VALUE-INDEPENDENT SITUATION IDENTIFICATION AND MATCHING

    公开(公告)号:US20230126028A1

    公开(公告)日:2023-04-27

    申请号:US17511450

    申请日:2021-10-26

    Abstract: A method includes receiving one or more fingerprint dimensions to be used to generate a fingerprint. The method further includes receiving trace data associated with a manufacturing process. The method further includes applying the one or more fingerprint dimensions to the trace data to generate at least one feature. The method further includes generating the fingerprint based on the at least one feature. The method further includes causing, based on the fingerprint, performance of a corrective action associated with one or more manufacturing processes.

    Automatic and adaptive fault detection and classification limits

    公开(公告)号:US11610076B2

    公开(公告)日:2023-03-21

    申请号:US16534828

    申请日:2019-08-07

    Abstract: A method includes receiving, from sensors, current trace data including current sensor values associated with producing products. The method further includes processing the current trace data to identify features of the current trace data and providing the features of the current trace data as input to a trained machine learning model that uses a hyperplane limit for product classification. The method further includes obtaining, from the trained machine learning model, outputs indicative of predictive data associated with the hyperplane limit and processing the predictive data and the hyperplane limit to determine: first products associated with a first product classification and second products associated with a second product classification based exclusively on the subset of the plurality of features; and third products associated with the first product classification or the second product classification based on an additional feature not within the subset.

    INTEGRATED HYBRID PREDICTIVE MONITORING OF MANUFACTURING SYSTEMS

    公开(公告)号:US20240427324A1

    公开(公告)日:2024-12-26

    申请号:US18341650

    申请日:2023-06-26

    Abstract: Implementations relate to techniques of monitoring conditions of tools used in device manufacturing systems. The techniques include storing a failure index (FI) model generated using run-time sensor data that was collected during operations of a tool that occurred prior to a low number of failures of the tool or even before any such failures occur. The FI model includes an FI function of the run-time sensor data and FI threshold value(s) associated with conditions of the tool. The techniques further include collecting new run-time sensor data and applying the FI model to the new run-time sensor data to identify one or more conditions associated with the tool. The techniques further include updating the FI model responsive to one or more tool failures.

    Guardbands in substrate processing systems

    公开(公告)号:US12019507B2

    公开(公告)日:2024-06-25

    申请号:US17748780

    申请日:2022-05-19

    CPC classification number: G06F11/0793 G06F11/0721 G06F11/3495

    Abstract: A method includes identifying trace data including a plurality of data points, the trace data being associated with production, via a substrate processing system, of substrates having property values that meet threshold values. The method further includes generating, based on the trace data and a plurality of allowable types of variance, a guardband including an upper limit and a lower limit for fault detection. The method further includes causing, based on the guardband, performance of a corrective action associated with the substrate processing system.

    GUARDBANDS IN SUBSTRATE PROCESSING SYSTEMS
    17.
    发明公开

    公开(公告)号:US20230376373A1

    公开(公告)日:2023-11-23

    申请号:US17748780

    申请日:2022-05-19

    CPC classification number: G06F11/0793 G06F11/0721 G06F11/3495

    Abstract: A method includes identifying trace data including a plurality of data points, the trace data being associated with production, via a substrate processing system, of substrates having property values that meet threshold values. The method further includes generating, based on the trace data and a plurality of allowable types of variance, a guardband including an upper limit and a lower limit for fault detection. The method further includes causing, based on the guardband, performance of a corrective action associated with the substrate processing system.

    Anomaly detection from aggregate statistics using neural networks

    公开(公告)号:US11657122B2

    公开(公告)日:2023-05-23

    申请号:US16947052

    申请日:2020-07-16

    CPC classification number: G06K9/6298 G06K9/6284 G06K9/6289 G06N3/04

    Abstract: Implementations disclosed describe a method and a system to perform the method of obtaining a reduced representation of a plurality of sensor statistics representative of data collected by a plurality of sensors associated with a device manufacturing system performing a manufacturing operation. The method further includes generating, using a plurality of outlier detection models, a plurality of outlier scores, each of the plurality of outlier scores generated based on the reduced representation of the plurality of sensor statistics using a respective one of the plurality of outlier detection models. The method further includes processing the plurality of outlier scores using a detector neural network to generate an anomaly score indicative of a likelihood of an anomaly associated with the manufacturing operation.

    MATCHING PROCESS CONTROLLERS FOR IMPROVED MATCHING OF PROCESS

    公开(公告)号:US20210116898A1

    公开(公告)日:2021-04-22

    申请号:US17137679

    申请日:2020-12-30

    Abstract: A method includes identifying first parameters of a first processing chamber of a semiconductor fabrication facility. The first parameters include first input parameters and first output parameters. The method further includes identifying second parameters of a second processing chamber of the semiconductor fabrication facility. The second parameters include second input parameters and second output parameters. The method further includes generating, by a processing device based on the first parameters and the second parameters, composite parameters comprising composite input parameters and composite output parameters. Semiconductor fabrication is based on the composite parameters.

    AUTOMATIC AND ADAPTIVE FAULT DETECTION AND CLASSIFICATION LIMITS

    公开(公告)号:US20210042570A1

    公开(公告)日:2021-02-11

    申请号:US16534828

    申请日:2019-08-07

    Abstract: A method includes receiving, from sensors, current trace data including current sensor values associated with producing products. The method further includes processing the current trace data to identify features of the current trace data and providing the features of the current trace data as input to a trained machine learning model that uses a hyperplane limit for product classification. The method further includes obtaining, from the trained machine learning model, outputs indicative of predictive data associated with the hyperplane limit and processing the predictive data and the hyperplane limit to determine: first products associated with a first product classification and second products associated with a second product classification based exclusively on the subset of the plurality of features; and third products associated with the first product classification or the second product classification based on an additional feature not within the subset.

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