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公开(公告)号：US10953633B2
公开(公告)日：2021-03-23
申请号：US14423956
申请日：2013-08-27
Applicant: Corning Incorporated
Inventor： Kiat Chyai Kang , Govindarajan Natarajan , Yu Xiao
IPC: B29C65/02 , B32B7/12 , B32B27/06 , B32B17/06 , B32B17/10 , B29C65/54 , B29C65/00 , B32B27/30 , B29K105/00 , B29L9/00 , B29L31/34
Abstract: A glass-polymer laminate structure includes a flexible glass substrate having a thickness of no more than about 0.3 mm. A polymer layer is laminated to a surface of the flexible glass substrate having a coefficient of thermal expansion (CTE) that is at least about 2 times a CTE of the flexible glass substrate. The polymer layer is laminated to the surface of the flexible glass substrate after thermally expanding the polymer layer to provide the flexible glass substrate with an in-plane compressive stress of at least about 30 MPa along a thickness of the flexible glass substrate.
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公开(公告)号：US20190126316A1
公开(公告)日：2019-05-02
申请号：US16230165
申请日：2018-12-21
Applicant: Corning Incorporated
Inventor： Jeffrey John Domey , Matthew Wade Fenton , Govindarajan Natarajan , Paul John Shustack , Jian-Zhi Jay Zhang
Abstract: A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.
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公开(公告)号：US20180104716A1
公开(公告)日：2018-04-19
申请号：US15659918
申请日：2017-07-26
Applicant: CORNING INCORPORATED
Inventor： Jeffrey John Domey , Matthew Wade Fenton , Govindarajan Natarajan , Paul John Shustack , Jian-Zhi Jay Zhang
CPC classification number: B05D1/36 , B32B17/10018 , B32B17/10137 , B32B17/10256 , B32B17/10266 , B32B2323/043 , B32B2323/10 , B32B2327/06 , B32B2367/00 , B41J3/407 , C03C17/34 , C03C17/3405 , C03C2217/72 , C03C2218/119 , C03C2218/31 , Y10T428/24851
Abstract: A method for printing ink on a substrate comprising the steps of coating a glass substrate with an adhesion promoter, depositing one or more layers of ink on the coated substrate, and laminating the imaged substrate. The substrate can be a glass substrate, and the adhesion promoter can include a silane material, powder coating, organophosphate primer suspended in isopropanol.
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Patent Agency Ranking
公开(公告)号：US20150258750A1
公开(公告)日：2015-09-17
申请号：US14423956
申请日：2013-08-27
Applicant: Corning Incorporated
Inventor： Kiat Chyai Kang , Govindarajan Natarajan , Yu Xiao
CPC classification number: B32B17/064 , B29C65/02 , B29C65/54 , B29C66/7465 , B29K2105/0097 , B29K2105/253 , B29K2833/12 , B29K2909/08 , B29K2995/0026 , B29L2009/00 , B29L2031/3412 , B32B7/12 , B32B17/10018 , B32B17/10036 , B32B17/101 , B32B17/10743 , B32B17/10752 , B32B27/06 , B32B27/308 , B32B2250/02 , B32B2255/10 , B32B2457/00 , Y10T428/24628 , Y10T428/266
Abstract: A glass-polymer laminate structure includes a flexible glass substrate having a thickness of no more than about 0.3 mm. A polymer layer is laminated to a surface of the flexible glass substrate having a coefficient of thermal expansion (CTE) that is at least about 2 times a CTE of the flexible glass substrate. The polymer layer is laminated to the surface of the flexible glass substrate after thermally expanding the polymer layer to provide the flexible glass substrate with an in-plane compressive stress of at least about 30 MPa along a thickness of the flexible glass substrate.
Abstract translation: 玻璃 - 聚合物层压结构包括厚度不大于约0.3mm的柔性玻璃基底。 聚合物层被层压到柔性玻璃基板的表面，其具有至少约为柔性玻璃基板的CTE的约2倍的热膨胀系数（CTE）。 在将聚合物层热膨胀之后，将聚合物层层压到柔性玻璃基板的表面上，以沿柔性玻璃基板的厚度提供具有至少约30MPa的平面内压缩应力的柔性玻璃基板。
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公开(公告)号：US20180345644A1
公开(公告)日：2018-12-06
申请号：US15771694
申请日：2016-10-27
Applicant: CORNING INCORPORATED
Inventor： Kiat Chyai Kang , Sue Camille Lewis , Govindarajan Natarajan , Marianne Griesbach Park , Nathaniel David Wetmore
CPC classification number: B32B17/061 , B32B17/064 , B32B17/10018 , B32B17/10743 , B32B17/10761 , B32B17/1077 , B32B17/10788 , B32B37/0015 , B32B37/144 , B32B2037/1253 , B32B2307/30 , B32B2309/02
Abstract: Embodiments of the present disclosure relate generally to methods of forming a laminate structure. In one or more embodiments, the method includes situating an interlayer between a glass substrate and a non-glass substrate having a softening point to form an assembled stack, heating the assembled stack to a temperature in a range of greater than the Tg of the interlayer to less than the softening point of the non-glass substrate and applying a force to at least one of the laminate glass surface and the laminate non-glass surface to bond that counter-balances thermal stress and polymer cure forces during bonding and prevents warpage, distortion and breakage of the laminate. In some embodiments, the interlayer has a coefficient of thermal expansion (CTE) at least 10 times greater than the CTE of the glass substrate.
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公开(公告)号：US10131118B2
公开(公告)日：2018-11-20
申请号：US14759354
申请日：2014-01-06
Applicant: Corning Incorporated , Kiat Chyai Kang , Sue Camille Lewis , Govindarajan Natarajan , Yu Xiao , Chunhe Zhang
Inventor： Kiat Chyai Kang , Sue Camille Lewis , Govindarajan Natarajan , Yu Xiao , Chunhe Zhang
Abstract: A laminated glass structure comprising a non-glass substrate and a glass sheet bonded to the non-glass substrate to form the laminated glass structure, wherein the laminated glass structure withstands a ball drop test wherein a 535 g stainless steel ball is dropped from a height of 0.8 m onto the laminated glass structure, with the glass sheet being impacted by the ball. The glass sheet has a thickness such that the glass sheet exhibits, without cracking, deformation to adapt to any shape change of the non-glass substrate as imparted by the ball of the ball drop test.
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公开(公告)号：US09902130B2
公开(公告)日：2018-02-27
申请号：US14412152
申请日：2013-06-25
Applicant: Corning Incorporated
Inventor： Donald Orrin Bigelow , Kiat Chyai Kang , Sue Camille Lewis , Govindarajan Natarajan , Eungsik Park
CPC classification number: B32B7/06 , B32B7/045 , B32B17/06 , B32B37/18 , B32B38/10 , B32B43/006 , B32B2307/748 , B32B2457/20 , B65G49/069 , B65H2301/51122 , B65H2557/514 , B65H2701/1315 , B65H2801/61 , C03C2218/355 , Y10T156/1153 , Y10T156/1158 , Y10T156/1195 , Y10T428/24777 , Y10T428/24802
Abstract: Methods of processing a glass substrate comprise the step of obtaining a glass substrate and a tab removably attached to a portion of the glass substrate. The position of the glass substrate is manipulated with the engagement portion and the tab is removed from the portion of the glass substrate by releasing a mounting portion of the tab from the portion of the glass substrate without damaging the glass substrate. In further examples, methods include the steps of removably attaching first and second tabs to respective first and second surfaces of a glass substrate and coiling the glass substrate on a storage roll wherein the first tab adheres to the second tab. In further examples, a glass apparatus comprises a glass substrate and a removable tab including a mounting portion attached to a portion of the glass substrate with a first peel force of less than about 10 N/cm.
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公开(公告)号：US20160083282A1
公开(公告)日：2016-03-24
申请号：US14785457
申请日：2014-04-14
Applicant: CORNING INCORPORATED
Inventor： Jean-Marc Martin Gerard Jouanno , Kiat Chyai Kang , Sue Camille Lewis , Govindarajan Natarajan , Yu Xiao
IPC: C03B27/012 , B32B37/10 , B32B37/06 , B32B37/08
CPC classification number: C03B27/012 , B29C35/0238 , B29C35/0277 , B29C43/30 , B29C43/52 , B29C44/06 , B29C44/24 , B32B17/061 , B32B17/064 , B32B17/10036 , B32B37/06 , B32B37/08 , B32B37/10 , B32B2457/20
Abstract: A method of forming a laminated glass structure includes introducing a continuous ribbon of flexible glass substrate having a thickness of no greater than about 0.3 mm to a substrate material. The substrate material has a coefficient of thermal expansion (CTE) that is greater than that of the flexible glass substrate. The flexible glass substrate is laminated to the substrate material at an elevated temperature. The substrate material is cooled to introduce a compressive stress across a thickness of the flexible glass substrate.
Abstract translation: 形成夹层玻璃结构的方法包括向衬底材料引入具有不大于约0.3mm的厚度的柔性玻璃衬底的连续带。 衬底材料的热膨胀系数（CTE）大于柔性玻璃衬底的热膨胀系数。 柔性玻璃基板在升高的温度下层压到基底材料上。 冷却基板材料以在柔性玻璃基板的厚度上引入压缩应力。
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