CONDUCTIVE STRUCTURE, PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20220336332A1

    公开(公告)日:2022-10-20

    申请号:US17233294

    申请日:2021-04-16

    Abstract: A conductive structure, a package structure and a method for manufacturing the same are provided. The conductive structure includes a main portion, a first electrical contact, a second electrical contact, a first post and a second post. The main portion has a first surface and a second surface opposite to the first surface. The first electrical contact is disposed adjacent to the first surface of the main portion. The second electrical contact is disposed adjacent to the second surface of the main portion and electrically connected to the first electrical contact. The first post is electrically connected to the first electrical contact. The second post is electrically connected to the second electrical contact.

    SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING A SUBSTRATE STRUCTURE

    公开(公告)号:US20220115288A1

    公开(公告)日:2022-04-14

    申请号:US17066407

    申请日:2020-10-08

    Abstract: A substrate structure, a semiconductor package structure including the same and a method for manufacturing the same are provided. The substrate structure includes a first passivation layer, a first circuit layer and a first protection layer. The first passivation layer has a first surface and a second surface opposite to the first surface. The first circuit layer has an outer lateral surface. A first portion of the first circuit layer is disposed in the first passivation layer. The first protection layer is disposed on a second portion of the first circuit layer and exposed from the first surface of the first passivation layer. The outer lateral surface of the first circuit layer is covered by the first passivation layer or the first protection layer.

    SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20210118775A1

    公开(公告)日:2021-04-22

    申请号:US16655178

    申请日:2019-10-16

    Abstract: A leadframe includes a first conductive layer, a plurality of conductive pillars and a first package body. The first conductive layer has a first surface and a second surface opposite to the first surface. The plurality of conductive pillars are disposed on the first surface of the first conductive layer. The first package body is disposed on the first surface of the first conductive layer and covers the conductive pillars. The conductive pillars and the first conductive layer are integratedly formed.

    SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE

    公开(公告)号:US20190006308A1

    公开(公告)日:2019-01-03

    申请号:US15636339

    申请日:2017-06-28

    Abstract: A semiconductor package includes at least one semiconductor element, an encapsulant, a first circuitry, a second circuitry and at least one first stud bump. The encapsulant covers at least a portion of the semiconductor element. The encapsulant has a first surface and a second surface opposite to the first surface. The first circuitry is disposed adjacent to the first surface of the encapsulant. The second circuitry is disposed adjacent to the second surface of the encapsulant. The first stud bump is disposed in the encapsulant, and electrically connects the first circuitry and the second circuitry. The first stud bump contacts the second circuitry directly.

    ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20220115310A1

    公开(公告)日:2022-04-14

    申请号:US17066411

    申请日:2020-10-08

    Abstract: An electronic package and method for manufacturing the same are provided. The electronic package includes a substrate and a wetting layer. The substrate includes a plurality of conductive step structures each including a first portion and a second portion. The first portion has a first bottom surface, a first outer surface and a first inner surface. The second portion has a second bottom surface, a second outer surface and a second inner surface, wherein the second portion partially exposes the first bottom surface. The wetting layer at least covers the second bottom surface, the second outer surface and the second inner surface of the second portion of each of the conductive step structures.

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