公开(公告)号：US12032301B2

公开(公告)日：2024-07-09

申请号：US18090873

申请日：2022-12-29

Applicant: ASML NETHERLANDS B.V.

Inventor： Johannes Onvlee ,  Antonius Franciscus Johannes De Groot ,  Wim Symens ,  David Ferdinand Vles

IPC: G03F7/00

CPC classification number: G03F7/70708 ,  G03F7/70691 ,  G03F7/707 ,  G03F7/70733

Abstract: A substrate support for supporting a substrate. The substrate support includes a main body, a clamping device and a dither device. The main body includes a support surface for supporting the substrate. The clamping device is arranged to provide the clamping force to clamp the substrate on the support surface. The dither device is configured to dither the clamping force. The dither device may be configured to dither the clamping force while the substrate is being loaded onto the support surface.

公开(公告)号：US11994848B2

公开(公告)日：2024-05-28

申请号：US17601503

申请日：2020-03-12

Applicant: ASML NETHERLANDS B.V.

Inventor： Johannes Onvlee ,  Arnaud Hubaux

IPC: G05B19/418

CPC classification number: G05B19/41885 ,  G05B2219/32335 ,  G05B2219/45031

Abstract: A method for configuring a semiconductor manufacturing process, the method including: providing an initial prediction model including a plurality of model parameters to one or more remote locations; receiving at least one updated model parameter from the one or more remote locations, the at least one model parameter is updated by training the initial prediction model with local data at the one or more remote locations; determining aggregated model parameters based on the at least one updated model parameter received from the one or more remote locations; and adjusting the initial prediction model based on the aggregated model parameters, the adjusted prediction model being operable to configure the semiconductor manufacturing process.

公开(公告)号：US20230134837A1

公开(公告)日：2023-05-04

申请号：US18090873

申请日：2022-12-29

Applicant: ASML NETHERLANDS B.V.

Inventor： Johannes Onvlee ,  Antonius Franciscus Johannes De Groot ,  Wim Symens ,  David Ferdinand Vles

IPC: G03F7/20

Abstract: A substrate support for supporting a substrate. The substrate support includes a main body, a clamping device and a dither device. The main body includes a support surface for supporting the substrate. The clamping device is arranged to provide the clamping force to clamp the substrate on the support surface. The dither device is configured to dither the clamping force. The dither device may be configured to dither the clamping force while the substrate is being loaded onto the support surface.

公开(公告)号：US11556063B2

公开(公告)日：2023-01-17

申请号：US16092021

申请日：2017-03-21

Applicant: ASML NETHERLANDS B.V.

Inventor： Johannes Onvlee ,  Antonius Franciscus Johannes De Groot ,  Wim Symens ,  David Ferdinand Vles

IPC: G03F7/20

Abstract: A substrate support for supporting a substrate. The substrate support comprises a main body, a clamping device and a dither device. The main body comprises a support surface for supporting the substrate. The clamping device is arranged to provide the clamping force to clamp the substrate on the support surface. The dither device is configured to dither the clamping force. The dither device may be configured to dither the clamping force while the substrate W is being loaded onto the support surface.

公开(公告)号：US09372412B2

公开(公告)日：2016-06-21

申请号：US14839663

申请日：2015-08-28

Applicant: ASML NETHERLANDS B.V.

Inventor： Erwin John Van Zwet ,  Pieter Willem Herman De Jager ,  Johannes Onvlee ,  Erik Christiaan Fritz

IPC: G03B27/32 ,  G03B27/54 ,  G03F7/20

CPC classification number: G03F7/70366 ,  G03F7/70275 ,  G03F7/70391 ,  G03F7/704 ,  G03F7/70491 ,  G03F7/70883

Abstract: A lithographic apparatus having an optical column capable of creating a pattern on a target portion of a substrate is disclosed. The optical column may have a self-emissive contrast device configured to emit a beam, and a projection system configured to project the beam onto the target portion. The apparatus may also have an actuator to move the optical column or a part thereof with respect to the substrate. The apparatus may be constructed to reduce the optical effect of density variation in a medium around the moving part of the optical column on the beam.

公开(公告)号：US09335638B2

公开(公告)日：2016-05-10

申请号：US13973703

申请日：2013-08-22

Applicant: ASML NETHERLANDS B.V.

Inventor： Pieter Willem Herman De Jager ,  Vadim Yevgenyevich Banine ,  Jozef Petrus Henricus Benschop ,  Cheng-Qun Gui ,  Johannes Onvlee ,  Erwin John Van Zwet

IPC: G03B27/52 ,  G03B27/54 ,  G03F7/20

CPC classification number: G03F7/70183 ,  G03F7/70275 ,  G03F7/70291 ,  G03F7/70391 ,  G03F7/704

Abstract: In an embodiment, a lithographic apparatus is disclosed that includes a modulator configured to expose an exposure area of the substrate to a plurality of beams modulated according to a desired pattern and a projection system configured to project the modulated beams onto the substrate. The modulator may be moveable with respect the exposure area and/or the projection system may have an array of lenses to receive the plurality of beams, the array of lenses moveable with respect to the exposure area.

公开(公告)号：US10459354B2

公开(公告)日：2019-10-29

申请号：US15565082

申请日：2016-03-24

Applicant: ASML Netherlands B.V.

Inventor： Kevin Van De Ruit ,  Bart Dinand Paarhuis ,  Jean-Philippe Xavier Van Damme ,  Johannes Onvlee ,  Cornelis Melchior Brouwer

IPC: G01B11/24 ,  G03F7/20 ,  G03F1/62

Abstract: A lithographic apparatus including a support to support a patterning device, a substrate table to hold a substrate, and a projection system to project a radiation beam patterned by the patterning device onto a target portion of the substrate. A transparent layer is provided to protect the pattering device. The apparatus further includes a transparent layer deformation-determining device to determine a deformation profile of the transparent layer, the deformation profile of the transparent layer expressing a deformation of the transparent layer during a scanning movement of the lithographic apparatus, and a compensator device which is configured to control the projection system, the substrate table and/or the support in response to the deformation profile of the transparent layer to compensate for the deformation of the transparent layer during the scanning movement of the apparatus.

公开(公告)号：US10444647B2

公开(公告)日：2019-10-15

申请号：US16307512

申请日：2017-06-01

Applicant: ASML NETHERLANDS B.V.

Inventor： Franciscus Godefridus Casper Bijnen ,  Augustinus Hubert Maria Boshouwers ,  Johannes Onvlee

IPC: G03F9/00 ,  H01L21/68

Abstract: A target structure such as an alignment mark on a semiconductor substrate becomes obscured by an opaque layer so that it cannot be located by an alignment sensor. A position for the mark is determined using an edge position sensor and relative position information that defines the position of the mark relative to one or more edge portions of the substrate is stored prior to formation of the opaque layer. A window can be opened in the opaque layer, based on the determined position. After revealing the target structure, the alignment sensor can, if desired, measure more accurately the position of the target structure, for use in controlling a further lithographic step. The edge position sensor may be a camera having an angle-selective behavior. The edge position sensor may be integrated within the alignment sensor hardware.