公开(公告)号：US11036141B2

公开(公告)日：2021-06-15

申请号：US16424734

申请日：2019-05-29

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Ming Liu ,  Yueping Zuo ,  Qiuhua Meng ,  Chunyang Wang ,  Fei Fang

IPC: G03F7/004 ,  G03F7/20

Abstract: A photoresist and a method of manufacturing photoresist patterns are disclosed. The photoresist includes a plurality of photosensitive units, and each photosensitive unit has magnetism.

公开(公告)号：US10886482B2

公开(公告)日：2021-01-05

申请号：US16452946

申请日：2019-06-26

Applicant: BOE Technology Group Co., Ltd.

Inventor： Shuai Zhang ,  Xiaolong Li ,  Yueping Zuo ,  Shantao Chen ,  Qiuhua Meng ,  Ming Liu

IPC: H01L51/00 ,  H01L51/52 ,  H01L27/32 ,  H01L33/12 ,  H01L29/78 ,  C08L63/00 ,  G03F7/00 ,  H05K1/02 ,  B82Y10/00 ,  B82Y40/00

Abstract: A flexible display panel, a manufacturing method thereof and a display device are provided. The flexible display panel includes: a flexible substrate, a first metal layer formed on the substrate, an insulation layer overlying the first metal layer, and a second metal layer disposed on the insulation layer, wherein a plurality of via holes are provided in the insulation layer, the inner wall of each via hole is covered by a stress buffer layer and the second metal layer is formed on the stress buffer layer and connected to the first metal layer through the via holes.

公开(公告)号：US10741634B2

公开(公告)日：2020-08-11

申请号：US16468341

申请日：2017-11-06

Applicant: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Benlian Wang ,  Li Wang ,  Yipeng Chen ,  Yueping Zuo ,  Zheng Liu

IPC: G02F1/13 ,  H01L27/32 ,  G02F1/1333 ,  G02F1/1345 ,  G02F1/1362 ,  H01L51/00 ,  H01L27/12

Abstract: A wiring structure, a display substrate and a display device; the wiring structure comprises a plurality of hollow patterns, and edges of the wiring structure along a length direction of the wiring structure extend in a straight line, the wiring structure can release stress through the hollow patterns so as to avoid breakage of the wiring structure, the display substrate, and the display device.

公开(公告)号：US09935177B2

公开(公告)日：2018-04-03

申请号：US15038174

申请日：2015-11-11

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Yueping Zuo ,  Liangjian Li

IPC: H01L29/66 ,  H01L21/265 ,  H01L21/266 ,  H01L29/786

CPC classification number: H01L29/66757 ,  H01L21/26513 ,  H01L21/266 ,  H01L29/66492 ,  H01L29/78621 ,  H01L29/78624 ,  H01L29/78696

Abstract: Embodiments of the present invention provide a thin film transistor and a manufacturing method thereof, an array substrate including the thin film transistor, and a manufacturing method of the array substrate. The thin film transistor comprises an active layer, a gate insulation layer, a gate, an interlayer insulation layer, a source and a drain formed on a base substrate, the interlayer insulation layer and the gate insulation layer are provided therein with through holes corresponding to the source and the drain; the active layer comprises a source ohmic contact region connected with the source, a drain ohmic contact region connected with the drain, a channel region serving as a channel located below the gate, and a lightly doped region between the drain ohmic contact region and the channel region.

公开(公告)号：US11127806B2

公开(公告)日：2021-09-21

申请号：US15779664

申请日：2017-11-07

Applicant: BOE TECHNOLOGY GROUP CO., LTD. ,  CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Benlian Wang ,  Li Wang ,  Yipeng Chen ,  Yueping Zuo ,  Zheng Liu

IPC: H01L27/32 ,  H01L51/00

Abstract: A wiring structure, a display substrate and a display device are provided, which belongs to the field of display technology. The wiring structure includes a plurality of hollow patterns connected successively. Each of the hollow patterns includes a first conductive part having a first pattern and a second conductive part having a second pattern. The first conductive part and the second conductive part are connected with each other, and the first pattern and the second pattern have different shapes. Because the wiring structure includes a plurality of hollow patterns connected successively, and the first conductive part and the second conductive part in each hollow pattern have different shapes, even if the conductive part of one shape in the wiring structure is broken in the process of bending, stretching and twisting, the conductive part of the other shape can also ensure good conductivity for the wiring structure.

公开(公告)号：US10998385B2

公开(公告)日：2021-05-04

申请号：US16399156

申请日：2019-04-30

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yueping Zuo ,  Shuai Zhang ,  Shantao Chen

IPC: H01L27/32 ,  H01L51/52 ,  G06K9/00 ,  H01L51/56

Abstract: A display element, a method for fabricating the same, and a display device are provided. The display element includes: a blocking layer; a fingerprint sensor on one side of the blocking layer; a light-shielding layer on the side of the blocking layer away from the fingerprint sensor, wherein the light-shielding layer includes a first via-hole; a middle layer on the light-shielding layer; a pixel definition layer on the middle layer, wherein the pixel definition layer includes a second via-hole in which a cathode layer and a light-emitting layer are arranged; an antireflection coating on the pixel definition layer; and an anode layer on the light-emitting layer.

公开(公告)号：US10008516B2

公开(公告)日：2018-06-26

申请号：US14428578

申请日：2014-07-16

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Yueping Zuo ,  Zheng Liu

IPC: H01L27/12 ,  H01L29/786 ,  H01L29/417 ,  H01L29/45

CPC classification number: H01L27/124 ,  H01L27/1222 ,  H01L27/1262 ,  H01L29/41733 ,  H01L29/458 ,  H01L29/78603 ,  H01L29/78675 ,  H01L29/78678

Abstract: The present disclosure relates to the field of TFT manufacturing process, and provides an LTPS TFT array substrate, its manufacturing method and a display device. The LTPS TFT array substrate includes contact holes through which a source electrode and a drain electrode of the array substrate are connected to an active layer, respectively, wherein a conductive pattern connected to the active layer is provided at a base portion of the contact hole. According to the present disclosure, it is able to form an excellent ohmic contact between the source/drain electrodes and the active layer after the contact holes have been etched, thereby to ensure the display quality of the display device.

公开(公告)号：US09997547B2

公开(公告)日：2018-06-12

申请号：US15107070

申请日：2016-02-22

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Yueping Zuo ,  Chien Hung Liu ,  Liangjian Li ,  Yinghai Ma

IPC: H01L21/683 ,  H01L27/12

CPC classification number: H01L27/1266

Abstract: The present application discloses a method of fabricating a display apparatus, comprising providing a carrier substrate comprising a base substrate and an adhesive layer over the base substrate, wherein the base substrate comprises a plurality of fluid passages between the base substrate and the adhesive layer, and a plurality of fluid inlets connected with the plurality of fluid passages; forming a product substrate on a side of the adhesive layer distal to the base substrate; dispensing a detaching agent through the plurality of fluid inlets to the plurality of fluid passages, and contacting the detaching agent with the adhesive layer through the plurality of fluid passages; and detaching the product substrate from the carrier substrate.

公开(公告)号：US09711602B2

公开(公告)日：2017-07-18

申请号：US15116195

申请日：2016-02-22

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Liangjian Li ,  Yueping Zuo ,  Yinghai Ma ,  Xiaowei Xu

IPC: H01L29/12 ,  H01L29/417 ,  H01L29/423 ,  H01L27/12 ,  H01L29/06 ,  H01L29/786 ,  H01L23/535 ,  H01L29/66

CPC classification number: H01L29/41733 ,  H01L23/535 ,  H01L27/1222 ,  H01L27/124 ,  H01L27/1248 ,  H01L27/1288 ,  H01L29/0649 ,  H01L29/42384 ,  H01L29/6675 ,  H01L29/78684

Abstract: The present application discloses a thin film transistor comprising active layer on a base substrate; an insulating layer over the active layer, the insulating layer comprising a source via and a drain via, each of which extending through the insulating layer; a source electrode within the source via in contact with the active layer; and a drain electrode within the drain via in contact with the active layer.

公开(公告)号：US20170040430A1

公开(公告)日：2017-02-09

申请号：US14907778

申请日：2015-08-24

Applicant: BOE Technology Group Co. Ltd.

Inventor： Hongwei Tian ,  Kaihong Ma ,  Wenqing Xu ,  Yueping Zuo ,  Xiaowei Xu

IPC: H01L29/423 ,  H01L21/28 ,  H01L29/49 ,  H01L27/12 ,  H01L29/417

CPC classification number: H01L29/42384 ,  H01L21/28008 ,  H01L23/50 ,  H01L27/124 ,  H01L27/3276 ,  H01L29/41 ,  H01L29/41733 ,  H01L29/4908 ,  H01L29/786

Abstract: A conductive structure and a manufacturing method thereof, an array substrate and a display device. The conductive structure includes a plurality of first metal layers made of aluminum, and between every two first metal layers that are adjacent, there is also provided a second metal layer, which is made of a metal other than aluminum. With the conductive structure, the hillock phenomenon that happens to the conductive structure when it is heated can be decreased without reducing the overall thickness of the conductive structure.

Abstract translation: 导电结构及其制造方法，阵列基板和显示装置。 导电结构包括多个由铝制成的第一金属层，并且在邻近的每两个第一金属层之间，还提供由铝以外的金属制成的第二金属层。 利用导电结构，可以降低导电结构在被加热时发生的小丘现象，而不会降低导电结构的整体厚度。