摘要:
A method of forming a NAND-type flash memory device including forming a stacked gate flash memory structure (346) containing an interpoly dielectric layer (322) for one or more flash memory cells in a core region (305). The method also includes forming a select gate transistor structure (348) having a first gate oxide (322) formed of the interpoly dielectric material and a gate conductor (338) overlying the first gate oxide (322) in the core region (305). A NAND-type flash memory device includes a core region (305) comprising a stacked gate flash memory cell structure (346) and a select gate transistor (348) and a periphery region (314, 315) comprising a low voltage transistor (342) and a high voltage transistor (350). The stacked gate flash memory cell structure (346) includes a tunnel oxide layer (308), a poly1 layer (312) overlying the tunnel oxide layer (308), an interpoly dielectric layer (322) formed of an insulating material overlying the poly1 layer (312) and a poly2 layer (338) overlying the interpoly dielectric layer (322). In addition, the select gate transistor structure (348) includes a gate insulator (322) formed of the insulating material and a poly2 layer (338) overlying the gate insulator (322).
摘要:
A method (200) of forming a NAND type flash memory device includes the steps of forming an oxide layer (202) over a substrate (102) and forming a first conductive layer (106) over the oxide layer. The first conductive layer (106) is etched to form a gate structure (107) in a select gate transistor region (105) and a floating gate structure (106a, 106b) in a memory cell region (111). A first insulating layer (110) is then formed over the memory cell region (111) and a second conductive layer (112, 118) is formed over the first insulating layer (110). A word line (122) is patterned in the memory cell region (111) to form a control gate region and source and drain regions (130, 132) are formed in the in the substrate (102) in a region adjacent the word line (122) and in a region adjacent the gate structure (107). A second insulating layer (140) is formed over both the select gate transistor region (105) and the memory cell region (111) and first and second contact openings are formed in the second insulating layer (140) down to the gate structure (107) and the control gate region, wherein a depth (X) through the second insulating layer (140) down to the gate structure (107) and down to the control gate region are approximately the same, thereby eliminating a substantial overetch of the gate structure contact opening.
摘要:
A semiconductor device having multiple layers uses different size contacts at different layer in order in order to simply the manufacturing process and the depth of etching required. Contact sizes are selected based on the responsiveness of the material to the etching process. Where a deep etch is required, a larger contact is used. A shallower etch through similar material uses a smaller contact to slow the etching process. As a result, the etches can complete at about the same time. The technique can be employed to etch any number of contacts. An intermediate size contact can be used where the material to be etched results in a slower etching process. A plurality of contact sizes can be used depending on the depths of etching required and the characteristics material to be etched, so that the etching for all the contacts completes at substantially the same time.
摘要:
A method and circuit for sensing multi states of a NAND memory cell by varying source bias, at a constant gate voltage, preferably zero volts, generating a memory cell current in response to the source bias, and sensing the memory cell state.
摘要:
A high voltage transistor exhibiting high gated diode breakdown voltage, low leakage and low body effect is forced while avoiding an excessive number of costly masking steps. Embodiments include providing a high gated diode breakdown voltage by masking the high voltage junctions from the conventional field implant, masking the source/drain regions from the conventional threshold adjust implant, and employing a very lightly doped n-type implant in lieu of conventional n+ and LDD implants. Appropriate openings are formed in the field implant blocking mask so that the field implant occurs at the edges of the junctions, thus achieving low leakage. The field implant blocking mask is extended over the channel area, thereby producing a transistor with low body effect.
摘要:
A CAPTCHA method executed by a CAPTCHA system is provided, comprising: receiving a CAPTCHA request comprising category information of an application service from an application server; responding to the application server with a token identifying the CAPTCHA request and a CAPTCHA image comprising a distorted advertisement word associated to the category information and a series of randomly generated and distorted characters, both the advertisement word and the characters being a CAPTCHA text intended to be typed by a user via a user equipment connected to the application server; receiving from the application server the token and a CAPTCHA answer submitted from the user equipment by the user; and verifying the token and the answer and returning to the application server a result of the verification. This provides an improved CAPTCHA system and method with better advertising effects and security.
摘要:
A method and system for providing at least one contact in a flash memory device is disclosed. The flash memory device includes a plurality of gate stacks and at lease one component including a polysilicon layer as a top surface. The method and system further include forming a silicide on the top surface of the polysilicon layer and providing an insulating layer covering the plurality of gate stacks, the at least one component and the silicide. The method and system also include etching the insulating layer to provide at least one contact hole. The insulating layer etching step uses the silicide as an etch stop layer to ensure that the insulating etching step does not etch through the polysilicon layer. The method and system also include filling the at least one contact hole with a conductor.
摘要:
An impedance matched write circuit is provided that shunts one or more matching resistors. The impedance matched write circuit includes an interconnect for connecting to a write head and at least one resistor between a control voltage and the interconnect for impedance matching to the interconnect. A transistor can be connected across the resistor to shunt current that would otherwise pass through the resistor during an overshoot mode. The transistor may be a PMOS transistor or a combination of PMOS and NMOS transistors. A gate voltage of the transistor is controlled by a source such that the transistor is turned on in an overshoot mode and turned off during a steady state mode.
摘要:
A NAND flash memory device incorporates a unique booster plate design. The booster plate is biased during read and program operations and the coupling to the floating gates in many cases reduces the voltage levels necessary to program and read the charge stored in the gates. The booster plate also shields against unwanted coupling between floating gates. Self boosting, local self boosting, and erase area self boosting modes used with the unique booster plate further improve read/write reliability and accuracy. A more compact and reliable memory device can hence be realized according to the present invention.
摘要:
A demagnetizer for an inductive load having a driver circuit including at least one transistor and a ramp-down voltage source switchably connected to the driver circuit, so that when the ramp-down voltage source is connected to the transistor, it drives the voltage of the transistor below its threshold voltage.