摘要:
A detachable low profile mounting clip arrangement suitable for use with a portable hand-held electronic apparatus such as a paging receiver, includes a housing having a slot. A base member has a hook attached to one end and a pair of apertures at the other end. The hook engages in the slot of the housing while the apertures spring over a pair of wedge shape protuberancies in the housing and snap into place. A mounting clip or lanyard is attached to the base member.
摘要:
An improved socket assembly is disclosed which is especially suited for use in printed circuitry with dense configuration of components in limited areas of surface. The socket is mounted on an associated printed circuit board and allows horizontal insertion of vertically stacked keyed components, from either side of the socket assembly. The socket assembly further includes a non-metallic insert, consisting of two mating halves containing a plurality of wire contacts of equal geometric diameters, capable of accommodating component leads of differing geometric configurations (i.e., square, rectangular, triangular, round, etc.) which provide pressure to the component lead thereby holding the component in place. The insert is unaffected by the molten solder or flux used during the manufacturing process and prevents entry of contaminating material into the interior of the socket assembly during the soldering process thereby eliminating electrical shorting problems occasionally caused by the soldering process. The insert is surrounded by a U-shaped bracket which acts as a retainer spring on the insert to the socket assembly and is held in place by protrusions extending from the insert which mate with slots in the U-shaped bracket. The socket assembly is inserted into the printed circuit board and is removable from such printed circuit board prior to the soldering process.
摘要:
A method and an apparatus provide a surface mountable package (100) with leads (150) having free end portions (355) coplanar in a target plane (370). The method includes forming the leads (150) such that the free end portions (355) angle away from the target plane (370), and biasing the free end portions (355) against a biasing surface (365) integral to the package (100) such that the free end portions (355) are forced toward the target plane (370) and into a coplanar state. The apparatus includes a housing (110), a plurality of leads (150) with free end portions (355) preformed to angle away from the target plane (370) mounted onto the housing (110), and a biasing surface (365), located on the package (100), to bias the free end portions (355) toward the target plane (370).
摘要:
An intercooled electronic device, includes a thermally conductive chassis (110), a substrate (120) mounted onto the chassis (110), a housing (104) formed around the chassis (110), and a cooling fan (130) mounted internally within the housing (104). The substrate (120) carries electrical circuitry including at least one heat-generating component (122) which is thermally coupled to the chassis (110). The cooling fan (130) is oriented to direct air across the chassis (110).
摘要:
An expandable chassis includes a four sided frame with a central opening to receive a plate or "shield" which is allowed to move within the frame between two predetermined positions. Protuberances on the shield contact the frame and limit its inward movement while outward movement is limited by a spring clip on the shield that snaps into an aperture in the frame. Tabs on the frame support integrally formed spring fingers on the shield which tend to force the shield outward. A membrane switch contact assembly and a speaker are respectively attached to the inside and outside surfaces of the shield. By compressing the shield partially into the frame, the chassis assembly slides into a molded plastic housing. A rubber key actuator pad on the outside of the housing has a plurality of keys each having a protrusion or "actuator" that extends partially into an actuator hole in the housing. When the key is depressed, the actuator depresses and activates one of the switches in the membrane switch contact assembly. A plurality of speaker apertures extend through the housing, the membrane switch contact assembly, and the plate. An acoustic seal is formed between the plate and the housing because the spring fingers force the shield towards the housing until the membrane contacts the housing's inner wall. When the chassis is removed from the housing, testing and repair are facilitated because the keypad switches and speaker remain attached to and electrically connected to the chassis.
摘要:
One specially designed fixture allows two components such as a microprocessor and its associated ROM to be simultaneously mounted on opposite surfaces of the substrate, with all or nearly all internal connections made through the area of the substrate between the components. A second fixture allows for wave soldering lead frames to the assembly while protecting the reflow soldered components. The method thus provides the most direct connections between the two components with all internal connections and external connections made by two automatic operations. A third component can be positioned astraddle the mounted assembly for minimum lead lengths.