公开(公告)号：US20090244859A1

公开(公告)日：2009-10-01

申请号：US12345069

申请日：2008-12-29

申请人： Kiyomi MURO ,  Sadahiro Tamai

发明人： Kiyomi MURO ,  Sadahiro Tamai

IPC分类号： H05K1/00

CPC分类号： H05K1/0218 ,  H05K1/0219 ,  H05K1/0237 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4664 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09618

摘要： According to one embodiment, a plurality of bumps are formed by repeatedly applying conductive paste to the conductive pattern portion, a plurality of bump-guiding openings are provided in the cover layer to align with the plurality of bumps, a plurality of crushed portions are formed by crushing heads of the plurality of bumps protruding from the cover layer through the bump-guiding openings, and a ground layer is formed on the cover layer. The ground layer is electrically connected to the plurality of crushed portions.

摘要翻译： 根据一个实施例，通过将导电膏重复地施加到导电图案部分而形成多个凸起，在覆盖层中设置多个凸起引导开口以与多个凸起对准，形成多个压碎部 通过从覆盖层突出的多个凸块的头部通过凸块引导孔破碎，并且在覆盖层上形成接地层。 接地层与多个压碎部电连接。

公开(公告)号：US20080179079A1

公开(公告)日：2008-07-31

申请号：US11923487

申请日：2007-10-24

申请人： Norihiro Ishii ,  Sadahiro Tamai ,  Terunari Kano

发明人： Norihiro Ishii ,  Sadahiro Tamai ,  Terunari Kano

IPC分类号： H05K1/03 ,  H05K3/00

CPC分类号： H05K1/028 ,  H05K3/28 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/09909 ,  Y10T29/49117

摘要： According to one embodiment, there is provided a printed-wiring board in which a composite board is formed to have rigid portions and a bending portion, wherein the bending portion includes linear protrusions each formed with solder resist having a bending resistance property.

摘要翻译： 根据一个实施例，提供了一种印刷电路板，其中复合板形成为具有刚性部分和弯曲部分，其中弯曲部分包括每个形成有具有抗弯曲性能的阻焊剂的线性突起。

公开(公告)号：US20080149382A1

公开(公告)日：2008-06-26

申请号：US11951055

申请日：2007-12-05

申请人： Jun Karasawa ,  Daigo Suzuki ,  Sadahiro Tamai

发明人： Jun Karasawa ,  Daigo Suzuki ,  Sadahiro Tamai

IPC分类号： G01R31/02 ,  H05K1/02

CPC分类号： G01R31/2805 ,  H05K1/0268 ,  H05K1/115 ,  H05K3/4644 ,  H05K3/4679 ,  H05K2201/09509 ,  H05K2203/162

摘要： According to one embodiment, in a method of inspecting a printed wiring board, the printed wiring board which is provided with an outer-layer surface and an inner-layer surface is prepared for inspection. The printed wiring board includes a land provided on the outer-layer surface, a via ranging from the land to the inner-layer surface, and an inner layer pattern provided on the inner-layer surface, wherein the inner layer pattern is electrically connected to the via when a via shift in the printed wiring board is within a tolerance range. A conduction state between the land and the inner layer pattern is detected.

摘要翻译： 根据一个实施例，在检查印刷电路板的方法中，准备设置有外层表面和内层表面的印刷电路板用于检查。 印刷电路板包括设置在外层表面上的焊盘，从焊盘到内层表面的通孔以及设置在内层表面上的内层图案，其中内层图案电连接到 当印刷电路板中的通孔偏移在公差范围内时的通孔。 检测陆地和内层图案之间的导通状态。