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公开(公告)号：US11838060B2
公开(公告)日：2023-12-05
申请号：US17502848
申请日：2021-10-15
Applicant: Cisco Technology, Inc.
Inventor： Joel Richard Goergen , Charles Calvin Byers , Robert Gregory Twiss , D. Brice Achkir , Chad M. Jones
IPC: H04B10/80 , G02B6/42 , H04L12/40 , H04M19/08 , H04L12/12 , H04L12/10 , H02J50/80 , H02J50/30 , G02B6/38 , H02S40/38 , G01J3/02
CPC classification number: H04B10/807 , G02B6/4293 , H02J50/30 , H02J50/80 , H04L12/10 , H04L12/12 , H04L12/40045 , H04L12/40091 , H04L12/40176 , H04M19/08 , G01J3/0218 , G02B6/3817 , H02S40/38
Abstract: In one embodiment, a method includes receiving power delivered over a data fiber cable at an optical transceiver installed at a network communications device and transmitting data and the power from the optical transceiver to the network communications device. The network communications device is powered by the power received from the optical transceiver. An apparatus is also disclosed herein.
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公开(公告)号：US11589481B2
公开(公告)日：2023-02-21
申请号：US16993885
申请日：2020-08-14
Applicant: Cisco Technology, Inc.
Inventor： Rohit Dev Gupta , Robert Gregory Twiss
IPC: H05K7/20
Abstract: A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes a mating surface. The TIM includes a first surface that is coupled to the mating surface and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a shape memory alloy (SMA) element. When the SMA element is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the SMA element moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.
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公开(公告)号：US10813248B2
公开(公告)日：2020-10-20
申请号：US16184550
申请日：2018-11-08
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Rohit Dev Gupta , Robert Gregory Twiss
IPC: H05K7/20
Abstract: In one embodiment, an apparatus includes a fan for cooling electronics within a chassis, the fan comprising a rotor with a plurality of fan blades connected thereto for generating an axial airflow during operation of the fan, a sensor for detecting failure of the fan, and an airflow blocking device positioned at an exhaust side of the fan and configured to prevent airflow through the fan upon detection of the fan failure, wherein the airflow blocking device is stowed in a position removed from a path of the axial airflow generated by the fan during operation of the fan. A method for preventing airflow recirculation at a failed fan is also disclosed herein.
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公开(公告)号：US10734306B2
公开(公告)日：2020-08-04
申请号：US16137650
申请日：2018-09-21
Applicant: Cisco Technology, Inc.
Inventor： Vic Chia , Hong Huynh , Steven A. Hanssen , Robert Gregory Twiss
Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.
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15.发明申请公开(公告)号：US20200221596A1
公开(公告)日：2020-07-09
申请号：US16819399
申请日：2020-03-16
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Rohit Dev Gupta , Joel Richard Goergen , Sarma VMK Vedhanabhatla , Damaruganath Pinjala , Jatin Kohli , Robert Gregory Twiss
Abstract: In one embodiment, a method includes receiving an indication at a modular electronic system of initiation of online removal for a module removably inserted into a slot of the modular electronic system, increasing a fan speed at the modular electronic system before the module is removed, monitoring an internal temperature at the modular electronic system, and providing an indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on the temperature monitoring. A panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system. An apparatus and logic are also disclosed herein.
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Patent Agency Ranking
公开(公告)号：US10601658B2
公开(公告)日：2020-03-24
申请号：US14681651
申请日：2015-04-08
Applicant: Cisco Technology, Inc.
Inventor： Robert Gregory Twiss
Abstract: A system of maintaining consumable physical components of networking equipment includes a physical network operations controller, having a controller and an interconnected memory device, which is configured to communicate with at least one notification device and consumable physical components for networking equipment. The controller is configured to: obtain and store current operating status data for the plurality of consumable physical components; generate historical operating status data, heuristic maintenance model data and maintenance schedule data for the plurality of consumable physical components; determine that at least one maintenance event trigger criteria is met by at least one of the consumable physical components; generate a maintenance event notification and transmit the maintenance event notification to the notification device; and transmit to the consumable physical components maintenance action data indicating at least one of the maintenance actions to be performed based on the maintenance event trigger criteria being met.
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公开(公告)号：US10541758B2
公开(公告)日：2020-01-21
申请号：US15707976
申请日：2017-09-18
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Joel Richard Goergen , Charles Calvin Byers , Robert Gregory Twiss , D. Brice Achkir , Chad M. Jones
IPC: H04B10/80 , H02J50/80 , H02J50/30 , G02B6/42 , H04L12/10 , H04L12/12 , H04L12/40 , H04M19/08 , H02S40/38 , G01J3/02 , G02B6/38
Abstract: In one embodiment, a method includes receiving power delivered over a data fiber cable at an optical transceiver installed at a network communications device and transmitting data and the power from the optical transceiver to the network communications device. The network communications device is powered by the power received from the optical transceiver. An apparatus is also disclosed herein.
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公开(公告)号：US20190304630A1
公开(公告)日：2019-10-03
申请号：US15942015
申请日：2018-03-30
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Joel Richard Goergen , Charles Calvin Byers , Robert Gregory Twiss , D. Brice Achkir
Abstract: In one embodiment, an apparatus includes an interface module for coupling a cable delivering combined power, data, and cooling to a network device. The interface module includes an electrical interface for receiving power for powering the network device, an optical transceiver for receiving optical communications signals, a fluid interface for receiving coolant, and sensors for monitoring the power and cooling and providing information to a central network device delivering the combined power, data, and cooling.
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公开(公告)号：US20190027422A1
公开(公告)日：2019-01-24
申请号：US16137650
申请日：2018-09-21
Applicant: Cisco Technology, Inc.
Inventor： Vic Chia , Hong Huynh , Steven A. Hanssen , Robert Gregory Twiss
CPC classification number: H01L23/4006 , F16B5/0266 , H01L2023/4081 , H01L2023/4087
Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.
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20.发明申请公开(公告)号：US20190008066A1
公开(公告)日：2019-01-03
申请号：US15639968
申请日：2017-06-30
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Rohit Dev Gupta , Joel Richard Goergen , Sarma VMK Vedhanabhatla , Damaruganath Pinjala , Jatin Kohli , Robert Gregory Twiss
Abstract: In one embodiment, a method includes receiving an indication at a modular electronic system of initiation of online removal for a module removably inserted into a slot of the modular electronic system, increasing a fan speed at the modular electronic system before the module is removed, monitoring an internal temperature at the modular electronic system, and providing an indication that the module is ready for removal upon reaching a specified cooling state at the modular electronic system based on the temperature monitoring. A panel on an adjacent module is opened and extends into the slot upon removal of the module to substantially block airflow bypass from the slot and maintain cooling within the modular electronic system. An apparatus and logic are also disclosed herein.
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