THIN FILM TRANSISTOR ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE
    17.
    发明申请
    THIN FILM TRANSISTOR ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE 审中-公开
    薄膜晶体管阵列基板及其制造方法及显示装置

    公开(公告)号:US20150311223A1

    公开(公告)日:2015-10-29

    申请号:US14406326

    申请日:2014-05-27

    Abstract: A thin film transistor array substrate and a manufacturing method thereof, and a display device comprising the thin film transistor array substrate, including a gate electrode (4) within a gate electrode recess of a first insulating layer (2), so that the gate electrode (4) is surrounded by the first insulating layer (2), the patterned gate electrode (4) has no slope, and the first insulating layer (2) isolates the gate electrode (4) from the outside, which can prevent fracture of the gate insulating layer (5), and further effectively block copper diffusion in the thin film transistor array substrate. Further, the metal blocking layer completely covers an upper surface and/or a lower surface of the composite copper metal or the composite thin film layer including copper metal, which can play a good role in blocking copper diffusion; meanwhile, above all, it is not necessary to etch copper, which reduces cost and improves yield.

    Abstract translation: 一种薄膜晶体管阵列基板及其制造方法,以及包括薄膜晶体管阵列基板的显示装置,其包括在第一绝缘层(2)的栅电极凹部内的栅电极(4),使得栅电极 (4)被第一绝缘层(2)包围,图案化栅电极(4)没有斜坡,第一绝缘层(2)将栅电极(4)与外部隔离,这可以防止 栅极绝缘层(5),并进一步有效地阻挡薄膜晶体管阵列基板中的铜扩散。 此外,金属阻挡层完全覆盖复合铜金属或包含铜金属的复合薄膜层的上表面和/或下表面,其可以在阻止铜扩散方面发挥良好的作用; 同时,最重要的是,不需要蚀刻铜,从而降低成本并提高产量。

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