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公开(公告)号:US20160067504A1
公开(公告)日:2016-03-10
申请号:US14939847
申请日:2015-11-12
IPC分类号: A61N1/372
CPC分类号: A61N1/37229 , A61B5/0031 , H01Q1/273 , H01Q1/36 , H01Q9/0414 , Y10T29/49016
摘要: In an example, an apparatus can include an implantable medical device comprising a housing, an implantable telemetry circuit carried within the housing, a dielectric compartment mechanically coupled to the housing, the dielectric compartment including first and second substantially parallel face portions and a third face portion extending between the first and second face portions, and an implantable telemetry antenna, located at least partially within the dielectric compartment. The implantable telemetry circuit can be electrically coupled to the implantable telemetry antenna and configured to wirelessly transfer information electromagnetically using the implantable telemetry antenna. In an example the implantable telemetry antenna comprises a spiral conductor portion extending along the first, second, and third face portions. In an example the spiral conductor includes a cross section having a lateral width that can be greater than a sidewall height of the cross section.
摘要翻译: 在一个示例中,装置可以包括可植入医疗装置,其包括壳体,在壳体内承载的可植入遥测电路,机械耦合到壳体的电介质隔室,电介质室包括第一和第二基本上平行的面部分和第三面部分 在第一和第二面部之间延伸,以及至少部分地位于电介质隔室内的可植入遥测天线。 可植入遥测电路可以电耦合到可植入遥测天线并且被配置为使用可植入遥测天线以电磁方式无线地传送信息。 在一个示例中,可植入遥测天线包括沿着第一,第二和第三面部分延伸的螺旋导体部分。 在一个示例中,螺旋导体包括具有可以大于横截面的侧壁高度的横向宽度的横截面。
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公开(公告)号:US20140364714A1
公开(公告)日:2014-12-11
申请号:US14297927
申请日:2014-06-06
发明人: Masoud Ameri , Keith R. Maile , James Blilie , David A. Chizek , Brian Allen , Daniel Joseph Landherr , Niharika Varanasi
CPC分类号: A61N1/37229 , A61B5/0031 , A61N1/36125 , A61N1/375 , A61N1/3758
摘要: In general, techniques are described for wirelessly transferring information using an implantable antenna. In one example, an apparatus includes an implantable medical device that includes a housing including an implantable telemetry circuit. The apparatus includes a dielectric compartment, mechanically coupled to the housing and including first and second substantially parallel face portions, and a third face portion extending between the first and second face portions, and an antenna assembly configured to be mechanically attached to the dielectric compartment and configured to be electrically coupled to the implantable telemetry circuit, the antenna assembly includes a spiral conductor comprising first, second, and third spiral conductor portions that extend adjacent the first, second, and third face portions, respectively, of the dielectric compartment, where the first, second, and third spiral conductor portions define an interior region, and where at least a portion of the third spiral conductor portion extends inwardly into the interior region.
摘要翻译: 通常,描述了使用可植入天线无线传送信息的技术。 在一个示例中,装置包括可植入医疗装置,其包括包括可植入遥测电路的壳体。 该设备包括机械耦合到壳体并且包括第一和第二基本平行的面部分的电介质隔室以及在第一和第二面部分之间延伸的第三面部分,以及被配置为机械地连接到电介质隔间的天线组件, 被配置为电耦合到所述可植入遥测电路,所述天线组件包括螺旋导体,所述螺旋导体包括分别延伸到所述电介质隔室的第一,第二和第三面部分的第一,第二和第三螺旋导体部分,其中 第一,第二和第三螺旋导体部分限定内部区域,并且其中第三螺旋导体部分的至少一部分向内延伸到内部区域。
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公开(公告)号:US20170100596A1
公开(公告)日:2017-04-13
申请号:US15286663
申请日:2016-10-06
IPC分类号: A61N1/375 , A61N1/39 , A61N1/362 , H01R13/52 , H01R13/502
CPC分类号: A61N1/3754 , A61N1/362 , A61N1/3752 , A61N1/3956 , H01R13/502 , H01R13/5224
摘要: An apparatus including a header mountable to an implantable housing; and an electrically conductive connector block located within the header, wherein the conductive connector block is formed from a substantially non-metallic material.
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公开(公告)号:US20160287883A1
公开(公告)日:2016-10-06
申请号:US15080122
申请日:2016-03-24
发明人: Patrick J. Barry , Randy White , Steven A. Kubow , Scott A. Spadgenske , David A. Chizek , Jerald Sauber
IPC分类号: A61N1/375 , H05K5/02 , H01G4/35 , H05K3/22 , H03H3/00 , H05K3/30 , H05K3/10 , H05K1/02 , H03H7/01
CPC分类号: A61N1/3754 , H01G4/35 , H03H3/00 , H03H7/17 , H05K1/0213 , H05K1/184 , H05K3/10 , H05K3/22 , H05K3/284 , H05K3/303 , H05K5/0247 , H05K2201/10015 , H05K2201/10189 , H05K2201/10303
摘要: An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.
摘要翻译: 一种用于可植入医疗装置的封装过滤的馈通组件,其包括套圈,耦合到套圈的电绝缘体,印刷电路板(PCB),延伸穿过电绝缘体和PCB的馈通导体以及耦合到PCB的电容器。 封装过滤的馈通组件可以包括限定开口并且相对于印刷电路板定位的模具,使得电容器的至少一部分位于开口内。 第一非导电材料可以对电容器进行底部填充,并且第二非导电材料可以回填到模具中以封装电容器。
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公开(公告)号:US20140243930A1
公开(公告)日:2014-08-28
申请号:US14270132
申请日:2014-05-05
IPC分类号: A61N1/372
CPC分类号: A61N1/37229 , A61B5/0031 , H01Q1/273 , H01Q1/36 , H01Q9/0414 , Y10T29/49016
摘要: In an example, an apparatus can include an implantable medical device comprising a housing, an implantable telemetry circuit carried within the housing, a dielectric compartment mechanically coupled to the housing, the dielectric compartment including first and second substantially parallel face portions and a third face portion extending between the first and second face portions, and an implantable telemetry antenna, located at least partially within the dielectric compartment. The implantable telemetry circuit can be electrically coupled to the implantable telemetry antenna and configured to wirelessly transfer information electromagnetically using the implantable telemetry antenna. In an example the implantable telemetry antenna comprises a spiral conductor portion extending along the first, second, and third face portions. In an example the spiral conductor includes a cross section having a lateral width that can be greater than a sidewall height of the cross section.
摘要翻译: 在一个示例中,装置可以包括可植入医疗装置,其包括壳体,在壳体内承载的可植入遥测电路,机械耦合到壳体的电介质隔室,电介质室包括第一和第二基本上平行的面部分和第三面部分 在第一和第二面部之间延伸,以及至少部分地位于电介质隔室内的可植入遥测天线。 可植入遥测电路可以电耦合到可植入遥测天线并且被配置为使用可植入遥测天线以电磁方式无线地传送信息。 在一个示例中,可植入遥测天线包括沿着第一,第二和第三面部分延伸的螺旋导体部分。 在一个示例中,螺旋导体包括具有可以大于横截面的侧壁高度的横向宽度的横截面。
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公开(公告)号:US09259585B2
公开(公告)日:2016-02-16
申请号:US14270132
申请日:2014-05-05
CPC分类号: A61N1/37229 , A61B5/0031 , H01Q1/273 , H01Q1/36 , H01Q9/0414 , Y10T29/49016
摘要: In an example, an apparatus can include an implantable medical device comprising a housing, an implantable telemetry circuit carried within the housing, a dielectric compartment mechanically coupled to the housing, the dielectric compartment including first and second substantially parallel face portions and a third face portion extending between the first and second face portions, and an implantable telemetry antenna, located at least partially within the dielectric compartment. The implantable telemetry circuit can be electrically coupled to the implantable telemetry antenna and configured to wirelessly transfer information electromagnetically using the implantable telemetry antenna. In an example the implantable telemetry antenna comprises a spiral conductor portion extending along the first, second, and third face portions. In an example the spiral conductor includes a cross section having a lateral width that can be greater than a sidewall height of the cross section.
摘要翻译: 在一个示例中,装置可以包括可植入医疗装置,其包括壳体,在壳体内承载的可植入遥测电路,机械耦合到壳体的电介质隔室,电介质室包括第一和第二基本上平行的面部分和第三面部分 在第一和第二面部之间延伸,以及至少部分地位于电介质隔室内的可植入遥测天线。 可植入遥测电路可以电耦合到可植入遥测天线并且被配置为使用可植入遥测天线以电磁方式无线地传送信息。 在一个示例中,可植入遥测天线包括沿着第一,第二和第三面部分延伸的螺旋导体部分。 在一个示例中,螺旋导体包括具有可以大于横截面的侧壁高度的横向宽度的横截面。
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公开(公告)号:US10828497B2
公开(公告)日:2020-11-10
申请号:US15934355
申请日:2018-03-23
发明人: Patrick J. Barry , Randy White , Steven A. Kubow , Scott A. Spadgenske , David A. Chizek , Jerald Sauber
IPC分类号: H05K3/30 , A61N1/375 , H05K1/18 , H01G4/35 , H03H3/00 , H03H7/01 , H05K1/02 , H05K3/10 , H05K3/22 , H05K5/02 , H05K3/28
摘要: An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.
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公开(公告)号:US20180207428A1
公开(公告)日:2018-07-26
申请号:US15934355
申请日:2018-03-23
发明人: Patrick J. Barry , Randy White , Steven A. Kubow , Scott A. Spadgenske , David A. Chizek , Jerald Sauber
IPC分类号: A61N1/375 , H05K3/22 , H03H3/00 , H03H7/01 , H05K1/02 , H05K5/02 , H05K3/30 , H01G4/35 , H05K3/10 , H05K1/18 , H05K3/28
CPC分类号: A61N1/3754 , H01G4/35 , H03H3/00 , H03H7/17 , H05K1/0213 , H05K1/184 , H05K3/10 , H05K3/22 , H05K3/284 , H05K3/303 , H05K5/0247 , H05K2201/10015 , H05K2201/10189 , H05K2201/10303
摘要: An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.
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公开(公告)号:US20180185658A1
公开(公告)日:2018-07-05
申请号:US15862118
申请日:2018-01-04
发明人: James E. Blood , Scott A. Spadgenske , Doug E. Giwoyna , Lonnie D. Myers , Shawn Larson , David A. Chizek
IPC分类号: A61N1/372 , H01L41/053 , H01L41/047 , H05K1/18 , H05K1/11 , H05K3/00 , H05K3/42 , H01L41/29 , G10K9/122 , A61N1/362 , A61N1/39 , A61N1/08
CPC分类号: A61N1/37258 , A61N1/08 , A61N1/3627 , A61N1/3956 , G10K9/122 , H01L41/0475 , H01L41/0533 , H01L41/29 , H05K1/09 , H05K1/115 , H05K1/183 , H05K1/185 , H05K1/189 , H05K3/0026 , H05K3/422 , H05K2201/10083 , H05K2203/0307 , H05K2203/072 , H05K2203/107 , H05K2203/1469
摘要: This document discusses, among other things, systems and methods related to a flexible circuit buzzer apparatus, such as a buzzer apparatus for use in an implantable medical device. In an example, the buzzer apparatus can include a flexible circuit having a first dielectric layer. A conductive layer can be disposed on the first dielectric layer. A hole can be formed in the first dielectric layer, the conductive layer, or both. A buzzer including a first contact can be located proximate to the hole. A conductive via can be plated or deposited in the hole. At least the first contact can be electrically coupled to the conductive layer by the conductive via.
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公开(公告)号:US10004908B2
公开(公告)日:2018-06-26
申请号:US14939847
申请日:2015-11-12
CPC分类号: A61N1/37229 , A61B5/0031 , H01Q1/273 , H01Q1/36 , H01Q9/0414 , Y10T29/49016
摘要: In an example, an apparatus can include an implantable medical device comprising a housing, an implantable telemetry circuit carried within the housing, a dielectric compartment mechanically coupled to the housing, the dielectric compartment including first and second substantially parallel face portions and a third face portion extending between the first and second face portions, and an implantable telemetry antenna, located at least partially within the dielectric compartment. The implantable telemetry circuit can be electrically coupled to the implantable telemetry antenna and configured to wirelessly transfer information electromagnetically using the implantable telemetry antenna. In an example the implantable telemetry antenna comprises a spiral conductor portion extending along the first, second, and third face portions. In an example the spiral conductor includes a cross section having a lateral width that can be greater than a sidewall height of the cross section.
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