Method for forming metrology structures from fins in integrated circuitry
    16.
    发明授权
    Method for forming metrology structures from fins in integrated circuitry 有权
    用于在集成电路中从散热片形成计量结构的方法

    公开(公告)号:US08486769B2

    公开(公告)日:2013-07-16

    申请号:US12949881

    申请日:2010-11-19

    IPC分类号: H01L29/66

    CPC分类号: H01L21/845 H01L21/823431

    摘要: A method for forming a plurality of fins on a semiconductor substrate includes depositing a spacer layer to fill in gaps between the plurality of fins, the fins comprising a first material and the spacer layer comprising a second material. A first area is defined where the fins need to be broadened and a second area is defined where the fins do not need to be broadened. The method also includes patterning the spacer layer to remove spacers in the first area where the fins need to be broadened and applying an epitaxy process at a predetermined rate to grow a layer of the first material on fins in the first area. The spacer layer is removed in the second area where the fins do not need broadening.

    摘要翻译: 在半导体衬底上形成多个散热片的方法包括沉积间隔层以填充多个散热片之间的间隙,散热片包括第一材料,间隔层包括第二材料。 限定翅片需要扩大的第一区域,并且限定翅片不需要扩大的第二区域。 该方法还包括图案化间隔层以去除第一区域中的间隔物,其中翅片需要变宽,并以预定的速率施加外延过程,以在第一区域的翅片上生长第一材料的层。 在翅片不需要加宽的第二区域中移除间隔层。

    METHOD FOR FORMING METROLOGY STRUCTURES FROM FINS IN INTEGRATED CIRCUITRY
    17.
    发明申请
    METHOD FOR FORMING METROLOGY STRUCTURES FROM FINS IN INTEGRATED CIRCUITRY 有权
    在集成电路中形成FINS的计量结构的方法

    公开(公告)号:US20120126375A1

    公开(公告)日:2012-05-24

    申请号:US12949881

    申请日:2010-11-19

    IPC分类号: H01L29/06 H01L21/20

    CPC分类号: H01L21/845 H01L21/823431

    摘要: A method for forming a plurality of fins on a semiconductor substrate includes depositing a spacer layer to fill in gaps between the plurality of fins, the fins comprising a first material and the spacer layer comprising a second material. A first area is defined where the fins need to be broadened and a second area is defined where the fins do not need to be broadened. The method also includes patterning the spacer layer to remove spacers in the first area where the fins need to be broadened and applying an epitaxy process at a predetermined rate to grow a layer of the first material on fins in the first area. The spacer layer is removed in the second area where the fins do not need broadening.

    摘要翻译: 在半导体衬底上形成多个散热片的方法包括沉积间隔层以填充多个散热片之间的间隙,散热片包括第一材料,间隔层包括第二材料。 限定翅片需要扩大的第一区域,并且限定翅片不需要扩大的第二区域。 该方法还包括图案化间隔层以去除第一区域中的间隔物,其中翅片需要变宽,并以预定的速率施加外延过程,以在第一区域的翅片上生长第一材料的层。 在翅片不需要加宽的第二区域中移除间隔层。