公开(公告)号：US20170148884A1

公开(公告)日：2017-05-25

申请号：US15116195

申请日：2016-02-22

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Liangjian Li ,  Yueping Zuo ,  Yinghai Ma ,  Xiaowei Xu

IPC: H01L29/417 ,  H01L27/12 ,  H01L29/66 ,  H01L29/786 ,  H01L23/535 ,  H01L29/423 ,  H01L29/06

CPC classification number: H01L29/41733 ,  H01L23/535 ,  H01L27/1222 ,  H01L27/124 ,  H01L27/1248 ,  H01L27/1288 ,  H01L29/0649 ,  H01L29/42384 ,  H01L29/6675 ,  H01L29/78684

Abstract: The present application discloses a thin film transistor comprising active layer on a base substrate; an insulating layer over fee active layer, the insulating layer comprising a source via and a drain via, each of which extending through the insulating layer; a source electrode within the source via in contact with the active layer; and a drain electrode within the drain via in contact with the active layer.

公开(公告)号：US11315990B2

公开(公告)日：2022-04-26

申请号：US16099530

申请日：2017-12-15

Applicant: BOE Technology Group Co., Ltd.

Inventor： Libin Liu ,  Xiaowei Xu

IPC: H01L27/32 ,  G09G3/3258 ,  G09G3/3266 ,  G09G3/3291

Abstract: The present application discloses a display panel comprising a substrate, a transistor layer on the substrate, and a pixel-defining layer on a side of the transistor layer distal to the substrate to divide the display panel into a plurality of subpixel regions. At least one subpixel region includes a display sub-region and a light-sensitive sub-region. The display panel further includes a plurality of organic light-emitting diodes formed on the transistor layer respectively on the plurality of subpixel regions. Additionally, the display panel includes a plurality of pixel circuits formed in the transistor layer respectively on the plurality of subpixel regions. Each pixel circuit includes at least a display-driving sub-circuit coupled to one organic light-emitting diode. At least one pixel circuit in the at least one subpixel region includes a light-sensing sub-circuit formed on the light-sensitive sub-region and coupled to the display-driving sub-circuit formed on the display sub-region.

公开(公告)号：US20210225965A1

公开(公告)日：2021-07-22

申请号：US16099530

申请日：2017-12-15

Applicant: BOE Technology Group Co., Ltd.

Inventor： Libin Liu ,  Xiaowei Xu

IPC: H01L27/32 ,  G09G3/3266 ,  G09G3/3291 ,  G09G3/3258

Abstract: The present application discloses a display panel comprising a substrate, a transistor layer on the substrate, and a pixel-defining layer on a side of the transistor layer distal to the substrate to divide the display panel into a plurality of subpixel regions. At least one subpixel region includes a display sub-region and a light-sensitive sub-region. The display panel further includes a plurality of organic light-emitting diodes formed on the transistor layer respectively on the plurality of subpixel regions. Additionally, the display panel includes a plurality of pixel circuits formed in the transistor layer respectively on the plurality of subpixel regions. Each pixel circuit includes at least a display-driving sub-circuit coupled to one organic light-emitting diode. At least one pixel circuit in the at least one subpixel region includes a light-sensing sub-circuit formed on the light-sensitive sub-region and coupled to the display-driving sub-circuit formed on the display sub-region.

公开(公告)号：US20200156160A1

公开(公告)日：2020-05-21

申请号：US16328469

申请日：2018-07-12

Applicant: Fuzhou BOE Optoelectronics Technology Co., Ltd. ,  Boe Technology Group., Co., Ltd.

Inventor： Zisong Jiang ,  Jinyin Zuo ,  Xiaowei Xu ,  Huizhen Du ,  Duo Zhang

IPC: B23B45/02 ,  B25J9/06

Abstract: An electrical tool including: a cutter bit assembly, a driving mechanism for providing a power to the cutter bit assembly, and a flexible transmission mechanism, which is connected at one end thereof to the driving mechanism and connected at the other end thereof to the cutter bit assembly; the flexible transmission mechanism is twistable and bendable, and is configured to transmit the power provided by the driving mechanism to the cutter bit assembly.

公开(公告)号：US10297678B2

公开(公告)日：2019-05-21

申请号：US15989773

申请日：2018-05-25

Applicant: BOE Technology Group Co., Ltd.

Inventor： Xiaolong Li ,  Zunqing Song ,  Xiaowei Xu ,  Dong Li

IPC: H01L21/00 ,  H01L21/84 ,  H01L29/66 ,  H01L21/768 ,  H01L21/324 ,  H01L21/265

Abstract: The present disclosure provides a method for manufacturing a thin film transistor comprising, forming a pattern of an active layer on a substrate through a patterning process; performing ion doping to a channel region of the active layer; forming a gate insulating layer; forming a pattern of a gate through the patterning process; performing ion doping to a source contact region and a drain contact region of the active layer; forming an interlayer insulating layer; and performing laser annealing to the active layer, so as to make the active layer crystallize and the ions doped in the channel region, the source contact region and the drain contact region of the active layer activate simultaneously. In this method, the crystallization of the active layer and the activation of the ions doped in the active layer are implemented in the same process, which reduces the process cost and improves the efficiency.

公开(公告)号：US10241339B2

公开(公告)日：2019-03-26

申请号：US15198063

申请日：2016-06-30

Applicant: Boe Technology Group Co., Ltd.

Inventor： Xiaowei Xu ,  Xiaolong Li ,  Liangjian Li

IPC: G02B27/14 ,  G02B27/10 ,  G02B26/02 ,  B23K26/00 ,  B23K26/067 ,  B23K26/0622 ,  H01L21/268 ,  B23K26/06 ,  H01S3/00 ,  B23K103/00 ,  H01S3/10 ,  G02B17/02

Abstract: The present disclosure discloses a laser pulse delay system and a laser annealing system. The laser pulse delay system comprises: a beam splitter, a first reflective unit and a delay unit. The beam splitter is configured to split a laser beam emitted by a laser into a first beam and a second beam, such that the first beam is transmitted to the first reflective unit and the second beam is transmitted to the delay unit. The first reflective unit is configured to reflect the first beam it receives, such that the reflected first beam is transmitted to a component to be irradiated. The delay unit is configured to delay the second beam it receives, such that the delayed second beam is transmitted to the component to be irradiated.

公开(公告)号：US20180374908A1

公开(公告)日：2018-12-27

申请号：US15737191

申请日：2017-06-29

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xiaolong Li ,  Yi Li ,  Xiaowei Xu ,  Zheng Liu

IPC: H01L27/32

CPC classification number: H01L27/326 ,  H01L27/3206 ,  H01L27/3216 ,  H01L27/3218 ,  H01L27/3246 ,  H01L27/3272 ,  H01L51/0011 ,  H01L51/0017 ,  H01L2251/558

Abstract: A display substrate, a method for manufacturing the same, a display panel and a display device are disclosed. The display substrate includes a pixel unit, and the pixel unit includes a light emitting layer and a pixel definition layer surrounding the light emitting layer. The pixel definition layer includes a first region and a second region. The first region has a first thickness, the second region has a second thickness. The first thickness is greater than the second thickness.

公开(公告)号：US09825106B2

公开(公告)日：2017-11-21

申请号：US15244930

申请日：2016-08-23

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Yansong Li ,  Xiaowei Xu ,  Liangjian Li

IPC: H01L51/56 ,  H01L27/32 ,  H01L51/52

CPC classification number: H01L27/3246 ,  H01L51/5271 ,  H01L51/56

Abstract: The present disclosure discloses an OLED display substrate and a manufacturing method thereof, and a display apparatus. The OLED display substrate is a top emitting OLED display substrate, and comprises a reflective layer covering side surfaces of a pixel defining layer, thus the reflective layer and a first electrode of the OLED form a reflective cup which increases the reflection of light emitted from the OLED.

公开(公告)号：US09524991B2

公开(公告)日：2016-12-20

申请号：US14422343

申请日：2014-06-30

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Wenqing Xu ,  Hui Tian ,  Xiaowei Xu

IPC: H01L27/12 ,  H01L27/32 ,  H01L29/786

CPC classification number: H01L27/1255 ,  H01L27/1222 ,  H01L27/1274 ,  H01L27/3265 ,  H01L29/78675

Abstract: An array substrate and a manufacturing method thereof, and a display apparatus comprising the array substrate are provided. The array substrate comprises a base substrate, and a thin film transistor and a storing capacitor provided on the base substrate, the thin film transistor comprises a gate, a source, a drain and a gate insulation layer provided between the source and drain and the gate, the storing capacitor comprises a first plate, a second plate and a dielectric layer provided between the first plate and the second plate, wherein, both of the first plate and the second plate are formed of metal material, and the dielectric layer is formed of the same material as the gate insulation layer. In the array substrate of the present invention, the charging speed of the storing capacitor can be improved and the display quality of the display apparatus comprising the array substrate is further improved.

Abstract translation: 提供阵列基板及其制造方法以及包括阵列基板的显示装置。 阵列基板包括基底基板和设置在基底基板上的薄膜晶体管和存储电容器，薄膜晶体管包括设置在源极和漏极与栅极之间的栅极，源极，漏极和栅极绝缘层 存储电容器包括设置在第一板和第二板之间的第一板，第二板和介电层，其中，第一板和第二板都由金属材料形成，并且介电层由 与栅极绝缘层相同的材料。 在本发明的阵列基板中，可以提高存储电容器的充电速度，并且进一步提高包括阵列基板的显示装置的显示质量。

公开(公告)号：US09837502B2

公开(公告)日：2017-12-05

申请号：US14907778

申请日：2015-08-24

Applicant: BOE Technology Group Co., Ltd.

Inventor： Hongwei Tian ,  Kaihong Ma ,  Wenqing Xu ,  Yueping Zuo ,  Xiaowei Xu

IPC: H01L29/423 ,  H01L23/50 ,  H01L29/41 ,  H01L21/28 ,  H01L27/12 ,  H01L29/417 ,  H01L29/49 ,  H01L29/786

CPC classification number: H01L29/42384 ,  H01L21/28008 ,  H01L23/50 ,  H01L27/124 ,  H01L27/3276 ,  H01L29/41 ,  H01L29/41733 ,  H01L29/4908 ,  H01L29/786

Abstract: A conductive structure and a manufacturing method thereof, an array substrate and a display device. The conductive structure includes a plurality of first metal layers made of aluminum, and between every two first metal layers that are adjacent, there is also provided a second metal layer, which is made of a metal other than aluminum. With the conductive structure, the hillock phenomenon that happens to the conductive structure when it is heated can be decreased without reducing the overall thickness of the conductive structure.