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    COMPOSITION FOR COPPER BUMP ELECTRODEPOSITION COMPRISING A LEVELING AGENT
    15.
    发明申请
    COMPOSITION FOR COPPER BUMP ELECTRODEPOSITION COMPRISING A LEVELING AGENT 有权

    公开(公告)号：US20220356592A1

    公开(公告)日：2022-11-10

    申请号：US17754110

    申请日：2020-09-15

    Applicant: BASF SE

    Inventor： Marco ARNOLD ,  Alexander FLUEGEL ,  Charlotte EMNET ,  Nadine ENGELHARDT

    IPC: C25D5/00 ,  C25D5/16 ,  C25D7/12

    Abstract: Disclosed herein is a composition including copper ions and at least one additive including a polyalkyleneimine backbone including N-hydrogen atoms, where (a) the polyalkyleneimine backbone has a mass average molecular weight MW of from 600 g/mol to 100 000 g/mol, (b) the N-hydrogen atoms are each substituted by a polyoxyalkylene group including an oxyethylene and a C3 to C6 oxyalkylene unit, and (c) the average number of oxyalkylene units in the polyoxyalkylene groups is of from more than 10 to less than 30 per N-hydrogen atom in the polyalkyleneimine.

    COMPOSITION FOR TIN OR TIN ALLOY ELECTROPLATING COMPRISING SUPPRESSING AGENT
    16.
    发明申请
    COMPOSITION FOR TIN OR TIN ALLOY ELECTROPLATING COMPRISING SUPPRESSING AGENT 有权

    公开(公告)号：US20210180201A1

    公开(公告)日：2021-06-17

    申请号：US17048770

    申请日：2019-04-11

    Applicant: BASF SE

    Inventor： Alexander FLUEGEL ,  Marco ARNOLD ,  Nadine ENGELHARDT ,  Marcel Patrik KIENLE

    IPC: C25D3/32

    Abstract: The present invention provides an aqueous composition comprising tin ions and at least one compound of formula I wherein X1 is selected from a linear or branched C1-C12 alkanediyl, which may optionally be interrupted by O or S or a C5 to C12 aromatic moiety, R11 is a copolymer of ethylene oxide and a further C3 to C6 alkylene oxide, wherein the content of ethylene oxide is from 5 to 30% by weight, R12 is selected from H, R11, R40, R13, R14, are (a) independently selected from H, R11, R40, or (b) may together form a divalent group X13; X13 is selected from a linear or branched C1-C12 alkanediyl, which may optionally be interrupted by O, S or NR43; R40 is H or a linear or branched C1-C20 alkyl, R43 is selected from H, R11 and a linear or branched C1-C20 alkyl.

    COMPOSITION FOR TIN-SILVER ALLOY ELECTROPLATING COMPRISING A COMPLEXING AGENT
    17.
    发明申请
    COMPOSITION FOR TIN-SILVER ALLOY ELECTROPLATING COMPRISING A COMPLEXING AGENT 有权

    公开(公告)号：US20210025070A1

    公开(公告)日：2021-01-28

    申请号：US17040642

    申请日：2019-03-22

    Applicant: BASF SE

    Inventor： Katharina FRITZSCHE ,  Doris KREMZOW-GRAW ,  Marco ARNOLD ,  Alexander FLUEGEL

    IPC: C25D3/32 ,  C25D3/46

    Abstract: An aqueous composition comprising (a) metal ions comprising tin ions and silver ions and (b) at least one complexing agent of formula (C1) R1—X1—S—X21[D1-X22—]n—S—X3—R2, (C2) R1—X1—S—X31-D2-[X32—S—]nX3—R2, (C3) R3—X1—S—X41-[D3—X42—]nS—X3—R4 wherein X1, X3 are independently selected from a linear or branched C1-C12 alkanediyl, which may be unsubstituted or substituted by OH; X21, X22 are independently selected from X1, which may be further substituted by —X5—COOR12, —X5—SO2—O—R12, a C2 to C6 polyoxyalkylene group of formula —(O—CH2—CHR11)z—OH, or a combination thereof, and —X1—NH—CO—X6—CO—NH—X1—; X31, X32 are independently selected from a chemical bond and X1; X41, X42 are independently selected from X1; X5 is a linear or branched Ci to C10 alkyl; X6 is selected from X1 and a divalent 5 or 6 membered aromatic group; R1, R2 are independently selected from a monovalent 5 or 6 membered aromatic N-heterocyclic group comprising one N atom or two N atoms which are separated by at least one C atom, and its derivatives received by N-alkylation with a C1-C6-alkyl group, which may be substituted by —COOR12 or —SO2—O—R12, and which aromatic N-heterocyclic group may optionally further comprise, under the proviso that X21 is substituted by at least one OH, one S atom; R3, R4 are independently selected from a monovalent 5 or 6 membered aliphatic N-heterocyclic group comprising one N atom and one O atom; D1 is independently selected from S, O and NR10−; D2 is (a) a divalent 5 or 6 membered aliphatic heterocyclic ring system comprising 1 or 2 S atoms, or (b) a 5 or 6 membered aromatic heterocyclic ring system comprising at least two N atoms and optionally one or two S atoms; D3 is independently selected from S and NR10−; n is an integer of from 0 to 5; z is an integer from 1 to 50; R10 is selected from H and a linear or branched C1-C12 alkyl; R11 is selected from H and a linear or branched C1 to C6 alkyl; and R12 is selected from R10 and a cation.

    COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SUBMICRON FEATURE FILLING
    19.
    发明申请
    COMPOSITION FOR COBALT PLATING COMPRISING ADDITIVE FOR VOID-FREE SUBMICRON FEATURE FILLING 审中-公开

    公开(公告)号：US20190226107A1

    公开(公告)日：2019-07-25

    申请号：US16318540

    申请日：2017-07-06

    Applicant: BASF SE

    Inventor： Marcel Patrik KIENLE ,  Dieter MAYER ,  Marco ARNOLD ,  Alexander FLUEGEL ,  Charlotte EMNET

    IPC: C25D3/16 ,  C25D7/12 ,  C25D3/18 ,  H01L21/288 ,  H01L21/768 ,  H01L23/532 ,  H01L23/522

    Abstract: A composition comprising: (a) cobalt ions, and (b) an additive of formula (I) wherein R1 is selected from X-Y; R2 is selected from R1 and R3; X is selected from linear or branched C1 to C10 alkanediyl, linear or branched C2 to C10 alkenediyl, linear or branched C2 to C10 alkynediyl, and (C2H3R6—O)n—H; Y is selected from OR3, NR3R4, N+R3R4R5 and NH—(C═O)—R3; R3, R4, R5 are the same or different and are selected from (i) H, (ii) C5 to C20 aryl, (iii) C1 to C10 alkyl (iv) C6 to C20 arylalkyl, (v) C6 to C20 alkylaryl, which may be substituted by OH, SO3H, COOH or a combination thereof, and (vi) (C2H3R6—O)n—H, and wherein R3 and R4 may together form a ring system, which may be interrupted by O or NR7; m, n are integers independently selected from 1 to 30; R6 is selected from II and C1 to C5 alkyl; R7 is selected from R6 and formula (II).

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