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公开(公告)号：US10331040B2
公开(公告)日：2019-06-25
申请号：US15763780
申请日：2016-09-15
Applicant: ASML NETHERLANDS B.V.
Inventor： Edo Maria Hulsebos , Patricius Aloysius Jacobus Tinnemans , Ralph Brinkhof , Pieter Jacob Heres , Jorn Kjeld Lucas , Loek Johannes Petrus Verhees , Ingrid Margaretha Ardina Van Donkelaar , Franciscus Godefridus Casper Bijnen
Abstract: In a method of controlling a lithographic apparatus, historical performance measurements are used to calculate a process model relating to a lithographic process. Current positions of a plurality of alignment marks provided on a current substrate are measured and used to calculate a substrate model relating to a current substrate. Additionally, historical position measurements obtained at the time of processing the prior substrates are used with the historical performance measurements to calculate a model mapping. The model mapping is applied to modify the substrate model. The lithographic apparatus is controlled using the process model and the modified substrate model together. Overlay performance is improved by avoiding over- or under-correction of correlated components of the process model and the substrate model. The model mapping may be a subspace mapping, and dimensionality of the model mapping may be reduced, before it is used.
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公开(公告)号：US11994845B2
公开(公告)日：2024-05-28
申请号：US17367901
申请日：2021-07-06
Applicant: ASML NETHERLANDS B.V.
Inventor： Sarathi Roy , Edo Maria Hulsebos , Roy Werkman , Junru Ruan
IPC: G05B19/418 , G03F7/00 , G05B13/02 , G06N3/044
CPC classification number: G05B19/41875 , G03F7/70508 , G03F7/70525 , G05B13/027 , G05B19/41885 , G06N3/044 , G05B2219/33025 , G05B2219/45028 , G05B2219/45031
Abstract: A method for configuring a semiconductor manufacturing process, the method including: obtaining a first value of a first parameter based on measurements associated with a first operation of a process step in the semiconductor manufacturing process and a first sampling scheme; using a recurrent neural network to determine a predicted value of the first parameter based on the first value; and using the predicted value of the first parameter in configuring a subsequent operation of the process step in the semiconductor manufacturing process.
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公开(公告)号：US11086305B2
公开(公告)日：2021-08-10
申请号：US17174159
申请日：2021-02-11
Applicant: ASML NETHERLANDS B.V.
Inventor： Sarathi Roy , Edo Maria Hulsebos , Roy Werkman , Junru Ruan
IPC: G05B19/418 , G05B13/02 , G03F7/20 , G06N3/04
Abstract: A method for configuring a semiconductor manufacturing process, the method including: obtaining a first value of a first parameter based on measurements associated with a first operation of a process step in the semiconductor manufacturing process and a first sampling scheme; using a recurrent neural network to determine a predicted value of the first parameter based on the first value; and using the predicted value of the first parameter in configuring a subsequent operation of the process step in the semiconductor manufacturing process.
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公开(公告)号：US11079684B2
公开(公告)日：2021-08-03
申请号：US16229009
申请日：2018-12-21
Applicant: ASML NETHERLANDS B.V.
Inventor： Franciscus Godefridus Casper Bijnen , Edo Maria Hulsebos , Henricus Johannes Lambertus Megens , Robert John Socha , Youping Zhang
Abstract: A measurement apparatus and method for determining a substrate grid describing a deformation of a substrate prior to exposure of the substrate in a lithographic apparatus configured to fabricate one or more features on the substrate. Position data for a plurality of first features and/or a plurality of second features on the substrate is obtained. Asymmetry data for at least a feature of the plurality of first features and/or the plurality of second features is obtained. The substrate grid based on the position data and the asymmetry data is determined. The substrate grid and asymmetry data are passed to the lithographic apparatus for controlling at least part of an exposure process to fabricate one or more features on the substrate.
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Patent Agency Ranking
公开(公告)号：US10527958B2
公开(公告)日：2020-01-07
申请号：US16132520
申请日：2018-09-17
Applicant: ASML NETHERLANDS B.V.
Inventor： Patricius Aloysius Jacobus Tinnemans , Edo Maria Hulsebos , Henricus Johannes Lambertus Megens , Sudharshanan Raghunathan , Boris Menchtchikov , Ahmet Koray Erdamar , Loek Johannes Petrus Verhees , Willem Seine Christian Roelofs , Wendy Johanna Martina Van De Ven , Hadi Yagubizade , Hakki Ergün Cekli , Ralph Brinkhof , Tran Thanh Thuy Vu , Maikel Robert Goosen , Maaike Van't Westeinde , Weitian Kou , Manouk Rijpstra , Matthijs Cox , Franciscus Godefridus Casper Bijnen
Abstract: A method for determining one or more optimized values of an operational parameter of a sensor system configured to measure a property of a substrate is disclosed. The method includes: determining a quality parameter for a plurality of substrates; determining measurement parameter values for the plurality of substrates using the sensor system for a plurality of values of the operational parameter; comparing a substrate to substrate variation of the quality parameter and a substrate to substrate variation of a mapping of the measurement parameter values; and determining the one or more optimized values of the operational parameter based on the comparing.
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公开(公告)号：US10527957B2
公开(公告)日：2020-01-07
申请号：US15778517
申请日：2016-10-27
Applicant: ASML NETHERLANDS B.V.
Inventor： Cayetano Sanchez-Fabres Cobaleda , Franciscus Godefridus Casper Bijnen , Edo Maria Hulsebos , Arie Jeffrey Den Boef , Marcel Hendrikus Maria Beems , Piotr Michał Stolarz
Abstract: A lithographic apparatus has a substrate table on which a substrate is positioned, and an alignment sensor used to measure the alignment of the substrate. In an exemplary processing method, the alignment sensor is used to perform one or more edge measurements in a first step. In a second step, one or more edge measurements are performed on the notch of the substrate. The edge measurements are then used to align the substrate in the lithographic apparatus. In a particular example, the substrate is arranged relative to the alignment sensor such that a portion of the edge surface is positioned at the focal length of the lens. When the alignment sensor detects radiation scattered by the edge surface at the focal length of the lens, the presence of the edge of the substrate is detected.
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公开(公告)号：US10139740B2
公开(公告)日：2018-11-27
申请号：US15742028
申请日：2016-07-07
Applicant: ASML NETHERLANDS B.V.
Abstract: A lithographic apparatus is described, the apparatus comprising: an illumination system configured to condition a radiation beam; a support constructed to support a patterning device, the patterning device being capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam; a substrate table constructed to hold a substrate; and a projection system configured to project the patterned radiation beam onto a target portion of the substrate, wherein the apparatus further comprises an alignment system configured to perform, for one or more alignment marks that are present on the substrate: —a plurality of alignment mark position measurements for the alignment mark by applying a respective plurality of different alignment measurement parameters, thereby obtaining a plurality of measured alignment mark positions for the alignment mark; the apparatus further comprising a processing unit, the processing unit being configured to: —determine, for each of the plurality of alignment mark position measurements, a positional deviation as a difference between an expected alignment mark position and a measured alignment mark position, the measured alignment mark position being determined based on the respective alignment mark position measurement; —define a set of functions as possible causes for the positional deviations, the set of functions including a substrate deformation function representing a deformation of the substrate, and at least one mark deformation function representing a deformation of the one or more alignment marks; —generating a matrix equation PD=M*F whereby a vector PD comprising the positional deviations is set equal to a weighted combination, represented by a weight coefficient matrix M, of a vector F comprising the substrate deformation function and the at least one mark deformation function, whereby weight coefficients associated with the at least one mark deformation function vary depending on applied alignment measurement; —determining a value for the weight coefficients of the matrix M; —determining an inverse or pseudo-inverse matrix of the matrix M, thereby obtaining a value for the substrate deformation function as a weighted combination of the positional deviations. —applying the value of the substrate deformation function to perform an alignment of the target portion with the patterned radiation beam.
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公开(公告)号：US09665012B2
公开(公告)日：2017-05-30
申请号：US14431229
申请日：2013-10-08
Applicant: ASML Netherlands B.V.
Inventor： Edo Maria Hulsebos
CPC classification number: G03F7/70483 , G03F7/70516 , G03F7/70775 , G03F7/709
Abstract: A method involving obtaining first calibration vibration data relating to vibrations of the lithographic apparatus from a sensor that is part of the lithographic apparatus and obtaining second calibration vibration data, the second calibration vibration data being a component of first parameter data of the lithographic apparatus. A filter is calculated from the first and second calibration vibration data, the filter being such that when applied to the first calibration vibration data, its output correlates closer with the second calibration vibration data. The filter can then be applied to vibration data obtained using the first sensor to obtain an estimate of a vibration component of the first parameter data during the lithographic process.
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公开(公告)号：US20150241791A1
公开(公告)日：2015-08-27
申请号：US14431229
申请日：2013-10-08
Applicant: ASML NETHERLANDS B.V.
Inventor： Edo Maria Hulsebos
IPC: G03F7/20
CPC classification number: G03F7/70483 , G03F7/70516 , G03F7/70775 , G03F7/709
Abstract: A method involving obtaining first calibration vibration data relating to vibrations of the lithographic apparatus from a sensor that is part of the lithographic apparatus and obtaining second calibration vibration data, the second calibration vibration data being a component of first parameter data of the lithographic apparatus. A filter is calculated from the first and second calibration vibration data, the filter being such that when applied to the first calibration vibration data, its output correlates closer with the second calibration vibration data. The filter can then be applied to vibration data obtained using the first sensor to obtain an estimate of a vibration component of the first parameter data during the lithographic process.
Abstract translation: 一种方法，包括从作为光刻设备的一部分的传感器获得与光刻设备的振动相关的第一校准振动数据，并获得第二校准振动数据，第二校准振动数据是光刻设备的第一参数数据的分量。 根据第一和第二校准振动数据计算滤波器，滤波器使得当应用于第一校准振动数据时，其输出与第二校准振动数据更接近。 然后可以将滤波器应用于使用第一传感器获得的振动数据，以在光刻处理期间获得第一参数数据的振动分量的估计。
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