公开(公告)号：US20210125974A1

公开(公告)日：2021-04-29

申请号：US16664652

申请日：2019-10-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsung-Yueh TSAI ,  Meng-Jen WANG ,  Yu-Fang TSAI ,  Meng-Jung CHUANG

IPC: H01L25/16 ,  H01L23/31 ,  H01L23/538 ,  H01L21/48 ,  H01L21/52

Abstract: An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.

公开(公告)号：US20210005761A1

公开(公告)日：2021-01-07

申请号：US16503318

申请日：2019-07-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Pin TSAI ,  Tsung-Yueh TSAI ,  Teck-Chong LEE

IPC: H01L31/02 ,  H01L25/16 ,  H01L31/0203

Abstract: An optical device includes a first circuit layer, a light detector, a first conductive pillar and an encapsulant. The first circuit layer has an interconnection layer and a dielectric layer. The light detector is disposed on the first circuit layer. The light detector has a light detecting area facing away from the first circuit layer and a backside surface facing the first circuit layer. The first conductive pillar is disposed on the first circuit layer and spaced apart from the light detector. The first conductive pillar is electrically connected to the interconnection layer of the first circuit layer. The encapsulant is disposed on the first circuit layer and covers the light detector and the first conductive pillar. The light detector is electrically connected to the interconnection layer of the first circuit layer through the first conductive pillar. The backside surface of the light detector is exposed from the encapsulant.

公开(公告)号：US20180108602A1

公开(公告)日：2018-04-19

申请号：US15655724

申请日：2017-07-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jung-Liang YEH ,  Meng-Jen WANG ,  Tsung-Yueh TSAI ,  Chih-Ming HUNG

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49816 ,  G06K9/00013 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L24/97 ,  H01L25/18 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/83855 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/15321 ,  H01L2924/15322 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A surface mount structure comprises a redistribution structure, an electrical connection and an encapsulant. The redistribution structure has a first surface and a second surface opposite the first surface. The electrical connection is on the first surface of the redistribution structure. The encapsulant encapsulates the first surface of the redistribution structure and the electrical connection. A portion of the electrical connection is exposed by the encapsulant.