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公开(公告)号：US10046167B2
公开(公告)日：2018-08-14
申请号：US15018379
申请日：2016-02-08
Applicant: CARDIAC PACEMAKERS, INC.
Inventor： Brian L. Schmidt , Bryan J. Swackhamer , Robert A. Jones , Steven A. Kubow
Abstract: An implantable medical device includes a housing. A first ID tag is secured relative to the housing at a first position and defines a first radiopaque manufacturer code section that visually identifies a manufacturer of the implantable medical device. A second ID tag is secured relative to the housing at a second position that is offset from the first position in at least one dimension. The second ID tag defines a second radiopaque manufacturer code section that also visually identifies the manufacturer of the implantable medical device.
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公开(公告)号：US20200016413A1
公开(公告)日：2020-01-16
申请号：US16460627
申请日：2019-07-02
Applicant: Cardiac Pacemakers, Inc.
Inventor： James Blilie , Arthur J. Foster , Jack Gordon , Bruce K. Gilbertson , Steven A. Kubow
Abstract: An implantable medical device includes a housing; and a header mounted to the housing, the header including a header core including a bore with an electrical contact located within the bore, wherein the electrical contact includes: a first longitudinally extending arm cantilever mounted within the bore; and a second longitudinally extending arm cantilever mounted within the bore.
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公开(公告)号：US20180326218A1
公开(公告)日：2018-11-15
申请号：US16042616
申请日：2018-07-23
Applicant: CARDIAC PACEMAKERS, INC.
Inventor： Brian L. Schmidt , Bryan J. Swackhamer , Robert Allen Jones , Steven A. Kubow
Abstract: An implantable medical device includes a housing. A first ID tag is secured relative to the housing at a first position and defines a first radiopaque manufacturer code section that visually identifies a manufacturer of the implantable medical device. A second ID tag is secured relative to the housing at a second position that is offset from the first position in at least one dimension. The second ID tag defines a second radiopaque manufacturer code section that also visually identifies the manufacturer of the implantable medical device.
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公开(公告)号：US20160287883A1
公开(公告)日：2016-10-06
申请号：US15080122
申请日：2016-03-24
Applicant: Cardiac Pacemakers, Inc.
Inventor： Patrick J. Barry , Randy White , Steven A. Kubow , Scott A. Spadgenske , David A. Chizek , Jerald Sauber
IPC: A61N1/375 , H05K5/02 , H01G4/35 , H05K3/22 , H03H3/00 , H05K3/30 , H05K3/10 , H05K1/02 , H03H7/01
CPC classification number: A61N1/3754 , H01G4/35 , H03H3/00 , H03H7/17 , H05K1/0213 , H05K1/184 , H05K3/10 , H05K3/22 , H05K3/284 , H05K3/303 , H05K5/0247 , H05K2201/10015 , H05K2201/10189 , H05K2201/10303
Abstract: An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.
Abstract translation: 一种用于可植入医疗装置的封装过滤的馈通组件，其包括套圈，耦合到套圈的电绝缘体，印刷电路板（PCB），延伸穿过电绝缘体和PCB的馈通导体以及耦合到PCB的电容器。 封装过滤的馈通组件可以包括限定开口并且相对于印刷电路板定位的模具，使得电容器的至少一部分位于开口内。 第一非导电材料可以对电容器进行底部填充，并且第二非导电材料可以回填到模具中以封装电容器。
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公开(公告)号：US20160228716A1
公开(公告)日：2016-08-11
申请号：US15018379
申请日：2016-02-08
Applicant: CARDIAC PACEMAKERS, INC.
Inventor： Brian L. Schmidt , Bryan J. Swackhamer , Robert A. Jones , Steven A. Kubow
Abstract: An implantable medical device includes a housing. A first ID tag is secured relative to the housing at a first position and defines a first radiopaque manufacturer code section that visually identifies a manufacturer of the implantable medical device. A second ID tag is secured relative to the housing at a second position that is offset from the first position in at least one dimension. The second ID tag defines a second radiopaque manufacturer code section that also visually identifies the manufacturer of the implantable medical device.
Abstract translation: 可植入医疗装置包括壳体。 在第一位置处相对于壳体固定第一ID标签，并且限定可视地标识可植入医疗装置的制造商的第一不透射线的制造商代码部分。 第二ID标签相对于在至少一个维度上与第一位置偏移的第二位置相对于壳体固定。 第二ID标签定义了第二不透射线的制造商代码部分，其也可视地识别可植入医疗装置的制造商。
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Patent Agency Ranking
公开(公告)号：US11020600B2
公开(公告)日：2021-06-01
申请号：US16042616
申请日：2018-07-23
Applicant: CARDIAC PACEMAKERS, INC.
Inventor： Brian L. Schmidt , Bryan J. Swackhamer , Robert Allen Jones , Steven A. Kubow
Abstract: An implantable medical device includes a housing. A first ID tag is secured relative to the housing at a first position and defines a first radiopaque manufacturer code section that visually identifies a manufacturer of the implantable medical device. A second ID tag is secured relative to the housing at a second position that is offset from the first position in at least one dimension. The second ID tag defines a second radiopaque manufacturer code section that also visually identifies the manufacturer of the implantable medical device.
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公开(公告)号：US10828497B2
公开(公告)日：2020-11-10
申请号：US15934355
申请日：2018-03-23
Applicant: Cardiac Pacemakers, Inc.
Inventor： Patrick J. Barry , Randy White , Steven A. Kubow , Scott A. Spadgenske , David A. Chizek , Jerald Sauber
IPC: H05K3/30 , A61N1/375 , H05K1/18 , H01G4/35 , H03H3/00 , H03H7/01 , H05K1/02 , H05K3/10 , H05K3/22 , H05K5/02 , H05K3/28
Abstract: An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.
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公开(公告)号：US10828496B2
公开(公告)日：2020-11-10
申请号：US16460627
申请日：2019-07-02
Applicant: Cardiac Pacemakers, Inc.
Inventor： James Blilie , Arthur J. Foster , Jack Gordon , Bruce K. Gilbertson , Steven A. Kubow
Abstract: An implantable medical device includes a housing; and a header mounted to the housing, the header including a header core including a bore with an electrical contact located within the bore, wherein the electrical contact includes: a first longitudinally extending arm cantilever mounted within the bore; and a second longitudinally extending arm cantilever mounted within the bore.
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公开(公告)号：US20180207428A1
公开(公告)日：2018-07-26
申请号：US15934355
申请日：2018-03-23
Applicant: Cardiac Pacemakers, Inc.
Inventor： Patrick J. Barry , Randy White , Steven A. Kubow , Scott A. Spadgenske , David A. Chizek , Jerald Sauber
IPC: A61N1/375 , H05K3/22 , H03H3/00 , H03H7/01 , H05K1/02 , H05K5/02 , H05K3/30 , H01G4/35 , H05K3/10 , H05K1/18 , H05K3/28
CPC classification number: A61N1/3754 , H01G4/35 , H03H3/00 , H03H7/17 , H05K1/0213 , H05K1/184 , H05K3/10 , H05K3/22 , H05K3/284 , H05K3/303 , H05K5/0247 , H05K2201/10015 , H05K2201/10189 , H05K2201/10303
Abstract: An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.
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公开(公告)号：US09937354B2
公开(公告)日：2018-04-10
申请号：US15080122
申请日：2016-03-24
Applicant: Cardiac Pacemakers, Inc.
Inventor： Patrick J. Barry , Randy White , Steven A. Kubow , Scott A. Spadgenske , David A. Chizek , Jerald Sauber
IPC: A61N1/36 , A61N1/375 , H01G4/35 , H03H3/00 , H03H7/01 , H05K1/02 , H05K3/10 , H05K3/22 , H05K3/30 , H05K5/02 , H05K1/18 , H05K3/28
CPC classification number: A61N1/3754 , H01G4/35 , H03H3/00 , H03H7/17 , H05K1/0213 , H05K1/184 , H05K3/10 , H05K3/22 , H05K3/284 , H05K3/303 , H05K5/0247 , H05K2201/10015 , H05K2201/10189 , H05K2201/10303
Abstract: An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.
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