-
公开(公告)号：US20240275060A1
公开(公告)日：2024-08-15
申请号：US18108489
申请日：2023-02-10
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Shao-En HSU , Huei-Shyong CHO , Shih-Wen LU
IPC: H01Q13/10
Abstract: The present disclosure provides an electronic device. The electronic device includes a signal transmission structure and a circuit. The signal transmission structure defines a waveguide. The signal transmission structure defines a plurality of first apertures. The circuit is configured to adjust a geometric profile of at least one of the plurality of first apertures to control a frequency of an electromagnetic wave radiated from the first apertures.
-
公开(公告)号：US20230389173A1
公开(公告)日：2023-11-30
申请号：US17827546
申请日：2022-05-27
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Po-An LIN , Huei-Shyong CHO , Shih-Wen LU
CPC classification number: H05K1/024 , H05K1/16 , H05K2201/10098
Abstract: The present disclosure provides an electronic device. The electronic device includes a first insulating layer, a first antenna pattern, a second insulating layer, and a second antenna pattern. The first antenna pattern is configured to operate at a first frequency and at least partially disposed over the first insulating layer. The second insulating layer is disposed over the first insulating layer. The second antenna pattern is configured to operate at a second frequency different from the first frequency and at least partially disposed over the second insulating layer. A dielectric constant of the first insulating layer is different from a dielectric constant of the second insulating layer.
-
公开(公告)号：US20210280968A1
公开(公告)日：2021-09-09
申请号：US17327644
申请日：2021-05-21
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Shao-En HSU , Huei-Shyong CHO , Shih-Wen LU
Abstract: A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.
-
公开(公告)号：US20250087887A1
公开(公告)日：2025-03-13
申请号：US18244208
申请日：2023-09-08
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Shao-En HSU , Huei-Shyong CHO , Shih-Wen LU
Abstract: An antenna module is provided. The antenna module includes a conductive structure, a first dielectric layer, and a second dielectric layer. The conductive structure defines a first space and a second space over the first space. The first dielectric layer is at least partially within the first space and has a first dielectric constant. The second dielectric layer is at least partially within the second space and has a second dielectric constant different from the first dielectric constant.
-
公开(公告)号：US20240357751A1
公开(公告)日：2024-10-24
申请号：US18137938
申请日：2023-04-21
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Hsin-Yu CHEN , Huei-Shyong CHO , Shih-Wen LU
CPC classification number: H05K5/0021 , H05K1/162 , H05K1/165 , H05K3/36 , H05K5/0247
Abstract: An electronic device is disclosed. The electronic device includes a first circuit structure, a second circuit structure having a surface facing the first circuit structure, and a first electronic component disposed over the first circuit structure and supporting the second circuit structure. The electronic device also includes a second electronic component disposed adjacent to the second circuit structure and having a top surface at an elevation higher than the surface of the second circuit structure with respect to the first circuit structure.
-
Patent Agency Ranking
公开(公告)号：US20230361060A1
公开(公告)日：2023-11-09
申请号：US18223525
申请日：2023-07-18
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Cheng-Nan LIN , Wei-Tung CHANG , Jen-Chieh KAO , Huei-Shyong CHO
CPC classification number: H01L23/66 , H01L23/3128 , H01L23/49833 , H01L23/49822 , H01L23/49838 , H01L21/4853 , H01L21/4857 , H01Q1/2283 , H01L24/16 , H01Q1/243
Abstract: An electronic device package includes a first substrate, a second substrate and a conductive layer. The first substrate includes a first bonding pad, and a cavity exposing the first bonding pad. The second substrate is laminated on the first substrate. The second substrate includes a second bonding pad at least partially inserting into the cavity of the first substrate. The conductive layer is disposed in the cavity and at least between the first bonding pad and the second bonding pad to connect the first bonding pad and the second bonding pad.
-
公开(公告)号：US20230327333A1
公开(公告)日：2023-10-12
申请号：US18206580
申请日：2023-06-06
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Shao-En HSU , Huei-Shyong CHO , Shih-Wen LU
CPC classification number: H01Q1/523 , H01Q1/243 , H01Q5/378 , H01Q1/2283 , H01Q21/061 , H01Q1/48
Abstract: A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.
-
公开(公告)号：US20210305181A1
公开(公告)日：2021-09-30
申请号：US17347220
申请日：2021-06-14
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Cheng-Nan LIN , Wei-Tung CHANG , Jen-Chieh KAO , Huei-Shyong CHO
Abstract: An electronic device package includes a first substrate, a second substrate and a conductive layer. The first substrate includes a first bonding pad, and a cavity exposing the first bonding pad. The second substrate is laminated on the first substrate. The second substrate includes a second bonding pad at least partially inserting into the cavity of the first substrate. The conductive layer is disposed in the cavity and at least between the first bonding pad and the second bonding pad to connect the first bonding pad and the second bonding pad.
-
公开(公告)号：US20200279815A1
公开(公告)日：2020-09-03
申请号：US16289072
申请日：2019-02-28
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Wen Hung HUANG , Yan Wen CHUNG , Huei-Shyong CHO
IPC: H01L23/00 , H01L23/498 , H01L23/552 , H01L21/48 , H01L21/66 , H01L21/683 , H01L23/66
Abstract: A wiring structure includes a conductive structure, a surface structure and at least one through via. The conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The surface structure is disposed adjacent to a top surface of the conductive structure. The through via extends through the surface structure and extending into at least a portion of the conductive structure.
-
公开(公告)号：US20200153081A1
公开(公告)日：2020-05-14
申请号：US16730411
申请日：2019-12-30
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Shao-En HSU , Huei-Shyong CHO , Shih-Wen LU
IPC: H01Q1/22 , H01L23/367 , H01L23/498 , H01Q1/02 , H01Q1/24 , H01Q21/06 , H01L23/66
Abstract: A semiconductor package device includes a substrate having an upper surface; an antenna disposed on the upper surface of the substrate; a conductor disposed on the upper surface of the substrate and surrounding the antenna; and a package body covering the conductor and the upper surface of the substrate.
-
-
-
-
-
-
-
-
-
Search Results
21
records
(took 0.031 seconds)
