公开(公告)号：US11330354B2

公开(公告)日：2022-05-10

申请号：US17071819

申请日：2020-10-15

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Christopher J. Stringer ,  Daniel R. Bloom ,  Michael E. Leclerc ,  David H. Narajowski ,  Kristopher P. Laurent ,  Daniele de Iuliis ,  Markus Diebel ,  Sung-Ho Tan

IPC: H04R1/10 ,  H04R5/033 ,  H04R3/04 ,  H04R5/04

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US20220116697A1

公开(公告)日：2022-04-14

申请号：US17555141

申请日：2021-12-17

Applicant: Apple Inc.

Inventor： Jeffrey J. Terlizzi ,  Kathleen A. Bergeron ,  Ali N. Ergun ,  Dustin A. Hatfield ,  Ethan L. Huwe ,  Todd P. Marco ,  Jason Joseph LeBlanc ,  Robert D. Zupke ,  Michael B. Minerbi ,  Prathamesh R. Bhagwat ,  Daniel R. Bloom

IPC: H04R1/10

Abstract: A personal audio device (e.g., headphones, earphones) can have an earpiece (e.g., an ear cup or earbud) with a removable cushioning member (e.g., headphone cushions or ear tips for earbuds). The cushioning member can include an identification tag that encodes identification data for the cushioning member. When the cushioning member is attached to the earpiece, the identification tag is brought into proximity with a tag sensor in the earpiece and the earpiece can read the identification tag to determine identification data for the cushioning member. The identification data can be used to modify a behavior of the earpiece and/or of a host device communicably coupled to the earpiece.

公开(公告)号：US11184696B1

公开(公告)日：2021-11-23

申请号：US17023240

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Tian Shi Li ,  Daniel R. Bloom ,  Jerzy S. Guterman ,  Jue Wang ,  Toni Ristoski ,  Jared M. Kole ,  Edward Siahaan ,  Eugene Antony Whang

IPC: H04R25/00 ,  H04R1/10 ,  H01Q13/10 ,  H01Q1/24 ,  H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.

公开(公告)号：US20210084402A1

公开(公告)日：2021-03-18

申请号：US17023237

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Jeffrey J. Terlizzi ,  Kathleen A. Bergeron ,  Ali N. Ergun ,  Dustin A. Hatfield ,  Ethan L. Huwe ,  Todd P. Marco ,  Jason Joseph LeBlanc ,  Robert D. Zupke ,  Michael B. Minerbi ,  Prathamesh R. Bhagwat ,  Daniel R. Bloom

IPC: H04R1/10

Abstract: A personal audio device (e.g., headphones, earphones) can have an earpiece (e.g., an ear cup or earbud) with a removable cushioning member (e.g., headphone cushions or ear tips for earbuds). The cushioning member can include an identification tag that encodes identification data for the cushioning member. When the cushioning member is attached to the earpiece, the identification tag is brought into proximity with a tag sensor in the earpiece and the earpiece can read the identification tag to determine identification data for the cushioning member. The identification data can be used to modify a behavior of the earpiece and/or of a host device communicably coupled to the earpiece.

公开(公告)号：US20230328418A1

公开(公告)日：2023-10-12

申请号：US18197672

申请日：2023-05-15

Applicant: APPLE INC.

Inventor： Edward Siahaan ,  Daniel R. Bloom ,  Jason J. LeBlanc ,  Phillip Qian

IPC: H04R1/10 ,  H04R5/033 ,  H04R5/04

CPC classification number: H04R1/1008 ,  H04R1/1066 ,  H04R1/1083 ,  H04R5/0335 ,  H04R1/1033 ,  H04R1/1041 ,  H04R1/105 ,  H04R1/1075 ,  H04R5/04 ,  G10K11/17861

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US11689842B2

公开(公告)日：2023-06-27

申请号：US17555141

申请日：2021-12-17

Applicant: Apple Inc.

Inventor： Jeffrey J. Terlizzi ,  Kathleen A. Bergeron ,  Ali N. Ergun ,  Dustin A. Hatfield ,  Ethan L. Huwe ,  Todd P. Marco ,  Jason Joseph LeBlanc ,  Robert D. Zupke ,  Michael B. Minerbi ,  Prathamesh R. Bhagwat ,  Daniel R. Bloom

IPC: H04R25/00 ,  H04R1/10

CPC classification number: H04R1/1041 ,  H04R1/1016 ,  H04R2420/07 ,  H04R2460/01

Abstract: A personal audio device (e.g., headphones, earphones) can have an earpiece (e.g., an ear cup or earbud) with a removable cushioning member (e.g., headphone cushions or ear tips for earbuds). The cushioning member can include an identification tag that encodes identification data for the cushioning member. When the cushioning member is attached to the earpiece, the identification tag is brought into proximity with a tag sensor in the earpiece and the earpiece can read the identification tag to determine identification data for the cushioning member. The identification data can be used to modify a behavior of the earpiece and/or of a host device communicably coupled to the earpiece.

公开(公告)号：US20220408171A1

公开(公告)日：2022-12-22

申请号：US17894055

申请日：2022-08-23

Applicant: APPLE INC.

Inventor： Dustin A. Hatfield ,  Michael B. Minerbi ,  Eugene Antony Whang ,  Benjamin A. Shaffer ,  Edward Siahaan ,  Daniel R. Bloom

IPC: H04R1/10 ,  H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.

公开(公告)号：US11477558B2

公开(公告)日：2022-10-18

申请号：US17061098

申请日：2020-10-01

Applicant: Apple Inc.

Inventor： Edward Siahaan ,  Daniel R. Bloom ,  Lee M. Panecki ,  Phillip Qian ,  Benjamin A. Shaffer ,  Christopher J. Stringer ,  Eugene A. Whang ,  David H. Narajowski ,  Scott Y. Oshita ,  Dustin A. Hatfield ,  Zachary G. Segraves ,  Sean J. Docherty

IPC: H04R1/10 ,  H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US20220086548A1

公开(公告)日：2022-03-17

申请号：US17023231

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Daniel R. Bloom

IPC: H04R1/10 ,  H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that enhance user comfort and improve user control of the headphones are discussed. Various sensor configurations and electronic component positions are also discussed. User convenience features that include detachable cushions and automatically detecting the donning and doffing of headphones are also discussed.

公开(公告)号：US11277679B1

公开(公告)日：2022-03-15

申请号：US17023246

申请日：2020-09-16

Applicant: Apple Inc.

Inventor： Jarrett B. Lagler ,  Michael B. Minerbi ,  Miikka O. Tikander ,  Lee M. Panecki ,  Trang Fisher ,  Esge Andersen ,  Eugene Whang ,  Ben Shaffer ,  Edward Siahaan ,  Daniel R. Bloom ,  Kitty Yung ,  Tyler A. Green ,  Krithika Elangovan ,  Sarah Gysbers ,  Michael Burello ,  Matthew Zaverl ,  Christopher A. Sandieson ,  Casey L. Baran

IPC: H04R1/10

Abstract: A headphone earcup including a frame defining a cavity dimensioned to surround an ear of a user; a damping component coupled to the frame and encircling the cavity; a wrap component that covers the damping component and defines a continuous acoustic opening around the cavity to acoustically connect the cavity to the damping component; and a cosmetic component that covers the wrap component and the continuous acoustic opening.