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公开(公告)号:US20230058606A1
公开(公告)日:2023-02-23
申请号:US18045119
申请日:2022-10-07
Applicant: APPLIED MATERIALS, INC.
Inventor: Nicholas Michael Bergantz , Jeffrey Hudgens , Doug McAllister , Helder Lee
IPC: H01L21/67 , H01L21/673
Abstract: A system includes a factory interface, a load port connected to the factory interface, a container connected to the load port, and a controller connected to a robot arm of the factory interface. The controller determines that the container is configured to store replacement parts for a process chamber of the system and causes the robot arm to move according to a first mapping pattern to identify, using a detection system at a distal end of an end effector of the robot arm, positions in the container. Regions of the container that do not contain replacement parts are determined and the robot arm is moved according to a second mapping pattern to identify a position in the container of a wafer and/or an empty carrier for a replacement part. A mapping of positions of replacement parts and positions of the wafer and/or empty carrier is recorded in a storage medium.
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公开(公告)号:US11211269B2
公开(公告)日:2021-12-28
申请号:US16923903
申请日:2020-07-08
Applicant: Applied Materials, Inc.
Inventor: Andrew Paul Harbert , Michael C Kuchar , Nicholas Michael Bergantz , Leon Volfovski , Sivakumar Ramalingam , Karuppasamy Muthukamatchi , Douglas R McAllister
IPC: H01L21/67 , H01L21/687 , H01L21/677 , H01L21/673
Abstract: A method includes receiving, by a first loadlock chamber of the loadlock system, a first object from a factory interface via a first opening. The first object is transferred into the first loadlock chamber via a first robot arm. The factory interface is at a first state. The first loadlock chamber is configured to receive different types of objects. The method further includes sealing a first loadlock door against the first opening to create a first sealed environment at the first state in the first loadlock chamber and causing the first sealed environment of the first loadlock chamber to be changed to a second state. The method further includes actuating a second loadlock door to provide a second opening between the first loadlock chamber and a transfer chamber. The first object is to be transferred from the first loadlock chamber to the transfer chamber via a second robot arm.
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公开(公告)号:US20210291374A1
公开(公告)日:2021-09-23
申请号:US16860992
申请日:2020-04-28
Applicant: Applied Materials, Inc.
Inventor: Nicholas Michael Bergantz , Damon K. Cox , Alexander Berger
Abstract: A calibration object is placed at a target orientation in a station of an electronics processing device by a first robot arm, and then retrieved from the station by the first robot arm. The calibration object is transferred to an aligner station using the first robot arm, a second robot arm and/or a load lock, wherein the calibration object has a first orientation at the aligner station. The first orientation at the aligner station is determined. A characteristic error value is determined based on the first orientation. The aligner station is to use the characteristic error value for alignment of objects to be placed in the first station.
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公开(公告)号:US20240429079A1
公开(公告)日:2024-12-26
申请号:US18759704
申请日:2024-06-28
Applicant: Applied Materials, Inc.
Inventor: Aaron Green , Nicholas Michael Bergantz , John C. Menk
IPC: H01L21/673
Abstract: A shelf system includes a first distal portion configured to be fastened to a first surface of an enclosure system. The first distal portion includes a first carrier alignment feature and a first process kit ring alignment feature. The shelf system further includes a second distal portion configured to be fastened to a second surface of the enclosure system. The second distal portion includes a second carrier alignment feature and a second process kit ring alignment feature. The first carrier alignment feature and the second carrier alignment feature are configured to be disposed proximate outer surfaces of a carrier to align the carrier in the enclosure system. The first process kit ring alignment feature and the second process kit ring alignment feature are configured to be proximate inner surfaces of a process kit ring to align the process kit ring on the carrier in the enclosure system.
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公开(公告)号:US11766782B2
公开(公告)日:2023-09-26
申请号:US16861000
申请日:2020-04-28
Applicant: Applied Materials, Inc.
Inventor: Nicholas Michael Bergantz , Damon K. Cox , Alexander Berger
IPC: B25J9/16 , H01L21/67 , H01L21/677 , H01L21/687 , B65G47/90 , H01L21/68 , B25J11/00 , B25J13/08
CPC classification number: B25J9/1692 , B65G47/905 , H01L21/67167 , H01L21/67196 , H01L21/67259 , H01L21/67706 , H01L21/67742 , H01L21/67745 , H01L21/68 , H01L21/68707 , B25J9/1697 , B25J11/0095 , B25J13/08
Abstract: A first robot arm places a calibration object into a load lock that separates a factory interface from a transfer chamber using a first taught position. A second robot arm retrieves the calibration object from the load lock using a second taught position. A controller determines, using a sensor, a first offset amount between a calibration object center of the calibration object and a pocket center of the second robot arm. The controller determines a characteristic error value that represents a misalignment between the first taught position of the first robot arm and the second taught position of the second robot arm based on the first offset amount. The first robot arm or the second robot arm uses the first characteristic error value to compensate for the misalignment for objects transferred between the first robot arm and the second robot arm via the load lock.
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公开(公告)号:USD980176S1
公开(公告)日:2023-03-07
申请号:US29736744
申请日:2020-06-02
Applicant: Applied Materials, Inc.
Designer: Aaron Green , Nicholas Michael Bergantz
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公开(公告)号:US11279032B2
公开(公告)日:2022-03-22
申请号:US16844765
申请日:2020-04-09
Applicant: Applied Materials, Inc.
Inventor: Nicholas Michael Bergantz , Ali Utku Pehlivan
IPC: B25J9/16
Abstract: A method includes positioning a robot in a plurality of postures in a substrate processing system relative to a fixed location in the substrate processing system and generating sensor data identifying a fixed location relative to the robot in the plurality of postures. The method further includes determining, based on the sensor data, a plurality of error values corresponding to one or more components of the substrate processing system and causing, based on the plurality of error values, performance of one or more corrective actions associated with the one or more components of the substrate processing system.
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公开(公告)号:US20210296149A1
公开(公告)日:2021-09-23
申请号:US17206036
申请日:2021-03-18
Applicant: Applied Materials, Inc.
Inventor: Aaron Green , Nicholas Michael Bergantz , John C. Menk
IPC: H01L21/673
Abstract: A set of one or more shelves is configured to be disposed within an enclosure system of a substrate processing system. The set of one or more shelves includes first upper surfaces disposed substantially in a first plane, carrier alignment features configured to align a carrier on the first upper surfaces, second upper surfaces disposed substantially in a second plane that is above the first plane, and process kit ring alignment features configured to align a process kit ring on the carrier above the second upper surfaces.
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公开(公告)号:US20210292104A1
公开(公告)日:2021-09-23
申请号:US17205878
申请日:2021-03-18
Applicant: Applied Materials, Inc.
Inventor: Aaron Green , Nicholas Michael Bergantz , Damon K. Cox , Andreas Schmid
Abstract: A carrier includes a rigid body forming a plurality of openings and a plurality of fasteners configured to removably attach to the rigid body via the plurality of openings. A first set of fingers is configured to be removably attached to the rigid body via the plurality of fasteners and the plurality of openings. The first set of fingers is configured to support first content during first transportation of the carrier within a substrate processing system. A second set of fingers is configured to be removably attached to the rigid body via the plurality of fasteners and the plurality of openings. The second set of fingers is configured to support second content during second transportation of the carrier within the substrate processing system.
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公开(公告)号:US12115683B2
公开(公告)日:2024-10-15
申请号:US18355355
申请日:2023-07-19
Applicant: Applied Materials, Inc.
Inventor: Nicholas Michael Bergantz , Damon K. Cox , Alexander Berger
IPC: B25J9/16 , B65G47/90 , H01L21/67 , H01L21/677 , H01L21/68 , H01L21/687 , B25J11/00 , B25J13/08
CPC classification number: B25J9/1692 , B65G47/905 , H01L21/67167 , H01L21/67196 , H01L21/67259 , H01L21/67706 , H01L21/67742 , H01L21/67745 , H01L21/68 , H01L21/68707 , B25J9/1697 , B25J11/0095 , B25J13/08
Abstract: A first robot arm places a calibration object into a load lock that separates a factory interface from a transfer chamber using a first taught position. A second robot arm retrieves the calibration object from the load lock using a second taught position. A controller determines, using a sensor, a first offset amount between a calibration object center of the calibration object and a pocket center of the second robot arm. The controller determines a characteristic error value that represents a misalignment between the first taught position of the first robot arm and the second taught position of the second robot arm based on the first offset amount. The first robot arm or the second robot arm uses the first characteristic error value to compensate for the misalignment for objects transferred between the first robot arm and the second robot arm via the load lock.
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