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公开(公告)号：US20100116893A1
公开(公告)日：2010-05-13
申请号：US12506367
申请日：2009-07-21
Applicant: Jiun-Jang Yu , Hsin-Hsien Yeh , Hong-Ching Lin , Chiung-Hsiung Chen
Inventor： Jiun-Jang Yu , Hsin-Hsien Yeh , Hong-Ching Lin , Chiung-Hsiung Chen
IPC: G06K19/06
CPC classification number: G06K19/07749 , G06K19/0775
Abstract: A radio frequency identification (RFID) tag including a substrate, an RFID chip, a chip contact part, a folding circuit and a radiation part is provided. The chip contact part is formed on the substrate and electrically coupled to the RFID chip. The folding circuit is formed on the substrate and electrically coupled to the chip contact part. The folding circuit has a winding part, which forms a hollow region, for compensating the antenna electric length. The radiation part is formed on the substrate and electrically coupled to the folding circuit, wherein one terminal of the winding part of the folding circuit is open, and the other terminal is electrically coupled to the radiation part. At least one of the folding circuit and the radiation part is asymmetric to the chip contact part.
Abstract translation: 提供了包括基板，RFID芯片，芯片接触部件，折叠电路和辐射部件的射频识别（RFID）标签。 芯片接触部分形成在基板上并电耦合到RFID芯片。 折叠电路形成在基板上并电耦合到芯片接触部分。 折叠电路具有绕组部分，其形成中空区域，用于补偿天线电长度。 辐射部分形成在基板上并电耦合到折叠电路，其中折叠电路的绕组部分的一个端子是开放的，另一个端子电耦合到辐射部分。 折叠电路和辐射部分中的至少一个与芯片接触部分不对称。
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公开(公告)号：US20070054112A1
公开(公告)日：2007-03-08
申请号：US11552534
申请日：2006-10-25
Applicant: Ying-Chang Houng , Hong-Ching Lin , Chi-Jen Shih , Shao-Ju Shih
Inventor： Ying-Chang Houng , Hong-Ching Lin , Chi-Jen Shih , Shao-Ju Shih
CPC classification number: C23C18/06 , C23C18/08 , H05K1/097 , H05K3/105 , Y10T428/256
Abstract: Methods for forming conductive layers. A layer of metal composite is applied on a substrate, comprising a plurality of metal flakes, a plurality of nanometer metal spheres, and a plurality of mixed metal precursors. The plurality of mixed metal precursors comprises a mixture of inorganic salts and organic acidic salts. The layer of metal composite is cured to induce an exothermic reaction, thereby forming a conductive layer on the substrate at a relatively low temperature (
Abstract translation: 形成导电层的方法。 将金属复合材料层施加在基板上，包括多个金属薄片，多个纳米金属球体和多个混合金属前体。 多种混合金属前体包括无机盐和有机酸性盐的混合物。 固化该金属复合层以引起放热反应，从而在较低温度（<200℃）下在基板上形成导电层。
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公开(公告)号：US06384705B1
公开(公告)日：2002-05-07
申请号：US09476432
申请日：1999-12-30
Applicant: Yu-Ting Huang , Wen-Song Ko , Mean-Jue Tung , Hong-Ching Lin , Li-Jiun Wang
Inventor： Yu-Ting Huang , Wen-Song Ko , Mean-Jue Tung , Hong-Ching Lin , Li-Jiun Wang
IPC: H01F500
CPC classification number: H01F17/0013 , H01F2017/0026 , H01F2017/0093 , H03H7/427 , H03H2001/0085
Abstract: A miniaturized common mode EMI filter with a greatly simplified design so that it can be manufactured very economically. The common mode filter includes: (a) a magnetic main body; (b) a pair of substantially identical electrically conductive planar coils embedded in the magnetic main body; and (c) an insulative planar coil sandwiched between the pair of electrically conductive planar coils, wherein the insulative planar coil has a pattern that is substantially identical to and inclusive of the pattern of the electrically conductive planar coils so as to insulate the pair of electrically conductive planar coil from each other. The common mode filter retains low normal mode impedance and high common mode impedance, with a substantially reduced physical size, so that it can cost-effectively maintain a high fidelity of the normal mode waveform of signals for electronic devices that utilize differential transmission technology and keep the common mode EMI noise to a minimum.
Abstract translation: 一种小型化的共模EMI滤波器，其设计大大简化，可以非常经济地制造。 共模滤波器包括：（a）磁性主体; （b）嵌入在磁性主体中的一对基本相同的导电平面线圈; 和（c）夹在所述一对导电平面线圈之间的绝缘平面线圈，其中所述绝缘平面线圈具有与所述导电平面线圈的图案基本相同并且包括所述导电平面线圈的图案的图案，以使所述一对电气 导电平面线圈彼此。 共模滤波器保持低正常模式阻抗和高共模阻抗，物理尺寸大大降低，从而可以以低成本的方式保持利用差分传输技术的电子设备信号的正常模式波形的高保真度并保持 将共模EMI噪声降至最低。
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公开(公告)号：US09019678B2
公开(公告)日：2015-04-28
申请号：US13587005
申请日：2012-08-16
Applicant: Hsin-Hsien Yeh , Hong-Ching Lin , Tsung-Wen Chen , Wen-Hao Deng
Inventor： Hsin-Hsien Yeh , Hong-Ching Lin , Tsung-Wen Chen , Wen-Hao Deng
IPC: H02H5/04 , H02H3/20 , H02H7/18 , H01H85/00 , H01M10/44 , H01M10/48 , H02H3/08 , H02H9/02 , H01H85/10 , H01H85/12
CPC classification number: H02H3/202 , H01H85/0039 , H01H85/10 , H01H85/12 , H01M10/446 , H01M10/486 , H02H7/18
Abstract: A protection component includes: a package substrate; a first fuse unit disposed in the package substrate, having a first fusing region; a second fuse unit disposed in the package substrate, having a second fusing region which is close to the first fusing region; and a first buried cave disposed in the package substrate corresponding to the first and second fusing regions. When one of the first and second fusing regions is blown out, the first buried cave assists energy of fuse melting to break the other of the first and second fusing regions.
Abstract translation: 保护部件包括：封装基板; 布置在所述封装衬底中的第一熔丝单元，具有第一熔化区域; 设置在所述封装基板中的第二熔丝单元，具有靠近所述第一熔融区域的第二熔融区域; 以及设置在与第一和第二熔融区域相对应的封装衬底中的第一掩埋洞穴。 当第一熔融区域和第二熔融区域中的一个被吹出时，第一掩埋洞穴帮助熔丝熔化的能量破坏第一和第二熔融区域中的另一个。
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Patent Agency Ranking
公开(公告)号：US08582307B2
公开(公告)日：2013-11-12
申请号：US12948280
申请日：2010-11-17
Applicant: Jiun-Jang Yu , Hsin-Hsien Yeh , Hong-Ching Lin
Inventor： Jiun-Jang Yu , Hsin-Hsien Yeh , Hong-Ching Lin
IPC: H05K1/14
CPC classification number: H01Q1/22
Abstract: A wireless communication apparatus in one embodiment includes a bag body and a radio frequency device. The bag body has at least a first slot, which extends to an edge of the bag body. The radio frequency device including a wireless integrated circuit chip is for radio-frequency signal transmission or receiving, and is disposed across a portion of the first slot and coupled to two connection ends of the bag body so that the bag body between the two connection ends serves as an inductance circuit. The inductance circuit of the two connection ends of the bag body is based on metallic material. An impedance of the inductance circuit is for conjugate matching with that of the radio frequency device and is determined according to a plurality of geometric parameters including: a distance from the edge to the wireless integrated circuit chip, and size of the first slot.
Abstract translation: 一个实施例中的无线通信装置包括袋体和射频装置。 袋体具有至少第一槽，其延伸到袋体的边缘。 包括无线集成电路芯片的无线电频率设备用于射频信号传输或接收，并且布置在第一槽的一部分上并且耦合到袋体的两个连接端，使得袋体在两个连接端之间 用作电感电路。 袋体的两个连接端的电感电路基于金属材料。 电感电路的阻抗用于与射频设备的共轭匹配，并且根据多个几何参数来确定，包括：从边缘到无线集成电路芯片的距离以及第一时隙的大小。
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公开(公告)号：US08042744B2
公开(公告)日：2011-10-25
申请号：US12506367
申请日：2009-07-21
Applicant: Jiun-Jang Yu , Hsin-Hsien Yeh , Hong-Ching Lin , Chiung-Hsiung Chen
Inventor： Jiun-Jang Yu , Hsin-Hsien Yeh , Hong-Ching Lin , Chiung-Hsiung Chen
CPC classification number: G06K19/07749 , G06K19/0775
Abstract: A radio frequency identification (RFID) tag including a substrate, an RFID chip, a chip contact part, a folding circuit and a radiation part is provided. The chip contact part is formed on the substrate and electrically coupled to the RFID chip. The folding circuit is formed on the substrate and electrically coupled to the chip contact part. The folding circuit has a winding part, which forms a hollow region, for compensating the antenna electric length. The radiation part is formed on the substrate and electrically coupled to the folding circuit, wherein one terminal of the winding part of the folding circuit is open, and the other terminal is electrically coupled to the radiation part. At least one of the folding circuit and the radiation part is asymmetric to the chip contact part.
Abstract translation: 提供了包括基板，RFID芯片，芯片接触部件，折叠电路和辐射部件的射频识别（RFID）标签。 芯片接触部分形成在基板上并电耦合到RFID芯片。 折叠电路形成在基板上并电耦合到芯片接触部分。 折叠电路具有绕组部分，其形成中空区域，用于补偿天线电长度。 辐射部分形成在基板上并电耦合到折叠电路，其中折叠电路的绕组部分的一个端子是开放的，另一个端子电耦合到辐射部分。 折叠电路和辐射部分中的至少一个与芯片接触部分不对称。
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公开(公告)号：US20110134622A1
公开(公告)日：2011-06-09
申请号：US12948280
申请日：2010-11-17
Applicant: Jiun-Jang Yu , Hsin-Hsien Yeh , Hong-Ching Lin
Inventor： Jiun-Jang Yu , Hsin-Hsien Yeh , Hong-Ching Lin
IPC: H05K5/02
CPC classification number: H01Q1/22
Abstract: A wireless communication apparatus in one embodiment includes a bag body and a radio frequency device. The bag body has at least a first slot, which extends to an edge of the bag body. The radio frequency device including a wireless integrated circuit chip is for radio-frequency signal transmission or receiving, and is disposed across a portion of the first slot and coupled to two connection ends of the bag body so that the bag body between the two connection ends serves as an inductance circuit. The inductance circuit of the two connection ends of the bag body is based on metallic material. An impedance of the inductance circuit is for conjugate matching with that of the radio frequency device and is determined according to a plurality of geometric parameters including: a distance from the edge to the wireless integrated circuit chip, and size of the first slot.
Abstract translation: 一个实施例中的无线通信装置包括袋体和射频装置。 袋体具有至少第一槽，其延伸到袋体的边缘。 包括无线集成电路芯片的无线电频率设备用于射频信号传输或接收，并且布置在第一槽的一部分上并且耦合到袋体的两个连接端，使得袋体在两个连接端之间 用作电感电路。 袋体的两个连接端的电感电路基于金属材料。 电感电路的阻抗用于与射频设备的共轭匹配，并且根据多个几何参数来确定，包括：从边缘到无线集成电路芯片的距离以及第一时隙的大小。
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公开(公告)号：US20080183407A1
公开(公告)日：2008-07-31
申请号：US11964647
申请日：2007-12-26
Applicant: Hsin-Hsien Yeh , Ying-Chang Hung , Hong-Ching Lin
Inventor： Hsin-Hsien Yeh , Ying-Chang Hung , Hong-Ching Lin
CPC classification number: G06K7/0008 , G06K7/10217
Abstract: The invention provides a system and method for testing the power intensity of RFID tags. The method is applicable to the system for testing power intensity, which comprises a RFID reading device, a signal transmitting device electrically coupled to the RFID reading device, a signal separating device electrically coupled to the signal transmitting device and a control analysis device electrically coupled to the signal separating device. The system is applicable to a RFID tag or a test object attached with a RFID tag in a non-shielded or shielded room.
Abstract translation: 本发明提供了一种用于测试RFID标签的功率强度的系统和方法。 该方法适用于用于测试功率强度的系统，其包括RFID读取装置，电耦合到RFID读取装置的信号发送装置，电耦合到信号发送装置的信号分离装置和电耦合到 信号分离装置。 该系统适用于在非屏蔽或屏蔽的房间中附着有RFID标签的RFID标签或测试对象。
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公开(公告)号：US07135394B2
公开(公告)日：2006-11-14
申请号：US11002509
申请日：2004-12-02
Applicant: Ying-Chang Houng , Hong-Ching Lin , Chi-Jen Shih , Shao-Ju Shih
Inventor： Ying-Chang Houng , Hong-Ching Lin , Chi-Jen Shih , Shao-Ju Shih
IPC: H01L21/44
CPC classification number: C23C18/06 , C23C18/08 , H05K1/097 , H05K3/105 , Y10T428/256
Abstract: Methods for forming conductive layers. A layer of metal composite is applied on a substrate, comprising a plurality of metal flakes, a plurality of nanometer metal spheres, and a plurality of mixed metal precursors. The plurality of mixed metal precursors comprises a mixture of inorganic salts and organic acidic salts. The layer of metal composite is cured to induce an exothermic reaction, thereby forming a conductive layer on the substrate at a relatively low temperature (
Abstract translation: 形成导电层的方法。 将金属复合材料层施加在基板上，包括多个金属薄片，多个纳米金属球体和多个混合金属前体。 多种混合金属前体包括无机盐和有机酸性盐的混合物。 金属复合材料层被固化以引起放热反应，从而在相对低的温度（<200℃）下在基板上形成导电层，
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