METHODS FOR FORMING BARRIER REGIONS WITHIN REGIONS OF INSULATING MATERIAL RESULTING IN OUTGASSING PATHS FROM THE INSULATING MATERIAL AND RELATED DEVICES
    11.
    发明申请
    METHODS FOR FORMING BARRIER REGIONS WITHIN REGIONS OF INSULATING MATERIAL RESULTING IN OUTGASSING PATHS FROM THE INSULATING MATERIAL AND RELATED DEVICES 有权
    在绝缘材料和相关设备中在绝缘材料上形成的绝缘材料区域中形成障碍区域的方法

    公开(公告)号:US20110198694A1

    公开(公告)日:2011-08-18

    申请号:US12707150

    申请日:2010-02-17

    Inventor: Man Fai NG Bin YANG

    CPC classification number: H01L21/84 H01L21/76267 H01L21/823878 H01L29/66772

    Abstract: Methods and devices are provided for fabricating a semiconductor device having barrier regions within regions of insulating material resulting in outgassing paths from the regions of insulating material. A method comprises forming a barrier region within an insulating material proximate the isolated region of semiconductor material and forming a gate structure overlying the isolated region of semiconductor material. The barrier region is adjacent to the isolated region of semiconductor material, resulting in an outgassing path within the insulating material.

    Abstract translation: 提供了用于制造在绝缘材料区域内具有阻挡区域的半导体器件的方法和装置,导致从绝缘材料区域的脱气路径。 一种方法包括在靠近半导体材料的隔离区域的绝缘材料内形成阻挡区域,并形成覆盖半导体材料的隔离区域的栅极结构。 阻挡区域与半导体材料的隔离区域相邻,导致绝缘材料内的除气路径。

    COMPREHENSIVELY NUTRITIOUS INSTANT FOOD
    13.
    发明申请

    公开(公告)号:US20170215465A1

    公开(公告)日:2017-08-03

    申请号:US15329231

    申请日:2015-07-31

    Applicant: Bin YANG

    Inventor: Bin YANG

    Abstract: A comprehensively nutritious instant food includes the following raw ingredients: rice powder 39.593849% to 44.930798%, soybean meal 29.695386% to 33.698099%, protein 8.908616% to 10.109430%, edible fiber 4.949231% to 5.616350%, carotene 0.000099% to 0.000112%, calcium 0.197969% to 0.224654%, iron 0.000356% to 0.000404%, zinc 0.000297% to 0.000337%, copper 0.000040% to 0.000045%, sodium 0.395938% to 0.449308%, potassium 0.395938% to 0.449308%, manganese 0.000040% to 0.000045%, selenium 0.000014% to 0.000016%, iodine 0.000030% to 0.000034%, phosphorus 0.013858% to 0.015726%, magnesium 0.007919% to 0.008986%, fluorine 0.000554% to 0.000629%, vitamin B1 0.000297% to 0.000337%, vitamin B2 0.000040% to 0.000045%, vitamin B6 0.000040% to 0.000045%, vitamin B12 0.000001% to 0.000001%, vitamin B3 0.000396% to 0.000449%, vitamin D 0.000013% to 0.000015%, vitamin K 0.000016% to 0.000018%, vitamin H 0.000059% to 0.000067%, vitamin B 0.000079% to 0.000090%, vitamin E 0.000178% to 0.000202%, vitamin C 0.001188% to 0.001348%, vitamin A 0.000020% to 0.000022%, edible fat 0 to 10.523458%, and refined sugar 0-5.939077%.

    SEMICONDUCTOR TRANSISTOR DEVICE STRUCTURE WITH BACK SIDE SOURCE/DRAIN CONTACT PLUGS, AND RELATED MANUFACTURING METHOD
    14.
    发明申请
    SEMICONDUCTOR TRANSISTOR DEVICE STRUCTURE WITH BACK SIDE SOURCE/DRAIN CONTACT PLUGS, AND RELATED MANUFACTURING METHOD 有权
    具有背面源/漏极接触片的半导体晶体管器件结构及相关制造方法

    公开(公告)号:US20110169083A1

    公开(公告)日:2011-07-14

    申请号:US12687607

    申请日:2010-01-14

    Abstract: A method of fabricating a semiconductor device with back side conductive plugs is provided here. The method begins by forming a gate structure overlying a semiconductor-on-insulator (SOI) substrate. The SOI substrate has a support layer, an insulating layer overlying the support layer, an active semiconductor region overlying the insulating layer, and an isolation region outboard of the active semiconductor region. A first section of the gate structure is formed overlying the isolation region and a second section of the gate structure is formed overlying the active semiconductor region. The method continues by forming source/drain regions in the active semiconductor region, and thereafter removing the support layer from the SOI substrate. Next, the method forms conductive plugs for the gate structure and the source/drain regions, where each of the conductive plugs passes through the insulating layer.

    Abstract translation: 此处提供制造具有背面导电插头的半导体器件的方法。 该方法通过形成覆盖绝缘体上半导体(SOI)衬底的栅极结构开始。 SOI衬底具有支撑层,覆盖在支撑层上的绝缘层,覆盖绝缘层的有源半导体区域和有源半导体区域外侧的隔离区域。 栅极结构的第一部分形成在隔离区域的上方,栅极结构的第二部分形成在有源半导体区域的上方。 该方法通过在有源半导体区域中形成源极/漏极区域继续,然后从SOI衬底去除支撑层。 接下来,该方法形成用于栅极结构和源极/漏极区域的导电插塞,其中每个导电插塞穿过绝缘层。

    METHOD FOR PRODUCING SILICON NANOWIRE DEVICES
    16.
    发明申请
    METHOD FOR PRODUCING SILICON NANOWIRE DEVICES 有权
    生产硅纳米装置的方法

    公开(公告)号:US20130102134A1

    公开(公告)日:2013-04-25

    申请号:US13659907

    申请日:2012-10-24

    Abstract: The invention provides a method for producing silicon nanowire devices, including the following steps: growing SiNW on a substrate; depositing an amorphous carbon layer and dielectric anti-reflectivity coating orderly; removing part of dielectric anti-reflectivity coating and amorphous carbon layer above the SiNW through dry etching to expose the SiNW device area; depositing an oxide film on the surface of the above structure; forming a metal pad connected with the SiNW in the SiNW device area; depositing a passivation layer on the surface of the above structure; applying photolithography and etching technology to form contact holes on the metal pad and to remove the passivation layer, the oxide film and the dielectric anti-reflectivity coating above the SiNW outside the device area, stopping on the amorphous carbon layer; removing the amorphous carbon layer above the SiNW outside the device area through ashing process to expose the SiNW.

    Abstract translation: 本发明提供一种生产硅纳米线器件的方法,包括以下步骤:在衬底上生长SiNW; 有序沉积无定形碳层和电介质抗反射涂层; 通过干蚀刻去除SiNW上方的介电抗反射涂层和无定形碳层的一部分,以暴露SiNW器件区域; 在上述结构的表面上沉积氧化膜; 在SiNW器件区域中形成与SiNW连接的金属焊盘; 在上述结构的表面上沉积钝化层; 施加光刻和蚀刻技术以在金属焊盘上形成接触孔,并在器件区域外的SiNW上方去除钝化层,氧化物膜和介电抗反射涂层,停止在无定形碳层上; 通过灰化处理去除器件区域外的SiNW以上的无定形碳层,以暴露SiNW。

    SEMICONDUCTOR DEVICES HAVING STRESSOR REGIONS AND RELATED FABRICATION METHODS
    17.
    发明申请
    SEMICONDUCTOR DEVICES HAVING STRESSOR REGIONS AND RELATED FABRICATION METHODS 有权
    具有压力区域的半导体器件及相关制造方法

    公开(公告)号:US20110303954A1

    公开(公告)日:2011-12-15

    申请号:US12814346

    申请日:2010-06-11

    Inventor: Bin YANG Man Fai NG

    Abstract: Apparatus for semiconductor device structures and related fabrication methods are provided. One method for fabricating a semiconductor device structure involves forming a gate structure overlying a region of semiconductor material, wherein the width of the gate structure is aligned with a crystal direction of the semiconductor material. The method continues by forming recesses about the gate structure and forming a stress-inducing semiconductor material in the recesses.

    Abstract translation: 提供了半导体器件结构和相关制造方法的装置。 制造半导体器件结构的一种方法包括形成覆盖半导体材料区域的栅极结构,其中栅极结构的宽度与半导体材料的<100>晶体方向对齐。 该方法通过在栅极结构周围形成凹槽并在凹部中形成应力诱导半导体材料来继续。

    METHOD FOR INCREASING BULKINESS OF RECONSTITUTED TOBACCO

    公开(公告)号:US20210259297A1

    公开(公告)日:2021-08-26

    申请号:US17037552

    申请日:2020-09-29

    Abstract: A method for increasing bulkiness of reconstituted tobacco by adding tobacco stem particles includes (1) pulverizing a first portion of tobacco stems to obtain tobacco stem particles; (2) classifying the tobacco stem particles with mesh sieves and selecting the tobacco stem particles with a predetermined mesh size; (3) extracting a second portion of the tobacco stems with water and grinding to form a tobacco stem slurry that has a beating degree of 12-14° SR, and mixing the tobacco stem slurry with tobacco leaves in a weight ratio of 6:4 and grinding to obtaining a tobacco slurry that has a beating degree of 18-20° SR; (4) cutting plant fiber pulp boards and dispersing in water to form a plant fiber pulp; (5) preparing a filler solution that contains 10 wt % of a mineral filler; (6) mixing, rolling and drying to obtain the reconstituted tobacco.

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