公开(公告)号：US20230370170A1

公开(公告)日：2023-11-16

申请号：US18354379

申请日：2023-07-18

Applicant: Ayar Labs, Inc.

Inventor： Roy Edward Meade ,  Vladimir Stojanovic ,  Chen Sun ,  Mark Wade ,  Hugo Saleh ,  Charles Wuischpard

IPC: H04B10/80 ,  H04B10/516 ,  G11C5/04 ,  G11C5/06 ,  G11C11/42 ,  G02B6/42 ,  G11C5/14

CPC classification number: H04B10/80 ,  G02B6/4249 ,  G02B6/4274 ,  G11C5/04 ,  G11C5/06 ,  G11C5/141 ,  G11C11/42 ,  H04B10/516

Abstract: A computer memory system includes an electro-optical chip, an electrical fanout chip electrically connected to an electrical interface of the electro-optical chip, and at least one dual in-line memory module (DIMM) slot electrically connected to the electrical fanout chip. A photonic interface of the electro-optical chip is optically connected to an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals into outgoing optical data signals for transmission through the optical link. The optical macro also converts incoming optical data signals from the optical link into incoming electrical data signals and transmits the incoming electrical data signals to the electrical fanout chip. The electrical fanout chip directs bi-directional electrical data communication between the electro-optical chip and a dynamic random access memory (DRAM) DIMM corresponding to the at least one DIMM slot.

公开(公告)号：US20220360336A1

公开(公告)日：2022-11-10

申请号：US17866482

申请日：2022-07-16

Applicant: Ayar Labs, Inc.

Inventor： Chen Sun ,  Roy Edward Meade ,  Mark Wade ,  Alexandra Wright ,  Vladimir Stojanovic ,  Rajeev Ram ,  Milos Popovic ,  Derek Van Orden ,  Michael Davenport

IPC: H04B10/50 ,  H01S5/40 ,  H01S5/026 ,  H04B10/80 ,  H01S5/02325

Abstract: An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.

公开(公告)号：US11249260B2

公开(公告)日：2022-02-15

申请号：US16937428

申请日：2020-07-23

Applicant: Ayar Labs, Inc.

Inventor： Alexandra Wright ,  Mark Wade ,  Chen Sun ,  Vladimir Stojanovic ,  Rajeev Ram ,  Milos Popovic ,  Roy Edward Meade ,  Derek Van Orden

IPC: G02B6/12 ,  G02B6/42 ,  G02B6/293

Abstract: An optical input/output chiplet is disposed on a first package substrate. The optical input/output chiplet includes one or more supply optical ports for receiving continuous wave light. The optical input/output chiplet includes one or more transmit optical ports through which modulated light is transmitted. The optical input/output chiplet includes one or more receive optical ports through which modulated light is received by the optical input/output chiplet. An optical power supply module is disposed on a second package substrate. The second package substrate is separate from the first package substrate. The optical power supply module includes one or more output optical ports through which continuous wave laser light is transmitted. A set of optical fibers optically connect the one or more output optical ports of the optical power supply module to the one or more supply optical ports of the optical input/output chiplet.

公开(公告)号：US20210258078A1

公开(公告)日：2021-08-19

申请号：US17175677

申请日：2021-02-14

Applicant: Ayar Labs, Inc.

Inventor： Roy Edward Meade ,  Vladimir Stojanovic ,  Chen Sun ,  Mark Wade ,  Hugo Saleh ,  Charles Wuischpard

IPC: H04B10/80 ,  H04B10/516

Abstract: A remote memory system includes a substrate of a multi-chip package, an integrated circuit chip connected to the substrate, and an electro-optical chip connected to the substrate. The integrated circuit chip includes a high-bandwidth memory interface. An electrical interface of the electro-optical chip is electrically connected to the high-bandwidth memory interface. A photonic interface of the electro-optical chip is configured to optically connect with an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals received through the electrical interface from the high-bandwidth interface into outgoing optical data signals. The optical macro transmits the outgoing optical data signals through the photonic interface to the optical link. The optical macro also converts incoming optical data signals received through the photonic interface into incoming electrical data signals. The optical macro transmits the incoming electrical data signals through the electrical interface to the high-bandwidth memory interface.

公开(公告)号：US20200169056A1

公开(公告)日：2020-05-28

申请号：US16777003

申请日：2020-01-30

Applicant: Ayar Labs, Inc.

Inventor： Milos Popovic ,  Rajeev Ram ,  Vladimir Stojanovic ,  Chen Sun ,  Mark Taylor Wade ,  Alexandra Carroll Wright

IPC: H01S3/08 ,  H04B10/50 ,  H04J14/02 ,  H04B10/572 ,  H04B10/40 ,  H04B10/25 ,  H01S3/23 ,  H01S3/04 ,  H01S3/00

Abstract: A laser light generator is configured to generate one or more wavelengths of continuous wave laser light. The laser light generator is configured to collectively and simultaneously transmit each of the wavelengths of continuous wave laser light through an optical output of the laser light generator as a laser light supply. An optical fiber is connected to receive the laser light supply from the optical output of the laser light generator. An optical distribution network has an optical input connected to receive the laser light supply from the optical fiber. The optical distribution network is configured to transmit the laser light supply to each of one or more optical transceivers and/or optical sensors. The laser light generator is physically separate from each of the one or more optical transceivers and/or optical sensors.

公开(公告)号：US20200158950A1

公开(公告)日：2020-05-21

申请号：US16688904

申请日：2019-11-19

Applicant: Ayar Labs, Inc.

Inventor： Roy Edward Meade ,  Vladimir Stojanovic ,  Mark Wade

IPC: G02B6/12

Abstract: A photonic fanout die has a planar structure that has a top surface, a bottom surface, and outer side surfaces extending between the top surface and the bottom surface around an outer perimeter of the planar structure. The planar structure includes an opening formed within the outer perimeter. The opening has side surfaces that extend from the top surface to the bottom surface. The photonic fanout die also includes a plurality of optical waveguides formed within the planar structure to extend from a side surface of the opening to an outer side surface of the planar structure. The plurality of optical waveguides is configured such that a spacing between adjacent optical waveguides at the outer side surface of the planar structure is greater than a spacing between adjacent optical waveguides at the side surface of the opening.

公开(公告)号：US10581215B2

公开(公告)日：2020-03-03

申请号：US16195829

申请日：2018-11-19

Applicant: Ayar Labs, Inc.

Inventor： Milos Popovic ,  Rajeev Ram ,  Vladimir Stojanovic ,  Chen Sun ,  Mark Taylor Wade ,  Alexandra Carroll Wright

IPC: H04J14/02 ,  H01S3/08 ,  H04B10/50 ,  H01S3/00 ,  H01S3/04 ,  H01S3/23 ,  H04B10/25 ,  H04B10/40 ,  H04B10/572

Abstract: A laser light generator is configured to generate one or more wavelengths of continuous wave laser light. The laser light generator is configured to collectively and simultaneously transmit each of the wavelengths of continuous wave laser light through an optical output of the laser light generator as a laser light supply. An optical fiber is connected to receive the laser light supply from the optical output of the laser light generator. An optical distribution network has an optical input connected to receive the laser light supply from the optical fiber. The optical distribution network is configured to transmit the laser light supply to each of one or more optical transceivers and/or optical sensors. The laser light generator is physically separate from each of the one or more optical transceivers and/or optical sensors.

公开(公告)号：US20200021385A1

公开(公告)日：2020-01-16

申请号：US16510829

申请日：2019-07-12

Applicant: Ayar Labs, Inc.

Inventor： Vladimir Stojanovic ,  Alexandra Wright ,  Chen Sun ,  Mark Wade ,  Roy Edward Meade

IPC: H04J14/02 ,  H04Q11/00 ,  H04B10/50

Abstract: A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module. The TORminator module coverts the multiple uplink optical data signals to multiple uplink electrical data signals, and transmits the multiple uplink electrical data signals to the rack switch.

公开(公告)号：US20190271819A1

公开(公告)日：2019-09-05

申请号：US16287984

申请日：2019-02-27

Applicant: Ayar Labs, Inc.

Inventor： Roy Edward Meade ,  Vladimir Stojanovic

IPC: G02B6/42 ,  H01L25/16 ,  H01L25/00

Abstract: A plurality of lid structures include at least one lid structure configured to overlie one or more heat sources within a multi-chip-module and at least one lid structure configured to overlie one or more temperature sensitive components within the multi-chip-module. The plurality of lid structures are configured and positioned such that each lid structure is separated from each adjacent lid structure by a corresponding thermal break. A heat spreader assembly is positioned in thermally conductive interface with the plurality of lid structures. The heat spreader assembly is configured to cover an aggregation of the plurality of lid structures. The heat spreader assembly includes a plurality of separately defined heat transfer members respectively configured and positioned to overlie the plurality of lid structures. The heat spreader assembly is configured to limit heat transfer between different heat transfer members within the heat spreader assembly.

公开(公告)号：US20180019139A1

公开(公告)日：2018-01-18

申请号：US15646039

申请日：2017-07-10

Applicant: Ayar Labs, Inc.

Inventor： Chen Sun ,  Roy Edward Meade ,  Mark Wade ,  Alexandra Wright ,  Vladimir Stojanovic

IPC: H01L21/67 ,  G02B6/12 ,  B05D1/00 ,  G02B6/122 ,  H01S5/026 ,  G03F7/16

CPC classification number: H01L21/6715 ,  B05D1/005 ,  G02B6/12004 ,  G02B6/1225 ,  G02B2006/12061 ,  G03F7/162 ,  G03F9/708 ,  G03F9/7084 ,  H01S5/0265

Abstract: A photoresist material is deposited, patterned, and developed on a backside of a wafer to expose specific regions on the backside of chips for etching. These specific regions are etched to form etched regions through the backside of the chips to a specified depth within the chips. The specified depth may correspond to an etch stop material. Etching of the backside of the wafer can also be done along the chip kerf regions to reduce stress during singulation/dicing of individual chips from the wafer. Etching of the backside of the chips can be done with the chips still part of the intact wafer. Or, the wafer having the pattered and developed photoresist on its backside can be singulated/diced before etching through the backside of the individual chips. The etched region(s) formed through the backside of a chip can be used for attachment of optical component(s) to the chip.