公开(公告)号：US07663271B2

公开(公告)日：2010-02-16

申请号：US11047987

申请日：2005-02-02

申请人： Shinichiro Akieda ,  Akio Nakamura

发明人： Shinichiro Akieda ,  Akio Nakamura

IPC分类号： H02K41/03

CPC分类号： H02K41/03 ,  H02K2201/18 ,  Y10T74/20201

摘要： An actuator including magnets arranged on a plane on a plane, coils respectively arranged to face the magnets and move relatively with facing the magnets when a current is applied thereto, a moving member connected to either the magnets or coils, a guide member that guides the moving member to move in a given two-dimensional range; and a hit prevention mechanism to prevent the moving member from hitting a movable limit in the given two-dimensional range. The hit prevention mechanism is provided at the movable limit (edge) in the two-dimensional range. It is thus possible to prevent the moving member from hitting the movable limit. This can prevent damage or any hitting sound. The actuator can be used in a comfortable manner and stably for a long period.

摘要翻译： 一种致动器，包括布置在平面上的磁体，线圈分别布置为面对磁体并且当施加电流时面向磁体相对移动，连接到磁体或线圈的移动构件，将移动构件引导到 在给定的二维范围内移动; 以及防止移动构件在给定的二维范围内击中可移动极限的防撞机构。 在二维范围内的可动极限（边缘）设置防撞机构。 因此可以防止移动构件撞击可动极限。 这可以防止损坏或任何打击声。 致动器可以舒适地使用并且可以长时间稳定地使用。

公开(公告)号：US20060022536A1

公开(公告)日：2006-02-02

申请号：US11191135

申请日：2005-07-28

申请人： Noboru Fujii ,  Shinichiro Akieda ,  Junichi Akama ,  Akio Nakamura

发明人： Noboru Fujii ,  Shinichiro Akieda ,  Junichi Akama ,  Akio Nakamura

IPC分类号： H02K7/06 ,  H02K7/10

CPC分类号： H04R7/045

摘要： A tactile panel includes a vibration panel, a yoke provided to face the vibration panel, drive coils secured on a circumference of the vibration panel, and a set of permanent magnets arranged between the vibration panel and the yoke. The vibration panel is held by panel holding members, into which both sides of the vibration panel are inserted in a direction substantially perpendicular to a vibration direction of the vibration panel.

摘要翻译： 触觉面板包括振动面板，设置成面对振动面板的磁轭，固定在振动面板的圆周上的驱动线圈和布置在振动面板与磁轭之间的一组永磁体。 振动面板由面板保持构件保持，振动面板的两侧沿与振动面板的振动方向大致垂直的方向插入其中。

公开(公告)号：US07416805B2

公开(公告)日：2008-08-26

申请号：US10677353

申请日：2003-10-03

申请人： Akio Nakamura ,  Takashi Arita

发明人： Akio Nakamura ,  Takashi Arita

IPC分类号： H01M2/00 ,  H01M2/14 ,  H01M8/00

CPC分类号： H01M8/2475 ,  H01M8/248

摘要： A fuel cell device is disclosed that is capable of being made compact when being transported and in storage. The fuel cell device includes a fuel cell unit including a number of fuel cells arranged sequentially in a case. The case includes a holder frame for holding the fuel cells, a first hemi-case, and a second hemi-case. The width of the case is adjustable in the direction in which the fuel cells are arranged in a line. When the fuel cell device is being transported or in storage, the first hemi-case and the second hemi-case are pushed to approach each other, making the size of the case small. When the fuel cell device is used to generate electrical power, the first hemi-case and the second hemi-case are pulled apart from each other and, accordingly, the fuel cells are separated from each other by a springy plate.

摘要翻译： 公开了一种燃料电池装置，其能够在运输和存储时被制造得紧凑。 燃料电池装置包括燃料电池单元，该燃料电池单元包括在壳体中顺次布置的多个燃料电池。 壳体包括用于保持燃料电池的保持架，第一半壳体和第二半壳体。 壳体的宽度可以在燃料电池排列成一行的方向上调节。 当燃料电池装置被运输或储存时，第一半箱和第二半壳被推动以彼此靠近，使得壳体的尺寸小。 当燃料电池装置用于产生电力时，第一半壳体和第二半壳体彼此分离，因此燃料电池通过弹性板彼此分离。

公开(公告)号：US08841572B2

公开(公告)日：2014-09-23

申请号：US13541889

申请日：2012-07-05

申请人： Daiei Iwamoto ,  Takashi Yuba ,  Koichi Kiryu ,  SeungSeok Beak ,  Akio Nakamura

发明人： Daiei Iwamoto ,  Takashi Yuba ,  Koichi Kiryu ,  SeungSeok Beak ,  Akio Nakamura

IPC分类号： H01H33/16 ,  H01H9/44 ,  H01H1/26 ,  H01H15/10 ,  H01H15/24 ,  H01H13/52

CPC分类号： H01H1/26 ,  H01H9/443 ,  H01H13/52 ,  H01H15/102 ,  H01H15/24

摘要： A switch device includes first and second contacting portions including first and second fixed contacting portions and first and second movable contacting portions configured to contact the first and second fixed contacting portions, respectively and provided to be adjacent from each other; and a magnet unit provided such that a first pole is positioned to face the first contacting portion and a second pole is positioned to face the second contacting portion to generate magnetic fields between the first fixed contacting portion and the first movable contacting portion and between the second fixed contacting portion and the second movable contacting portion, respectively.

摘要翻译： 开关装置包括第一和第二接触部分，第一和第二接触部分包括第一和第二固定接触部分，第一和第二可动接触部分分别被配置成接触第一和第二固定接触部分并被设置为彼此相邻; 以及设置成使得第一极定位成面对第一接触部分并且第二极被定位成面对第二接触部分以在第一固定接触部分和第一可动接触部分之间以及在第二接触部分之间产生磁场的磁体单元 固定接触部分和第二可动接触部分。

公开(公告)号：US20130037401A1

公开(公告)日：2013-02-14

申请号：US13541826

申请日：2012-07-05

申请人： Takashi Yuba ,  Daiei Iwamoto ,  SeungSeok Beak ,  Koichi Kiryu ,  Akio Nakamura

发明人： Takashi Yuba ,  Daiei Iwamoto ,  SeungSeok Beak ,  Koichi Kiryu ,  Akio Nakamura

IPC分类号： H01R13/70 ,  H01H33/20

CPC分类号： H01H13/52 ,  H01H1/24 ,  H01H9/44 ,  H01H9/46 ,  H01H15/102 ,  H01H15/24

摘要： A switch device includes first and second contacting portions including first and second fixed contacting portions and first and second movable contacting portions, respectively, the first fixed contacting portion and the second fixed contacting portion being configured to be electrically connected to one of a power source and an electronic device while the first movable contacting portion and the second movable contacting portion are configured to be electrically connected to the other of the power source and the electronic device; a first electric arc runner provided near at least one of the first fixed contacting portion and the first movable contacting portion; and a second electric arc runner provided near at least one of the second fixed contacting portion and the second movable contacting portion.

摘要翻译： 开关装置包括分别包括第一和第二固定接触部分以及第一和第二可动接触部分的第一和第二接触部分，第一固定接触部分和第二固定接触部分被构造成电连接到电源和 电子设备，同时第一可动接触部分和第二可动接触部分被配置为电连接到电源和电子设备中的另一个; 设置在第一固定接触部分和第一可动接触部分中的至少一个附近的第一电弧流道; 以及设置在第二固定接触部分和第二可动接触部分中的至少一个附近的第二电弧流道。

公开(公告)号：US07663151B2

公开(公告)日：2010-02-16

申请号：US11587632

申请日：2005-04-13

申请人： Hitoshi Ikeda ,  Kingo Suzuki ,  Akio Nakamura

发明人： Hitoshi Ikeda ,  Kingo Suzuki ,  Akio Nakamura

IPC分类号： H01L33/00

CPC分类号： H01L33/22 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/30

摘要： A light emitting device chip is obtained by dicing a light emitting device wafer having a light emitting layer section 24 based on a double heterostructure in which a first-conductivity-type cladding layer 6, an active layer 5 and an second-conductivity-type cladding layer 4, each of which being composed of a compound semiconductor having a composition allowing lattice matching with GaAs, out of compound semiconductors expressed by formula (AlxGa1-x)yIn1-yP (where, 0≦x≦1, 0≦y≦1), are stacked in this order, and having the (100) surface appeared on the main surface thereof, and GaP transparent semiconductor layers 20, 90 stacked on the light emitting layer section 24 as being agreed with the crystal orientation thereof, so that the {100} surfaces appear on the side faces of the GaP transparent semiconductor layer. Accordingly, there can be provided a method of fabricating a light emitting device having the AlGaInP light emitting layer section and the GaP transparent semiconductor layers, less causative of failures such as edge chipping during the dicing.

摘要翻译： 通过基于双异质结构对具有发光层部分24的发光器件晶片进行切割来获得发光器件芯片，其中第一导电型包覆层6，有源层5和第二导电型包层 （Al x Ga 1-x）y In 1-y P表示的化合物半导体中的每一个由具有允许与GaAs晶格匹配的组成的化合物半导体构成，其中，0≤x≤1,0< y <= 1）按顺序堆叠，并且在其主表面上出现（100）表面，并且与发光层部分24堆叠在一起的GaP透明半导体层20,90与晶体取向一致 ，使得{100}表面出现在GaP透明半导体层的侧面上。 因此，可以提供一种制造具有AlGaInP发光层部分和GaP透明半导体层的发光器件的方法，其不利于在切割期间的边缘切屑等故障。

公开(公告)号：US07595557B2

公开(公告)日：2009-09-29

申请号：US11453827

申请日：2006-06-16

申请人： Kazumi Watase ,  Akio Nakamura ,  Katsumi Ootani

发明人： Kazumi Watase ,  Akio Nakamura ,  Katsumi Ootani

IPC分类号： H01L29/40

CPC分类号： H01L22/14 ,  G01R31/2853 ,  H01L23/3114 ,  H01L23/5228 ,  H01L2924/0002 ,  H01L2924/014 ,  H01L2924/00

摘要： A metal wire for inspection and an electrode for inspection are formed on a region of a semiconductor substrate where a metal wire and an electrode for external connection are not formed. The metal wire for inspection and the electrode for inspection electrically detect an open failure, a short-circuit failure and a leakage failure of the metal wire and a connection failure between an element electrode and the metal wire. A semiconductor wafer is subjected to an electrical test, so that it is possible to detect the aforementioned failures with good accuracy during a manufacturing process.

摘要翻译： 在不形成金属线和外部连接用电极的半导体基板的区域上形成检查用金属线和检查用电极。 用于检查的金属线和用于检查的电极电检测金属线的开路故障，短路故障和漏电故障以及元件电极和金属线之间的连接故障。 对半导体晶片进行电气测试，从而可以在制造过程中以高精度检测上述故障。

公开(公告)号：US07579205B2

公开(公告)日：2009-08-25

申请号：US11587635

申请日：2005-04-13

申请人： Hitoshi Ikeda ,  Kingo Suzuki ,  Akio Nakamura

发明人： Hitoshi Ikeda ,  Kingo Suzuki ,  Akio Nakamura

IPC分类号： H01L21/00

CPC分类号： H01L33/30 ,  H01L24/03 ,  H01L24/05 ,  H01L33/22 ,  H01L2224/48091 ,  Y10S438/964 ,  H01L2924/00014

摘要： A light emitting device wafer having a light emitting layer section 24 having an AlGaInP-base double heterostructure, and a GaP light extraction layer 20 disposed on the light emitting layer section so as to allow a first main surface thereof to compose a first main surface of the wafer is fabricated so that the first main surface of the GaP light extraction layer appears as the (100) surface. The first main surface of the GaP light extraction layer 20 composed of the (100) surface is etched using an etching solution for surface roughening to thereby form surface roughening projections 40f. Accordingly, there can be provided a method of fabricating a light emitting device having the GaP light extraction layer agreed with the (100) main surface, capable of readily subjecting the (100) main surface to surface roughening.

摘要翻译： 一种发光器件晶片，具有具有AlGaInP基双异质结构的发光层部分24和设置在发光层部分上的GaP光提取层20，以便允许其第一主表面组成第一主表面 制造晶片，使得GaP光提取层的第一主表面显示为（100）表面。 使用用于表面粗糙化的蚀刻溶液蚀刻由（100）表面构成的GaP光提取层20的第一主表面，从而形成表面粗糙化突起40f。 因此，可以提供一种制造具有与（100）主表面一致的GaP光提取层的发光器件的方法，能够容易地使（100）主表面粗糙化。

公开(公告)号：US20080179723A1

公开(公告)日：2008-07-31

申请号：US11947169

申请日：2007-11-29

申请人： Akio Nakamura

发明人： Akio Nakamura

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor device includes a die pad section having a surface and a back surface, a first semiconductor chip having a surface on which a first electrode section is formed, and a back surface fixed to the surface of the die pad section, a second semiconductor chip having a surface on which a second electrode section is formed, and a back surface fixed to the surface of the first semiconductor chip, lead terminal sections respectively electrically connected to the first and second electrode sections, and a resin encapsulating body that seals the die pad section and the first and second semiconductor chips. An edge portion of the second semiconductor chip protrudes from an edge portion of the first semiconductor chip. An edge portion of the die pad section protrudes from an edge portion of the first semiconductor chip.

摘要翻译： 半导体器件包括具有表面和背面的芯片焊盘部分，具有形成有第一电极部分的表面的第一半导体芯片和固定到芯片焊盘部分的表面的后表面，第二半导体芯片 具有形成第二电极部分的表面和固定到第一半导体芯片的表面的背面，分别电连接到第一和第二电极部分的引线端子部分和密封芯片焊盘的树脂封装体 以及第一和第二半导体芯片。 第二半导体芯片的边缘部分从第一半导体芯片的边缘部分突出。 芯片焊盘部分的边缘部分从第一半导体芯片的边缘部分突出。

公开(公告)号：US07267007B2

公开(公告)日：2007-09-11

申请号：US11181799

申请日：2005-07-15

申请人： Akio Nakamura

发明人： Akio Nakamura

IPC分类号： G01P15/08

CPC分类号： G01P15/08 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/18 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/16152 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An acceleration sensing device includes a movable sensing member, a frame member and a supporting member. The supporting member is coupled between the movable sensing member and the frame member so as to support the movable sensing member. The acceleration sensing device further includes a covering member disposed above the movable sensing member, with a gap between the covering member and the movable sensing member. The acceleration sensing device still further includes internal electrodes, interconnection films, external electrodes and a resin film. The internal electrodes are arranged around the covering member. The interconnection films are disposed on the frame member so as to be coupled to the internal electrodes. The external electrodes are disposed on the interconnection films. The resin film is disposed on the frame member so as to seal the covering member. Also, there is provided a manufacturing method of the acceleration sensing device.

摘要翻译： 加速度感测装置包括可移动检测构件，框架构件和支撑构件。 支撑构件联接在可移动检测构件和框架构件之间，以支撑可移动检测构件。 加速度感测装置还包括设置在可移动检测构件上方的覆盖构件，在覆盖构件和可移动检测构件之间具有间隙。 加速度检测装置还包括内部电极，互连膜，外部电极和树脂膜。 内部电极围绕覆盖件布置。 互连膜设置在框架构件上，以便连接到内部电极。 外部电极设置在互连膜上。 树脂膜设置在框架构件上，以密封覆盖构件。 另外，提供了加速度检测装置的制造方法。