公开(公告)号：US20160287883A1

公开(公告)日：2016-10-06

申请号：US15080122

申请日：2016-03-24

Applicant: Cardiac Pacemakers, Inc.

Inventor： Patrick J. Barry ,  Randy White ,  Steven A. Kubow ,  Scott A. Spadgenske ,  David A. Chizek ,  Jerald Sauber

IPC: A61N1/375 ,  H05K5/02 ,  H01G4/35 ,  H05K3/22 ,  H03H3/00 ,  H05K3/30 ,  H05K3/10 ,  H05K1/02 ,  H03H7/01

CPC classification number: A61N1/3754 ,  H01G4/35 ,  H03H3/00 ,  H03H7/17 ,  H05K1/0213 ,  H05K1/184 ,  H05K3/10 ,  H05K3/22 ,  H05K3/284 ,  H05K3/303 ,  H05K5/0247 ,  H05K2201/10015 ,  H05K2201/10189 ,  H05K2201/10303

Abstract: An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.

Abstract translation: 一种用于可植入医疗装置的封装过滤的馈通组件，其包括套圈，耦合到套圈的电绝缘体，印刷电路板（PCB），延伸穿过电绝缘体和PCB的馈通导体以及耦合到PCB的电容器。 封装过滤的馈通组件可以包括限定开口并且相对于印刷电路板定位的模具，使得电容器的至少一部分位于开口内。 第一非导电材料可以对电容器进行底部填充，并且第二非导电材料可以回填到模具中以封装电容器。

公开(公告)号：US20140083762A1

公开(公告)日：2014-03-27

申请号：US14097607

申请日：2013-12-05

Applicant: Cardiac Pacemakers, Inc.

Inventor： Patrick J. Barry ,  Derek John Boettger

IPC: A61N1/05 ,  H02G3/02

CPC classification number: A61N1/05 ,  A61N1/3754 ,  H02G3/02 ,  Y10T29/49002

Abstract: A feedthrough assembly includes a metallic ferrule, an insulator mounted within the ferrule, a plurality of feedthrough wires mounted within and extending through the insulator, and a ground wire directly attached to the ferrule, wherein the ground wire does not pass through or alongside the insulator.

Abstract translation: 馈通组件包括金属套圈，安装在套圈内的绝缘体，安装在绝缘体内并延伸穿过绝缘体的多个馈通线，以及直接附接到套圈的接地线，其中接地线不穿过绝缘体或旁边， 。

公开(公告)号：US11266843B2

公开(公告)日：2022-03-08

申请号：US16175491

申请日：2018-10-30

Applicant: Cardiac Pacemakers, Inc.

Inventor： Jean M. Bobgan ,  James M. English ,  David P. Stieper ,  Richard Percy ,  Patrick J. Barry ,  Ernest Beaudet ,  Matthew Couri ,  Mark A. Lamberty

IPC: A61N1/372 ,  A61N1/375 ,  A61B5/00 ,  A61B5/0205 ,  A61B5/11 ,  A61B7/04 ,  A61N1/362 ,  A61N1/39

Abstract: Aspects of the present disclosure are directed toward apparatuses, systems, and methods that may comprise a medical device having a header, a core assembly, and a scaffold assembly. The scaffold assembly may be configured to interface with the core assembly and position and support one or more circuit component relative to one or more other circuit components.

公开(公告)号：US10828497B2

公开(公告)日：2020-11-10

申请号：US15934355

申请日：2018-03-23

Applicant: Cardiac Pacemakers, Inc.

Inventor： Patrick J. Barry ,  Randy White ,  Steven A. Kubow ,  Scott A. Spadgenske ,  David A. Chizek ,  Jerald Sauber

IPC: H05K3/30 ,  A61N1/375 ,  H05K1/18 ,  H01G4/35 ,  H03H3/00 ,  H03H7/01 ,  H05K1/02 ,  H05K3/10 ,  H05K3/22 ,  H05K5/02 ,  H05K3/28

Abstract: An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.

公开(公告)号：US10306748B2

公开(公告)日：2019-05-28

申请号：US15816877

申请日：2017-11-17

Applicant: Cardiac Pacemakers, Inc.

Inventor： Patrick J. Barry ,  Randy White ,  Troy Anthony Giese ,  James E. Blood ,  Michael J. Lyden ,  Robert M. Mohn

IPC: A61N1/08 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/10 ,  H05K3/32 ,  A61N1/375 ,  H05K3/40 ,  H05K5/02 ,  H05K5/04

Abstract: A filtered feedthrough assembly for an implantable medical device comprises a ferrule, an electrical insulator coupled to the ferrule by a connection element, a plurality of feedthrough conductors extending through the electrical insulator, a printed circuit board (PCB), and plurality of capacitors. The PCB is coupled to the ferrule or the electrical insulator, and includes one or more ground layers and a plurality of vias. The connection element is electrically coupled to the ground layer through the vias. The capacitor has a ground terminal electrically coupled to the ground layer through at least one of the vias, and a conductor terminal electrically coupled to the feedthrough conductor.

公开(公告)号：US20180207428A1

公开(公告)日：2018-07-26

申请号：US15934355

申请日：2018-03-23

Applicant: Cardiac Pacemakers, Inc.

Inventor： Patrick J. Barry ,  Randy White ,  Steven A. Kubow ,  Scott A. Spadgenske ,  David A. Chizek ,  Jerald Sauber

IPC: A61N1/375 ,  H05K3/22 ,  H03H3/00 ,  H03H7/01 ,  H05K1/02 ,  H05K5/02 ,  H05K3/30 ,  H01G4/35 ,  H05K3/10 ,  H05K1/18 ,  H05K3/28

CPC classification number: A61N1/3754 ,  H01G4/35 ,  H03H3/00 ,  H03H7/17 ,  H05K1/0213 ,  H05K1/184 ,  H05K3/10 ,  H05K3/22 ,  H05K3/284 ,  H05K3/303 ,  H05K5/0247 ,  H05K2201/10015 ,  H05K2201/10189 ,  H05K2201/10303

Abstract: An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.

公开(公告)号：US09937354B2

公开(公告)日：2018-04-10

申请号：US15080122

申请日：2016-03-24

Applicant: Cardiac Pacemakers, Inc.

Inventor： Patrick J. Barry ,  Randy White ,  Steven A. Kubow ,  Scott A. Spadgenske ,  David A. Chizek ,  Jerald Sauber

IPC: A61N1/36 ,  A61N1/375 ,  H01G4/35 ,  H03H3/00 ,  H03H7/01 ,  H05K1/02 ,  H05K3/10 ,  H05K3/22 ,  H05K3/30 ,  H05K5/02 ,  H05K1/18 ,  H05K3/28

CPC classification number: A61N1/3754 ,  H01G4/35 ,  H03H3/00 ,  H03H7/17 ,  H05K1/0213 ,  H05K1/184 ,  H05K3/10 ,  H05K3/22 ,  H05K3/284 ,  H05K3/303 ,  H05K5/0247 ,  H05K2201/10015 ,  H05K2201/10189 ,  H05K2201/10303

Abstract: An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.

公开(公告)号：US20170064816A1

公开(公告)日：2017-03-02

申请号：US15347471

申请日：2016-11-09

Applicant: Cardiac Pacemakers, Inc.

Inventor： Patrick J. Barry ,  Randy White ,  Troy Anthony Giese ,  James E. Blood ,  Michael J. Lyden ,  Robert M. Mohn

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/40 ,  A61N1/08 ,  H05K5/04 ,  H05K5/02 ,  A61N1/375 ,  H05K1/11 ,  H05K3/32

Abstract: A filtered feedthrough assembly for an implantable medical device comprises a ferrule, an electrical insulator coupled to the ferrule by a connection element, a plurality of feedthrough conductors extending through the electrical insulator, a printed circuit board (PCB), and plurality of capacitors. The PCB is coupled to the ferrule or the electrical insulator, and includes one or more ground layers and a plurality of vias. The connection element is electrically coupled to the ground layer through the vias. The capacitor has a ground terminal electrically coupled to the ground layer through at least one of the vias, and a conductor terminal electrically coupled to the feedthrough conductor.

Abstract translation: 用于可植入医疗装置的经滤波的馈通组件包括套圈，通过连接元件耦合到套圈的电绝缘体，延伸穿过电绝缘体的多个馈通导体，印刷电路板（PCB）和多个电容器。 PCB耦合到套圈或电绝缘体，并且包括一个或多个接地层和多个通孔。 连接元件通过通孔电耦合到接地层。 电容器具有通过至少一个通孔电耦合到接地层的接地端子，以及电耦合到馈通导体的导体端子。