APPARATUS AND METHOD TO HARDEN COMPUTER SYSTEM
    12.
    发明申请
    APPARATUS AND METHOD TO HARDEN COMPUTER SYSTEM 有权
    硬件计算机系统的设备和方法

    公开(公告)号:US20120159652A1

    公开(公告)日:2012-06-21

    申请号:US13404628

    申请日:2012-02-24

    Abstract: In some embodiments, a processor-based system may include a processor, the processor having a processor identification, one or more electronic components coupled to the processor, at least one of the electronic components having a component identification, and a hardware security component coupled to the processor and the electronic component. The hardware security component may include a secure non-volatile memory and a controller. The controller may be configured to receive the processor identification from the processor, receive the at least one component identification from the one or more electronic components, and determine if a boot of the processor-based system is a provisioning boot of the processor-based system. If the boot is determined to be the provisioning boot, the controller may be configured to store a security code in the secure non-volatile memory, wherein the security code is based on the processor identification and the at least one component identification. Other embodiments are disclosed and claimed.

    Abstract translation: 在一些实施例中,基于处理器的系统可以包括处理器,处理器具有处理器标识,耦合到处理器的一个或多个电子部件,具有部件识别的电子部件中的至少一个以及耦合到 处理器和电子元件。 硬件安全组件可以包括安全的非易失性存储器和控制器。 控制器可以被配置为从处理器接收处理器标识,从一个或多个电子部件接收至少一个组件标识,并且确定基于处理器的系统的启动是否是基于处理器的系统的供应引导 。 如果确定引导是供应启动,则控制器可以被配置为将安全代码存储在安全非易失性存储器中,其中安全代码基于处理器标识和至少一个组件标识。 公开和要求保护其他实施例。

    METHOD AND SYSTEM OF ADAPTING COMMUNICATION LINKS TO LINK CONDITIONS ON A PLATFORM
    13.
    发明申请
    METHOD AND SYSTEM OF ADAPTING COMMUNICATION LINKS TO LINK CONDITIONS ON A PLATFORM 有权
    将通信链接适应于平台上的链接条件的方法和系统

    公开(公告)号:US20120079160A1

    公开(公告)日:2012-03-29

    申请号:US12890252

    申请日:2010-09-24

    Abstract: A method and system to adapt communication links statically and/or dynamically to their individual link conditions on a platform. The communicatively coupled devices have logic to adapt one or more settings of a respective one or more communication links with another device based at least in part on a respective metric of received data patterns from the respective one or more communication links. The communicatively coupled devices in the platform have a back channel to allow feedback or information to be sent from one receiving device to a transmitting device in one embodiment of the invention.

    Abstract translation: 一种方法和系统,用于使通信链路在平台上静态和/或动态地适应其各自的链路状态。 所述通信耦合设备具有至少部分地基于来自相应的一个或多个通信链路的接收数据模式的相应度量而将相应的一个或多个通信链路的一个或多个通信链路的一个或多个设置适配到另一设备的逻辑。 在本发明的一个实施例中,平台中的通信耦合设备具有反向信道以允许从一个接收设备向发送设备发送反馈或信息。

    Body contact structures and methods of manufacturing the same
    14.
    发明授权
    Body contact structures and methods of manufacturing the same 有权
    身体接触结构及其制造方法

    公开(公告)号:US08053325B1

    公开(公告)日:2011-11-08

    申请号:US12782320

    申请日:2010-05-18

    CPC classification number: H01L29/78615 H01L29/66772

    Abstract: A body contact structure which reduce parasitic capacitance and improves body resistance of a device and methods of manufacture. The method includes forming a gate insulator material and gate electrode material on a substrate. The method further includes patterning the gate insulator material and the gate electrode material to form a gate structure having a shape with a first portion isolated from a second portion. The method further includes forming source and drain regions on sides of the first portion and a body contact at a side and under an area of the second portion, and forming an interlevel dielectric within a space that isolates the first portion from the second portion of the gate structure, and over the gate structure, source and drain regions and the body contact.

    Abstract translation: 减少寄生电容并改善器件的体电阻和制造方法的体接触结构。 该方法包括在基板上形成栅极绝缘体材料和栅电极材料。 该方法还包括图案化栅极绝缘体材料和栅电极材料以形成具有与第二部分隔离的第一部分的形状的栅极结构。 该方法还包括在第一部分的侧面上形成源极和漏极区域,在第二部分的侧面和下面区域形成体接触,以及在隔离第一部分与第二部分的第二部分的空间内形成层间电介质 栅极结构,以及栅极结构,源极和漏极区域以及身体接触。

    STRUCTURE AND METHOD FOR MANUFACTURING ASYMMETRIC DEVICES
    15.
    发明申请
    STRUCTURE AND METHOD FOR MANUFACTURING ASYMMETRIC DEVICES 有权
    用于制造不对称装置的结构和方法

    公开(公告)号:US20110254059A1

    公开(公告)日:2011-10-20

    申请号:US13167303

    申请日:2011-06-23

    Abstract: A plurality of gate structures are formed on a substrate. Each of the gate structures includes a first gate electrode and source and drain regions. The first gate electrode is removed from each of the gate structures. A first photoresist is applied to block gate structures having source regions in a source-down direction. A first halo implantation is performed in gate structures having source regions in a source-up direction at a first angle. The first photoresist is removed. A second photoresist is applied to block gate structures having source regions in a source-up direction. A second halo implantation is performed in gate structures having source regions in a source-down direction at a second angle. The second photoresist is removed. Replacement gate electrodes are formed in each of the gate structures.

    Abstract translation: 在基板上形成多个栅极结构。 每个栅极结构包括第一栅极电极和源极和漏极区域。 从每个栅极结构去除第一栅电极。 施加第一光致抗蚀剂以在源向下方向上阻挡具有源极区的栅极结构。 在栅极结构中进行第一光晕注入,其栅源结构的源极区域在源极方向上以第一角度。 去除第一光致抗蚀剂。 施加第二光致抗蚀剂以阻挡在源向上方向上具有源极区的栅极结构。 在栅极结构中进行第二光晕注入,其栅源结构的源极区域以源向下方向为第二角度。 去除第二光致抗蚀剂。 在每个栅极结构中形成替代栅电极。

    PROCESSOR EXTENSIONS FOR EXECUTION OF SECURE EMBEDDED CONTAINERS
    18.
    发明申请
    PROCESSOR EXTENSIONS FOR EXECUTION OF SECURE EMBEDDED CONTAINERS 有权
    处理器扩展用于执行安全嵌入式集装箱

    公开(公告)号:US20100169968A1

    公开(公告)日:2010-07-01

    申请号:US12347890

    申请日:2008-12-31

    Abstract: Methods and apparatus relating to processor extensions for execution of secure embedded containers are described. In an embodiment, a scalable solution for manageability function is provided, e.g., for UMPC environments or otherwise where utilizing a dedicated processor or microcontroller for manageability is inappropriate or impractical. For example, in an embodiment, an OS (Operating System) or VMM (Virtual Machine Manager) Independent (generally referred to herein as “OI”) architecture involves creating one or more containers on a processor by dynamically partitioning resources (such as processor cycles, memory, devices) between the HOST OS/VMM and the OI container. Other embodiments are also described and claimed.

    Abstract translation: 描述与用于执行安全嵌入式容器的处理器扩展有关的方法和装置。 在一个实施例中,提供了用于可管理性功能的可扩展解决方案,例如对于UMPC环境,或者其他利用专用处理器或微控制器进行可管理性是不合适或不切实际的。 例如,在一个实施例中,OS(操作系统)或VMM(虚拟机管理器)独立(本文通常称为“OI”)架构涉及通过动态地划分资源(例如处理器周期)来在处理器上创建一个或多个容器 ,内存,设备)在HOST OS / VMM和OI容器之间。 还描述和要求保护其他实施例。

    Apparatus and method to harden computer system

    公开(公告)号:US20100083365A1

    公开(公告)日:2010-04-01

    申请号:US12587825

    申请日:2009-10-14

    CPC classification number: G06F21/575

    Abstract: In some embodiments, a processor-based system may include a processor, the processor having a processor identification, one or more electronic components coupled to the processor, at least one of the electronic components having a component identification, and a hardware security component coupled to the processor and the electronic component. The hardware security component may include a secure non-volatile memory and a controller. The controller may be configured to receive the processor identification from the processor, receive the at least one component identification from the one or more electronic components, and determine if a boot of the processor-based system is a provisioning boot of the processor-based system. If the boot is determined to be the provisioning boot, the controller may be configured to store a security code in the secure non-volatile memory, wherein the security code is based on the processor identification and the at least one component identification. Other embodiments are disclosed and claimed.

    SOI TRANSISTOR HAVING A CARRIER RECOMBINATION STRUCTURE IN A BODY
    20.
    发明申请
    SOI TRANSISTOR HAVING A CARRIER RECOMBINATION STRUCTURE IN A BODY 失效
    具有体内载体重构结构的SOI晶体管

    公开(公告)号:US20090302386A1

    公开(公告)日:2009-12-10

    申请号:US12133686

    申请日:2008-06-05

    CPC classification number: H01L29/66772 H01L29/78603 H01L29/78612

    Abstract: A top semiconductor layer is formed with two different thicknesses such that a step is formed underneath a body region of a semiconductor-on-insulator (SOI) field effect transistor at the interface between a top semiconductor layer and an underlying buried insulator layer. The interface and the accompanying interfacial defects in the body region provide recombination centers, which increase the recombination rate between the holes and electrons in the body region. Optionally, a spacer portion, comprising a material that functions as recombination centers, is formed on sidewalls of the step to provide an enhanced recombination rate between holes and electrons in the body region, which increases the bipolar breakdown voltage of a SOI field effect transistor.

    Abstract translation: 顶部半导体层形成有两个不同的厚度,使得在顶部半导体层和下面的掩埋绝缘体层之间的界面处在绝缘体上半导体(SOI)场效应晶体管的体区之下形成台阶。 身体区域中的界面和伴随的界面缺陷提供了复合中心,这增加了身体区域中的空穴和电子之间的复合速率。 任选地,包括作为复合中心的材料的间隔物部分形成在台阶的侧壁上,以在体区中的空穴和电子之间提供增强的复合率,这增加了SOI场效应晶体管的双极击穿电压。

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