公开(公告)号：US08789129B2

公开(公告)日：2014-07-22

申请号：US12498371

申请日：2009-07-07

Applicant: Chien-Tsuen Liu ,  Yung-Chih Lin

Inventor： Chien-Tsuen Liu ,  Yung-Chih Lin

IPC: H04N7/16 ,  H04N7/173 ,  H04N5/445 ,  H04N21/44 ,  H04N21/41 ,  H04N21/47 ,  H04N21/462 ,  G10L15/26

CPC classification number: H04N5/445 ,  G10L15/26 ,  H04N21/4113 ,  H04N21/44008 ,  H04N21/4622 ,  H04N21/47

Abstract: In the specification and drawing a television is described and shown with a multimedia player for playing information, a grabber for producing a word from the information and a controller for controlling a computer to search for data related to the word. Moreover, a method for operating the television is also disclosed in the specification and drawing.

Abstract translation: 在说明书和绘图中，描述和显示电视机，用于播放信息的多媒体播放器，用于从信息产生单词的抓取器和用于控制计算机搜索与该单词有关的数据的控制器。 此外，在说明书和附图中还公开了一种操作电视机的方法。

公开(公告)号：USD693934S1

公开(公告)日：2013-11-19

申请号：US29453199

申请日：2013-04-26

Applicant: Yung-Chih Lin

Designer： Yung-Chih Lin

公开(公告)号：US20110221059A1

公开(公告)日：2011-09-15

申请号：US12825513

申请日：2010-06-29

Applicant: Fu-Di Tang ,  Ching-Chiuan Wei ,  Yung-Chih Lin

Inventor： Fu-Di Tang ,  Ching-Chiuan Wei ,  Yung-Chih Lin

IPC: H01L23/49 ,  H01L21/60

CPC classification number: H01L24/97 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/131 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85001 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A QFN package includes a chip-mounting base; electrically connecting pads disposed around the periphery of the chip-mounting base, the bottom surfaces of the chip-mounting base and the electrically connecting pads being covered by a copper layer; a chip mounted on the top surface of the chip-mounting base; bonding wires electrically connecting to the chip and the electrically connecting pads; an encapsulant encapsulating the chip-mounting base, the electrically connecting pads, the chip and the bonding wires while exposing the copper layer; and a dielectric layer formed on the bottom surfaces of the encapsulant and the copper layer and having a plurality of openings exposing a portion of the copper layer. The copper layer has good bonding with the dielectric layer that helps to prevent solder material in a reflow process from permeating into the interface between the chip-mounting base, the electrically connecting pads and the dielectric layer, thereby avoiding solder extrusion and enhancing product yield.

Abstract translation: QFN封装包括芯片安装基座; 设置在芯片安装基座的周边周围的电连接焊盘，芯片安装基座的底面和电连接焊盘被铜层覆盖; 安装在芯片安装基座的顶表面上的芯片; 电连接到芯片和电连接焊盘的接合线; 在暴露铜层的同时封装芯片安装基座，电连接焊盘，芯片和接合线的密封剂; 以及形成在密封剂和铜层的底表面上并且具有暴露铜层的一部分的多个开口的电介质层。 铜层与电介质层具有良好的结合，有助于防止回流工艺中的焊料渗透到芯片安装基座，电连接焊盘和电介质层之间的界面，从而避免焊料挤出并提高产品产量。

公开(公告)号：US20110221049A1

公开(公告)日：2011-09-15

申请号：US12843440

申请日：2010-07-26

Applicant: Fu-Di Tang ,  Ching-Chiuan Wei ,  Yung-Chih Lin

Inventor： Fu-Di Tang ,  Ching-Chiuan Wei ,  Yung-Chih Lin

IPC: H01L23/495 ,  H01L21/56

CPC classification number: H01L21/561 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49582 ,  H01L23/552 ,  H01L24/89 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A Quad Flat No-Lead (QFN) semiconductor package includes a die pad; I/O connections disposed at the periphery of the die pad; a chip mounted on the die pad; bonding wires; an encapsulant for encapsulating the die pad, the I/O connections, the chip and the bonding wires while exposing the bottom surfaces of the die pad and the I/O connections; a surface layer formed on the bottoms surfaces of the die pad and the I/O connections; a dielectric layer formed on the bottom surfaces of the encapsulant and the surface layer and having openings for exposing the surface layer. The surface layer has good bonding with the dielectric layer that helps to prevent solder material in a reflow process from permeating into the die pad and prevent solder extrusion on the interface of the I/O connections and the dielectric layer, thereby increasing product yield.

Abstract translation: 四通道扁平无引线（QFN）半导体封装包括管芯焊盘; 设置在管芯焊盘周边的I / O连接; 安装在芯片焊盘上的芯片; 接合线; 用于封装芯片焊盘的密封剂，I / O连接，芯片和接合线，同时暴露管芯焊盘的底表面和I / O连接; 形成在管芯焊盘的底部表面上的表面层和I / O连接; 形成在密封剂和表面层的底表面上并具有用于暴露表面层的开口的电介质层。 表面层与电介质层具有良好的结合，有助于防止回流工艺中的焊料渗透到芯片焊盘中并防止焊料挤出在I / O连接和电介质层的界面上，从而提高产品产量。

公开(公告)号：US20110037896A1

公开(公告)日：2011-02-17

申请号：US12844846

申请日：2010-07-28

Applicant: Yung-Chih Lin ,  Po-Hsu Chen

Inventor： Yung-Chih Lin ,  Po-Hsu Chen

IPC: H04N5/445 ,  G09G5/00

CPC classification number: H04N5/44513 ,  G06F3/14 ,  G06F3/1423 ,  G09G5/14 ,  G09G2310/0232 ,  G09G2340/0407 ,  G09G2340/0442 ,  H04N21/42204 ,  H04N21/4316 ,  H04N21/440263 ,  H04N21/4438 ,  H04N21/488 ,  H04N21/8126 ,  H04N21/8173

Abstract: An electronic device for simultaneously displaying a widget window and a video signal in a display device includes a dividing unit for dividing a display area of the display device into a major display area and a minor display area, a first display unit for scaling the video signal to completely display the video signal in the major display area, and a second display unit for displaying the widget window in the minor display area.

Abstract translation: 一种用于在显示装置中同时显示小窗口窗口和视频信号的电子设备包括：分割单元，用于将显示设备的显示区域划分为主要显示区域和次要显示区域;第一显示单元，用于缩放视频信号 以在主显示区域中完全显示视频信号，以及用于在小显示区域中显示小窗口窗口的第二显示单元。