公开(公告)号：US20250159793A1

公开(公告)日：2025-05-15

申请号：US18510535

申请日：2023-11-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Meng-Jen WANG ,  Chien-Yuan TSENG ,  Zhong Kai CHANG ,  Shao-Chang LEE ,  Shih-Wei TIEN ,  Jyun-Jhih YANG ,  You-Chi WANG ,  Dian-Yong LI ,  Yi Min LIN ,  Jung-Liang YEH

IPC: H05K1/02

Abstract: The present disclosure provides an electronic device. The electronic device includes a substrate, an electronic component, a circuit structure, and a shielding layer. The electronic component is disposed under the substrate. The circuit structure is disposed under the substrate. The shielding layer is disposed under the substrate and covers the electronic component and connected to the circuit structure. The circuit structure and the shielding layer are collectively configured to block the electronic component from electromagnetic interference.

公开(公告)号：US20180108602A1

公开(公告)日：2018-04-19

申请号：US15655724

申请日：2017-07-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jung-Liang YEH ,  Meng-Jen WANG ,  Tsung-Yueh TSAI ,  Chih-Ming HUNG

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49816 ,  G06K9/00013 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L24/97 ,  H01L25/18 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2224/83855 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/15321 ,  H01L2924/15322 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A surface mount structure comprises a redistribution structure, an electrical connection and an encapsulant. The redistribution structure has a first surface and a second surface opposite the first surface. The electrical connection is on the first surface of the redistribution structure. The encapsulant encapsulates the first surface of the redistribution structure and the electrical connection. A portion of the electrical connection is exposed by the encapsulant.