductive portion.

    Abstract translation: 用于降低等效串联电阻（ESR）的固体电解电容器封装结构包括电容器单元，封装单元和导电单元。 电容器单元包括依次堆叠在彼此顶部并彼此电连接的多个第一层叠型电容器。 封装单元包括用于封闭电容器单元的封装体。 导电单元包括第一导电端子和具有通孔的第二导电端子，并且层叠型电容器电连接在第一和第二导电端子之间。 最下面的第一叠层型电容器通过导电膏定位在第二导电端子的顶表面上，导电膏具有设置在最底部的第一叠层型电容器和第二导电端子的顶表面之间的第一导电部分和第二导电部分 填充通孔以与第一导电部分连接。

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