摘要:
Disclosed are a polyamic acid having repeating units represented by the formula (1): wherein the norbornane skeleton of comprises four components of and their contents satisfy the following: 1%≦2,5-[diexo]≦90%, 1%≦2,5-[exo,endo]≦90%, 1%≦2,6-[diexo]≦90%, 1% ≦2,6-[exo,endo]≦90%, provided that (2,5-[diexo])+(2,5-[exo,endo])+(2,6-[diexo])+(2,6-[exo,endo])=100%, R represents from 4 to 27 carbon atoms, and represents a tetravalent group selected from the group consisting of an aliphatic group, a monocyclic aliphatic group, a condensed polycyclic aliphatic group, a monocyclic aromatic group, a condensed polycyclic aromatic group, and a non-condensed polycyclic aliphatic or aromatic group which is composed of cycloaliphatic or aromatic groups mutually bonded to each other either directly or via a crosslinking member; and a polyimide which is obtained by imidizing the polyamic acid and which has good properties intrinsic to polyimides, or that is, thermal resistance, mechanical properties, slidability, low water absorption, electric properties and radiation resistance intrinsic thereto. By varying the composition ratio of the starting diamine isomers, various polyimides having controlled thermal resistance, melt flowability, optical properties, chemical resistance and electric properties and capable of forming films of various forms can be obtained.
摘要:
This invention relates to a novel thermoplastic and amorphous polyimide which is readily soluble in organic solvent, a novel aromatic diamino compound used for the polyimide, a preparation process thereof, a polyimide-based resin composition comprising the thermoplastic polyimide and a fibrous reinforcement, a process for preparing the resin composition, an injection molded article of the resin composition, a polyimide-based composite obtained by molding the above soluble and thermoplastic polyimide in combination with a fibrous reinforcement, and a fibrous reinforcement having a surface modified with the above polyimide.The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula: ##STR1## wherein m and n are individually an integer of 0 or 1, and R is ##STR2## The polyimide of the invention is essentially amorphous, excellent in melt flow stability in the decreased temperature as compared with conventionally known polyimide and has greatly improved processability.The polyimide of the invention obtained by using a novel aromatic diamino compound as a monomer can control various properties such as melt flow ability and solubility in solvents by side chains and not by principal chain of polyimide. Thus, excellent melt flow property and solubility in solvents can be obtained while maintaining high heat resistance and adhesive property which are derived from benzophenone structure of the diamino compound of the the invention.
摘要:
The purpose of the present invention is to provide a polyimide resin which exhibits higher heat resistance than that of a conventional polyimide resin by controlling the geometric configuration of the constituent units. Provided is a polyamic acid which comprises repeating units represented by general formula (1), wherein the 1,4-bismethylenecyclohexane skeleton units consist of both trans- and cis-form units, and the contents of the trans- and cis-form units are 60 to 100% and 0 to 40% respectively (with the sum total of the trans- and cis-form units being 100%).
摘要:
A polyamic acid solution includes a polyamic acid, a solvent (C) in which the polyamic acid (PAA1) is dissolved, and a substance (M) that can release at least one metal selected from groups 1 and 2 of the periodic table as a metal ion, or a substance (m) that contains the substance (M). A polyimide composite is produced from the polyamic acid solution. The polyimide composite can provide a greatly improved glass transition temperature without impairing the intrinsic physical properties of the polyimide.
摘要:
A fatigue-resistant polyimide resin composition comprising 100 parts by weight of polyimide having from 0.5 (exclusive) to 1.0 (inclusive) mole ratio of recurring structural units represented by the formula (1) and from 0 (inclusive) to 0.5 (exclusive) mole ratio of recurring structural units represented by the formula (2): ##STR1## wherein X is ##STR2## in the formulas (1) and (2), and having an inherent viscosity of 0.45 dl/g or more; and 5.about.65 parts by weight of a carbon fiber, glass fiber, aromatic polyamide fiber and/or potassium titanate fiber, and an injection molded article having a high fatigue resistance.
摘要:
A polyamic acid solution according to the present invention includes a polyamic acid, a solvent (C) in which the polyamic acid (PAA1) is dissolved, and a substance (M) that can release at least one metal selected from groups 1 and 2 of the periodic table as a metal ion, or a substance (m) that contains the substance (M). A polyimide composite according to the present invention is produced from the polyamic acid solution.The present invention provides a polyimide composite having a greatly improved glass transition temperature without impairing the intrinsic physical properties of the polyimide.
摘要:
This invention relates to a novel fluorine-containing polyimide or polyimide copolymer being colorless and having transparency and very low dielectric characteristics, and has a novel aromatic diamino compound used for the polyimide, a preparation process thereof, a polyimide-based resin composition comprising the polyimide or polyimide copolymer and a fibrous reinforcement, a process for preparing the resin composition, an injection molded article of the resin composition.The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula: ##STR1## wherein Ar is a tetravalent radical having 6 to 27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed polyaromatic radical having aromatic radicals connected to each other with a direct bond or a bridge member, a trifluoromethyl radical is situated at the 3- or the 4-position on a pyridine nucleus, and an imide nitrogen atom is connected at the 3- or the 4-position to an ether bond.The polyimide or polyimide copolymer has excellent heat resistance, outstanding melt-flow stability and greatly improved processability, and also is colorless and has high transparency and very low dielectric coefficient, and can be expected to be used as raw materials for electric.cndot.electronic appliances and optical instruments due to the above characteristics.
摘要:
The purpose of the present invention is to provide a polyimide resin which exhibits higher heat resistance than that of a conventional polyimide resin by controlling the geometric configuration of the constituent units. Provided is a polyamic acid which comprises repeating units represented by general formula (1), wherein the 1,4-bismethylenecyclohexane skeleton units consist of both trans- and cis-form units, and the contents of the trans- and cis-form units are 60 to 100% and 0 to 40% respectively (with the sum total of the trans- and cis-form units being 100%).
摘要:
Provided is a metal-resin composite provided with a layer consisting of a heat-resistant resin composition having a low permittivity or a low dielectric loss tangent. The composite can exhibit a low thermal expansion coefficient and a reduced transmission loss of an electric signal. The composite comprises a metal and a resin layer (I). The resin layer (I) is made from a resin composition prepared by blending (A) a heat-resistant resin that exhibits a relative permittivity of 2.3 or more at a frequency of 1 MHz with (B) polyolefin particles having a mean particle diameter of 100 [mu]m or less. The resin composition has both a continuous phase of the heat-resistant resin (A) and a dispersed phase of the polyolefin particles (B), with the relative permittivity of the resin composition being lower than that of the heat-resistant resin (A).
摘要:
A positive photosensitive resin composition containing 100 parts by weight of a polyimide precursor (A) having a constituent unit represented by the formula (1), 15 to 25 parts by weight of a crosslinking agent (B) represented by the formula (2), and 2 to 5 parts by weight of a photosensitizer (C) generating acid upon irradiation of an actinic ray: wherein m is an integer of 1 or greater, and R is an aromatic group or an aliphatic group having a valency of 1 or higher. The positive photosensitive resin composition can be developed by using an aqueous solution of alkali metal carbonate, is capable of forming micropatterns, and has excellent thermal resistance and the like. A method for forming a positive pattern, and uses thereof are also provided.