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公开(公告)号：US20140054009A1
公开(公告)日：2014-02-27
申请号：US13969602
申请日：2013-08-18
Applicant: ASUSTeK COMPUTER INC.
Inventor： Kuang-Yu CHANG , Ing-Jer CHIOU
IPC: F28F3/00
CPC classification number: F28F3/00 , F28D15/00 , F28D15/0233 , F28F3/046 , H01L23/427 , H01L23/473 , H01L2924/0002 , H01L2924/00
Abstract: A water cooling device includes a cooling plate and a water cooling module. The cooling plate includes a plate and a wording fluid. The plate includes vacuum enclosed space therein. The wording fluid is accommodated in the enclosed space. The water cooling module is connected to the cooling plate.
Abstract translation: 水冷装置包括冷却板和水冷模块。 冷却板包括板和文字液。 该板包括真空封闭空间。 措辞流体容纳在封闭的空间中。 水冷却模块连接到冷却板。
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公开(公告)号：US20220026164A1
公开(公告)日：2022-01-27
申请号：US17381259
申请日：2021-07-21
Applicant: ASUSTeK COMPUTER INC.
Inventor： Hsin-Chen LIN , Ing-Jer CHIOU
Abstract: A heat transfer device is provided. The heat transfer device includes a first heat conduction sheet and a second heat conduction sheet. The first heat conduction sheet includes two first rigid parts and a first bendable part connected between the two first rigid parts. The second heat conduction sheet includes two second rigid parts and a second bendable part connected between the two second rigid parts. The two first rigid parts are thermally coupled to the two second rigid parts, respectively. The first bendable portion includes a nonlinear section.
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公开(公告)号：US20210381523A1
公开(公告)日：2021-12-09
申请号：US17338806
申请日：2021-06-04
Applicant: ASUSTEK COMPUTER INC.
Inventor： Hsin-Chen LIN , Ing-Jer CHIOU
Abstract: A centrifugal fan is provided. The centrifugal fan includes a shaft and a plurality of blades. The blades is disposed on the shaft and surround the shaft, and outer edges of the blades define a circle. The circle includes an outer region adjacent to a boundary of the circle, each of the blades includes a first contour line and a second contour line within the outer region, and the neighboring blades include an air channel therebetween, which expands toward the outer edges of the blades according to an interval expanding ratio.
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公开(公告)号：US20210062820A1
公开(公告)日：2021-03-04
申请号：US17006955
申请日：2020-08-31
Applicant: ASUSTeK COMPUTER INC.
Inventor： Hsin-Chen LIN , Ing-Jer CHIOU
Abstract: A fan module includes a hub, a first body and a second body. The hub is configured to rotate along a central axis. The first body is connected to an outer wall of the hub. The second body is sleeved on the outer wall of the hub. The second body includes a plurality of ribs. The ribs are disposed on an inner wall of the second body and abut against the outer wall of the hub.
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公开(公告)号：US20190250674A1
公开(公告)日：2019-08-15
申请号：US16264878
申请日：2019-02-01
Applicant: ASUSTeK COMPUTER INC.
Inventor： Hsin-Chen LIN , Ing-Jer CHIOU
CPC classification number: G06F1/1681 , F16M13/005 , G06F1/1616 , G06F1/203
Abstract: The disclosure discloses an electronic device. The electronic device includes a first enclosure, a second enclosure, a plurality of components, a rotating shaft assembly, and at least one drive member. The components are disposed on the second enclosure. The rotating shaft assembly is disposed in the second enclosure and is connected to the first enclosure. The drive member is connected to the rotating shaft assembly. When the first enclosure is opened relative to the second enclosure, the rotating shaft assembly drives the drive member to push the components, to enable the components to move away from the rotating shaft assembly.
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Patent Agency Ranking
公开(公告)号：US20190048883A1
公开(公告)日：2019-02-14
申请号：US16051735
申请日：2018-08-01
Applicant: ASUSTeK COMPUTER INC.
Inventor： Hsin-Chen LIN , Ing-Jer CHIOU
IPC: F04D29/044 , F04D29/056 , G06F1/20
Abstract: A pivoting assembly includes a base, a bearing, and a rotating shaft. The bearing is disposed on the base and includes a first ring wall. The rotating shaft is sheathed in the first ring wall and rotatably disposed on the first ring wall. In this way, a larger superficial area is provided to generate an effective oil pressure acting force.
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公开(公告)号：US20140290914A1
公开(公告)日：2014-10-02
申请号：US14222676
申请日：2014-03-23
Applicant: ASUSTeK COMPUTER INC.
Inventor： Ing-Jer CHIOU , Cheng-Yu WANG
IPC: F28D15/04
CPC classification number: F28D15/046 , F28D15/0233 , H01L23/427 , H01L2924/0002 , H01L2924/00
Abstract: A heat pipe structure includes a hollow tube body and a plurality of capillary structures. A first region and a second region are defined in the hollow tube body. The capillary structure is disposed on the first region. A diameter of the second region is larger than a diameter of the first region.
Abstract translation: 热管结构包括中空管体和多个毛细结构。 第一区域和第二区域被限定在中空管体中。 毛细结构设置在第一区域上。 第二区域的直径大于第一区域的直径。
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公开(公告)号：US20140146472A1
公开(公告)日：2014-05-29
申请号：US14072758
申请日：2013-11-05
Applicant: ASUSTEK COMPUTER INC.
Inventor： Chia-Ching NIU , Ing-Jer CHIOU , Cheng-Yu WANG
IPC: H05K7/20
CPC classification number: H05K7/20 , F04D29/40 , F28D15/02 , G06F1/20 , G06F1/203 , H05K7/20145 , H05K7/20445
Abstract: An electronic device includes an upper cover, a lower cover combined with the upper cover, and a heat conducting pillar. An accommodating space is formed by the upper cover and the lower cover. The heat conducting pillar is disposed in the accommodating space and physically connected with the upper cover and the lower cover to balance the temperature of the upper cover and the lower cover.
Abstract translation: 电子装置包括上盖，与上盖结合的下盖和导热支柱。 由上盖和下盖形成容纳空间。 导热柱设置在容纳空间中并与上盖和下盖物理连接，以平衡上盖和下盖的温度。
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公开(公告)号：US20230264261A1
公开(公告)日：2023-08-24
申请号：US17958025
申请日：2022-09-30
Applicant: ASUSTEK COMPUTER INC.
Inventor： Fei Lin YANG , Ing-Jer CHIOU
CPC classification number: B22F9/08 , B22F1/102 , B22F1/105 , B22F1/14 , B22F2302/45 , B22F2301/30 , F28F2013/001
Abstract: A manufacturing method of thermal paste is provided. The manufacturing method includes: providing a base material; heating a metal material to a liquid state, to generate a liquid metal material; sieving the liquid metal material to generate a metal powder material; adding a dispersant to the metal powder material and mixing to generate a mixed powder material; and mixing the mixed powder material and the base material.
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公开(公告)号：US20230167828A1
公开(公告)日：2023-06-01
申请号：US17859797
申请日：2022-07-07
Applicant: ASUSTEK COMPUTER INC.
Inventor： Hsin Chen LIN , Ing-Jer CHIOU
CPC classification number: F04D29/281 , F04D29/441
Abstract: Provided is a centrifugal fan. The centrifugal fan includes an air inlet, a shaft, and a plurality of blades. The blades are arranged around the shaft. Each of the blades includes an air guiding portion on a side of the blade facing the air inlet. The air guiding portion includes a first curve and a second curve. An air inflow channel is formed between the first curve and the second curve of two adjacent air guiding portions respectively. A width of the air inflow channel is expanded in a direction away from the air inlet according to an expanding ratio.
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