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公开(公告)号：US20220271020A1
公开(公告)日：2022-08-25
申请号：US17350910
申请日：2021-06-17
Inventor： Jie Lei , Zouming Xu , Jian Tian , Chunjian Liu , Xintao Wu , Jie Wang
Abstract: A light emitting substrate, a light emitting motherboard, a method for obtaining a light emitting substrate, and a displaying device. The light emitting substrate comprises a substrate and multiple light emitting units, wherein the substrate is provided with a light emitting region and a bind region located on one side of the light emitting region; each light emitting unit comprises a light zone provided with at least one light emitting diode and a drive circuit provided with multiple pins, and the multiple light emitting units are arranged on the substrate in an array; a direction pointing from the light emitting region to the bind region is a first direction; and in the first direction, the drive circuit of at least one light emitting unit in the last row of the light emitting units is connected to an address line.
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12.发明公开公开(公告)号：US20240322099A1
公开(公告)日：2024-09-26
申请号：US18577470
申请日：2022-06-02
Inventor： Jie Wang , Zhi Jin , Xintao Wu , Zouming Xu , Huan Liu , Leiming Ding , Tingwei Han , Ningyu Luo
IPC: H01L33/62 , H01L25/075 , H01L33/38
CPC classification number: H01L33/62 , H01L25/0753 , H01L33/38 , H01L2933/0066
Abstract: The present disclosure provides a wiring substrate, a manufacturing method thereof, a light-emitting substrate, a display device. The wiring substrate includes a base substrate including a functional region and a bonding region, a first conductive layer at least in the functional region; a second conductive layer that is on the first conductive layer and at least in the functional region and connected to the first conductive layer; a first insulating layer on the second conductive layer and including a main part and an opening. At least one of the first and second conductive layers includes multiple electrodes in the bonding region and extending along a first direction, each electrode includes a first end adjacent to the functional region in the first direction, an orthographic projection of the main part on the base substrate at least partially overlaps with an orthographic projection of the first end on the base substrate.
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公开(公告)号：US12062620B2
公开(公告)日：2024-08-13
申请号：US17611801
申请日：2020-12-08
Inventor： Qin Zeng , Zouming Xu , Chunjian Liu , Jian Tian , Xintao Wu , Jie Lei , Jie Wang , Xiaodong Xie , Min He , Xinxiu Zhang , Xue Zhao , Huayu Sang , Wenjie Xu
IPC: H01L25/16 , H01L23/538 , H01L33/62 , H01L23/00
CPC classification number: H01L23/5386 , H01L25/167 , H01L33/62 , H01L24/05 , H01L24/06 , H01L2224/05552 , H01L2224/0615
Abstract: An array substrate includes connecting leads, a signal channel region extending in a first direction, a first power voltage lead, and a second power voltage lead. Any one of the signal channel region includes at least two control region columns extending in the first direction, and any one of the control region columns includes a plurality of control regions arranged along the first direction. Any one of the control regions includes a pad connecting circuit and a first pad group for bonding a microchip, the first pad group is electrically connected to the first power voltage lead. The pad connection circuit includes a plurality of second pad groups, and is provided with a first end electrically connected to the first pad group, and a second end electrically connected to the second power voltage lead.
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公开(公告)号：US20240258478A1
公开(公告)日：2024-08-01
申请号：US18040505
申请日：2021-10-27
Inventor： Jian Tian , Jie Lei , Zouming Xu , Jie Wang , Jianying Zhang , Chunjian Liu , Jiawei Xu , Tsungchieh Kuo , Xintao Wu
IPC: H01L33/62 , H01L25/075
CPC classification number: H01L33/62 , H01L25/0753 , H01L2933/0066
Abstract: The present disclosure provides a light-emitting substrate, a method for manufacturing the same, and a display device. The light-emitting substrate includes: a substrate including a light-emitting region; a first conductor on the substrate and at least in the light-emitting region, the first conductor extending along a first direction in the light-emitting region; a second conductor on the first conductor and arranged in the light-emitting region, the second conductor including a first connecting portion; and a first insulator within the light-emitting region. The first connecting portion extends along a second direction, an orthographic projection of the first connecting portion on the substrate at least partially overlaps with an orthographic projection of the first conductor on the substrate to constitute an overlapping region. The first insulator is only between the first connecting portion and the first conductor, the overlapping region is within an orthographic projection of the first insulator on the substrate.
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15.发明公开公开(公告)号：US20240243241A1
公开(公告)日：2024-07-18
申请号：US18577518
申请日：2022-06-30
Inventor： Ningyu Luo , Zouming Xu , Xintao Wu , Jie Wang , Jiawei Xu , Tingwei Han
IPC: H01L33/62 , H01L25/075
CPC classification number: H01L33/62 , H01L25/0753 , H01L2933/0066
Abstract: A method of allocating widths for target signal lines, a wiring substrate, a light-emitting substrate and a display device are provided. The method includes numbering the target signal lines; performing the following operations at least once until the number of target signal lines in a set is zero, determining the set of target signal lines; determining a region R based on the conditions satisfied by a voltage drop V, a temperature rise T, and widths W of the target signal lines, determining the number i of the target signal line with the maximum voltage drop in the set; substituting a known length Li of the target signal line numbered i into V (L, W) to obtain V (Li, W) and obtaining Wi based on an intersection of V (Li, W) and a boundary of the region R, and removing the target signal line with the width Wi from the set.
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Patent Agency Ranking
公开(公告)号：US11966552B2
公开(公告)日：2024-04-23
申请号：US18027653
申请日：2022-03-04
Inventor： Jian Tian , Xintao Wu , Zouming Xu , Chunjian Liu , Jie Lei , Shaoyi Zhan , Jie Wang , Jianying Zhang , Jiacheng Ding
CPC classification number: G06F3/0446 , G06F3/0412 , G06F3/04164 , G06F2203/04102 , G06F2203/04103
Abstract: A touch substrate manufacturing method, for manufacturing a target touch substrate to be assembled with a display substrate, is provided. A size of an active display region of the display substrate is a first preset size. The method includes: providing a touch substrate to be processed having a second preset size, the second preset size being greater than the first preset size; and cutting, in at least one cutting direction, the touch substrate to be processed to obtain the target touch substrate, the cutting direction being parallel to an extending direction of a touch channel on the touch substrate to be processed. A manufacturing method for touch module, a touch substrate and a touch module are also provided.
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17.发明公开公开(公告)号：US20230384900A1
公开(公告)日：2023-11-30
申请号：US18027653
申请日：2022-03-04
Inventor： Jian Tian , Xintao Wu , Zouming Xu , Chunjian Liu , Jie Lei , Shaoyi Zhan , Jie Wang , Jianying Zhang , Jiacheng Ding
CPC classification number: G06F3/0446 , G06F3/04164 , G06F3/0412 , G06F2203/04102 , G06F2203/04103
Abstract: A touch substrate manufacturing method, for manufacturing a target touch substrate to be assembled with a display substrate, is provided. A size of an active display region of the display substrate is a first preset size. The method includes: providing a touch substrate to be processed having a second preset size, the second preset size being greater than the first preset size; and cutting, in at least one cutting direction, the touch substrate to be processed to obtain the target touch substrate, the cutting direction being parallel to an extending direction of a touch channel on the touch substrate to be processed. A manufacturing method for touch module, a touch substrate and a touch module are also provided.
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公开(公告)号：US11670222B2
公开(公告)日：2023-06-06
申请号：US17488621
申请日：2021-09-29
Inventor： Qin Zeng , Zouming Xu , Jian Tian , Jie Lei , Jie Wang , Jianying Zhang , Xintao Wu , Chunjian Liu
IPC: G09G3/32
CPC classification number: G09G3/32 , G09G2300/0413 , G09G2330/028
Abstract: The disclosure provides a driving backplate and a display device. The driving backplate includes a substrate having a plurality of light source regions where light sources are disposed, the plurality of light source regions being arranged in an array; and a plurality of control chips arranged in an array on the substrate, the plurality of control chips being in one-to-one correspondence with the plurality of light source regions and each configured to provide a driving signal to the light source in a corresponding light source region, wherein each column of control chips is divided into at least two groups, each group of control chips are coupled in series through a same signal line, and the at least two groups of control chips are coupled in parallel with each other.
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公开(公告)号：US11595615B2
公开(公告)日：2023-02-28
申请号：US16914681
申请日：2020-06-29
Inventor： Kangjian Liu , Jingyuan Yu , Laishou Cai , Jie Wang , Cheng Yang
Abstract: The present disclosure provides a conference device, a method of controlling the conference device, and a computer storage medium. The conference device includes a display, an image sensor, a holographic projector, and a controller configured to identify, by using an image data from the image sensor, a modification action performed at a target location for a holographic image projected by the holographic projector, modify holographic projection data based on the modification action, and convert modified holographic projection data into modified two-dimensional imaging data.
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公开(公告)号：US12087698B2
公开(公告)日：2024-09-10
申请号：US17426815
申请日：2021-01-28
Inventor： Chunjian Liu , Zouming Xu , Feifei Wang , Qin Zeng , Xintao Wu , Jian Tian , Jie Lei , Jie Wang , Yufei Zhan
IPC: H01L23/538 , H01L25/16
CPC classification number: H01L23/5386 , H01L25/167
Abstract: The present disclosure relates to the field of display technology, and provides a wiring substrate, an array substrate, and a light emitting module. The wiring substrate includes a base substrate, a first metal wiring layer, and an insulating material layer stacked in sequence. The first metal wiring layer is provided with a plurality of drive leads extending along a first direction, and the insulating material layer is provided with a plurality of via holes exposing the drive leads. Through adjusting positions of the drive leads and positions of the via holes, the wiring substrate can be applied to different microchips, and used further to prepare different array substrates.
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