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公开(公告)号：US20150303162A1
公开(公告)日：2015-10-22
申请号：US14407345
申请日：2014-06-20
发明人： Junping BAO , Wei HE , Xinghua LI , Seung Yik PARK
CPC分类号： H01L24/17 , G02F1/13306 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/056 , H01L2224/13005 , H01L2224/13013 , H01L2224/13014 , H01L2224/13017 , H01L2224/13022 , H01L2224/131 , H01L2224/1355 , H01L2224/1411 , H01L2224/14131 , H01L2224/1605 , H01L2224/16055 , H01L2224/16113 , H01L2224/27334 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/73204 , H01L2224/81191 , H01L2224/83192 , H01L2224/83203 , H01L2224/8385 , H01L2224/83851 , H01L2924/14 , H01L2924/2064 , H01L2924/00014
摘要： Provided are an IC chip and a display apparatus. The IC chip (109) comprises several conductive metal sheets spaced from each other on one side of the IC chip, and conductive bumps (111) are formed on the conductive metal sheets. According to the present disclosure, since conductive bumps (111) are arranged on the conductive metal sheet of the IC chip (109), it is possible to use a non-conductive bonding layer such as NCF instead of ACF to bond the IC chip (109) to the display panel, and thus no metal particles would accumulate. As a result, the problem of short circuit or too large resistance will not occur. In addition, it is possible to reduce the production cost of the display apparatus by using NCF instead of ACF, facilitating industrialized manufacturing.
摘要翻译： 提供了IC芯片和显示装置。 IC芯片（109）包括在IC芯片的一侧彼此间隔开的几个导电金属片，并且在导电金属片上形成导电凸块（111）。 根据本公开，由于在IC芯片（109）的导电性金属板上配置有导电性凸起（111），因此可以使用NCF等非导电性接合层代替ACF来将IC芯片 109）到显示面板，因此不会积聚金属颗粒。 结果，不会发生短路或过大电阻的问题。 此外，通过使用NCF而不是ACF可以降低显示装置的生产成本，从而促进工业化制造。
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公开(公告)号：US20190035813A1
公开(公告)日：2019-01-31
申请号：US16002317
申请日：2018-06-07
发明人： Shihua HUANG , Zhiyong YANG , Chao FU , Wei HE , Jing WANG , Dexiong SONG , Liwei HUANG , Wei LI , Chao MA , Chaofan LI , Fei CHEN
IPC分类号： H01L27/12 , H01L27/32 , G09G3/3291 , G09G3/3258 , H01L51/52
摘要： A display substrate, including: a display region and two non-display regions provided at two opposite sides of the display region, respectively; proximal end wiring and distal end wiring which are provided in the two non-display regions, respectively, wherein the proximal end wiring is wiring proximal to a driving chip to be employed to provide a driving voltage to the display substrate, and the distal end wiring is wiring distal to the driving chip; pixels provided within the display region; and data lines provided within the display region, wherein each data line is connected to the proximal and distal end wirings, respectively. Each of the pixels is provided with a power introduction structure, the power introduction structures of the pixels are connected to each other to form a mesh structure, and the mesh structure is connected to the proximal and distal end wiring, respectively, to form an electrically-conductive path.
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公开(公告)号：US20170148858A1
公开(公告)日：2017-05-25
申请号：US15110565
申请日：2016-01-05
CPC分类号： H01L27/3262 , G02F1/13454 , G02F1/1368 , H01L27/12 , H01L27/1222 , H01L27/124 , H01L27/1251 , H01L27/3276
摘要： The present invention relates to an array substrate and a display device. The array substrate comprises a first thin film transistor arranged on a non-display area of the array substrate and a second thin film transistor arranged on a display area of the array substrate, a part of a first active layer corresponding to a region between a first source and a first drain in the first thin film transistor forms a first trench, and a part of a second active layer corresponding to a region between a second source and a second drain in the second thin film transistor forms a second trench, the first trench has at least one first bent portion, the second trench has a second bent portion, and bending angles of the first bent portion and the second bent portion are the same or explementary angles.
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14.发明申请公开(公告)号：US20190035760A1
公开(公告)日：2019-01-31
申请号：US15994529
申请日：2018-05-31
发明人： Wei LI , Wei HE , Jing WANG , Chao FU , Chaofan LI , Zhiyong YANG , Liwei HUANG
IPC分类号： H01L23/00
摘要： Embodiments of the present disclosure provide an anisotropic conductive film and a forming method thereof, an ACF roll, a bonding structure and a display device. The anisotropic conductive film (ACE) includes: an insulating adhesive layer, including a plurality of preset regions corresponding to electrodes to be bonded and spaced from each other; and capsule structures, dispersed in the insulating adhesive layer of the plurality of preset regions and configured to realize a electrical connection in a direction perpendicular to a surface of the ACF when the ACF is subjected to a pressure in the direction perpendicular to the surface of the ACF, wherein a number of the capsule structures in each of the plurality of preset regions is greater than a preset number.
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公开(公告)号：US20220328578A1
公开(公告)日：2022-10-13
申请号：US17417299
申请日：2020-09-24
发明人： Xiang LI , Wei HE , Haowei ZOU , Shi SHU , Chuanxiang XU , Yong YU , Yang YUE , Haitao HUANG , Qi YAO
摘要： A display substrate, a display panel and a manufacturing method thereof, and a display device are disclosed. The display substrate includes: a first substrate; a pixel defining layer on the first substrate and having pixel openings; and light emitting devices in one-to-one correspondence with the pixel openings. The light emitting device includes a first electrode and a light emitting function layer, the first electrode is between the pixel defining layer and the first substrate, and includes a main body portion exposed by the pixel opening; the light emitting function layer is in the pixel opening and on a side of the main body portion away from the first substrate, at least a part of the light emitting function layer directly faces the main body portion, and the part of the light emitting function layer directly facing the main body portion is a curved film layer protruding towards the first substrate.
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16.发明申请公开(公告)号：US20220069254A1
公开(公告)日：2022-03-03
申请号：US17393661
申请日：2021-08-04
发明人： Jun LIU , Jingang FANG , Yang ZHANG , Tongshang SU , Wei HE , Bin ZHOU , Ning LIU
摘要： A light-emitting substrate includes; a base, an isolation portion disposed on the base and located in an isolation region located outside a light-emitting region, and a second insulating pattern located in the light-emitting region. The isolation portion includes a first conductive pattern, a second conductive pattern and a first insulating pattern that are sequentially stacked on the base; an orthogonal projection of the first conductive pattern on the base is located within an orthogonal projection of the second conductive pattern on the base; and a side face of the first conductive pattern proximate to the light-emitting region and a corresponding side face of the second conductive pattern proximate to the light-emitting region have a first gap therebetween. A side face of the second insulating pattern proximate to the first insulating pattern and a side face of the first insulating pattern proximate to the second insulating pattern have a second gap therebetween.
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公开(公告)号：US20220093723A1
公开(公告)日：2022-03-24
申请号：US17483504
申请日：2021-09-23
发明人： Liangchen YAN , Jun GENG , Tongshang SU , Wei HE , Bin ZHOU
IPC分类号： H01L27/32
摘要： A display backplane, a manufacturing method thereof, and a display device are provided. The display backplane includes a base substrate. A thin film transistor array layer, a protective layer, a planarization layer, and a light-emitting element are arranged on the base substrate. A first through hole is formed in the protective layer, and a second through hole is formed in the planarization layer. The first through hole and the second through hole are connected. A source electrode or a drain electrode is electrically connected to an anode via the first through hole and the second through hole. Each of the first through hole and the second through hole has a sidewall inclined relative to the base substrate.
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公开(公告)号：US20210234137A1
公开(公告)日：2021-07-29
申请号：US16769374
申请日：2019-10-08
发明人： Wei HE , Huili WU , Shipei LI , Dongsheng LI , Fang HE , Renquan GU , Sheng XU , Dongsheng YIN , Wusheng LI , Qi YAO
摘要： The present disclosure relates to a method of fabricating a flexible display panel. The method of fabricating the flexible display panel may include forming a photosensitive layer comprising at least one azo group on a carrier substrate; forming a flexible substrate on the photosensitive layer; irradiating the photosensitive layer with ultraviolet light; and peeling off the flexible substrate from the carrier substrate.
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公开(公告)号：US20210159363A1
公开(公告)日：2021-05-27
申请号：US16824062
申请日：2020-03-19
发明人： Sheng XU , Huili WU , Lizhen ZHANG , Wei HE , Xuefei ZHAO , Shipei LI , Fang HE , Dongsheng YIN , Renquan GU , Wusheng LI , Qi YAO
IPC分类号： H01L33/38 , H01L33/24 , H01L25/075
摘要： A drive backboard, a manufacturing method thereof, a display panel and a display device are provided. The drive backboard includes a plurality of pixel units and a plurality of spare electrode groups. Each pixel unit includes m subpixel units, and m is a positive integer greater than or equal to 2. Each spare electrode group includes two first spare electrodes and one second spare electrode; two adjacent ith subpixel units respectively use one first spare electrode in each spare electrode group and share one second spare electrode in each spare electrode group, where i is a positive integer from 1 to m.
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公开(公告)号：US20210158007A1
公开(公告)日：2021-05-27
申请号：US17041516
申请日：2020-04-08
发明人： Shipei LI , Ying ZHAO , Renquan GU , Wei HE , Huili WU , Dongsheng YIN , Sheng XU , Lizhen ZHANG , Xuefei ZHAO , Fang HE , Yupeng GAO
IPC分类号： G06K9/00 , H01L27/146
摘要： Disclosed are a fingerprint recognition sensor, a manufacturing method, and a display device. The fingerprint recognition sensor includes a base substrate, a thin film transistor, on a side of the base substrate; and a photosensitive element, on a side of the base substrate away from the thin film transistor, the thin film transistor, the base substrate, and the photosensitive element are sequentially stacked in a thickness direction perpendicular to the base substrate, the base substrate includes a conductive structure penetrating through the base substrate in the thickness direction perpendicular to the base substrate, and the photosensitive element is connected with the thin film transistor through the conductive structure.
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