公开(公告)号：US10685895B2

公开(公告)日：2020-06-16

申请号：US16261012

申请日：2019-01-29

Applicant: DELTA ELECTRONICS, INC.

Inventor： Pengkai Ji ,  Shouyu Hong ,  Zhenqing Zhao ,  Jianhong Zeng

IPC: H05K1/02 ,  H05K5/00 ,  H05K9/00 ,  H01L23/34 ,  H01L23/36 ,  H01L23/58 ,  H01L23/66 ,  H01L23/367 ,  H01L29/82 ,  H01L51/52 ,  H01L23/31 ,  H01L21/56 ,  H01L23/433 ,  H01L23/498 ,  H01L23/492 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/40

Abstract: The present invention provides a power module and a manufacturing method thereof. The power module includes a carrier board and a lead component stacked relative to the carrier board. The lead component includes an initial plane, plural first pins and plural second pin. The initial plane includes a vertical projection overlapping with the carrier board. The first pins are electrically connected to the carrier board and vertical to the initial plane. The second pins are electrically connected to the carrier board and vertical to the initial plane. An isolation gap is disposed in the initial plane and located between the first pins and the second pins. The initial plane is separated into a first plane and a second plane by the isolation gap, so as to electrically isolate the first pins and the second pins from each other.

公开(公告)号：US10447166B2

公开(公告)日：2019-10-15

申请号：US15819507

申请日：2017-11-21

Applicant: DELTA ELECTRONICS, INC.

Inventor： Jianhong Zeng ,  Haoyi Ye ,  Peiqing Hu ,  Pengkai Ji

IPC: H02M3/00 ,  H02M3/335 ,  H05K1/14 ,  G09G1/00 ,  H02M3/158 ,  H02M7/04 ,  H02M7/49 ,  H02M1/42 ,  G06F1/20 ,  G06F1/26 ,  H02M1/00 ,  H05K1/02

Abstract: A power module includes a circuit board and a load group. The load group is installed on the circuit board. The load group includes a first-stage power conversion circuit, a second-stage power conversion circuit and plural loads. The first-stage power conversion circuit converts an input voltage into a transition voltage. The second-stage power conversion circuit converts the transition voltage into a driving voltage. A rated value of the first input voltage is higher than twice a rated value of the transition voltage. A rated value of the driving voltage is lower than a half of the rated value of the transition voltage. The distance between the input terminal of the second-stage power conversion circuit and the output terminal of the first-stage power conversion circuit is smaller than the distance between the input terminal of the first-stage power conversion circuit and each edge of the circuit board.

公开(公告)号：US20190157175A1

公开(公告)日：2019-05-23

申请号：US16261012

申请日：2019-01-29

Applicant: DELTA ELECTRONICS, INC.

Inventor： Pengkai Ji ,  Shouyu Hong ,  Zhenqing Zhao ,  Jianhong Zeng

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/433 ,  H01L23/492 ,  H05K3/40 ,  H01L21/56 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K3/30

Abstract: The present invention provides a power module and a manufacturing method thereof. The power module includes a carrier board and a lead component stacked relative to the carrier board. The lead component includes an initial plane, plural first pins and plural second pin. The initial plane includes a vertical projection overlapping with the carrier board. The first pins are electrically connected to the carrier board and vertical to the initial plane. The second pins are electrically connected to the carrier board and vertical to the initial plane. An isolation gap is disposed in the initial plane and located between the first pins and the second pins. The initial plane is separated into a first plane and a second plane by the isolation gap, so as to electrically isolate the first pins and the second pins from each other.

公开(公告)号：US20180122562A1

公开(公告)日：2018-05-03

申请号：US15784864

申请日：2017-10-16

Applicant: DELTA ELECTRONICS, INC.

Inventor： Pengkai Ji ,  Jinping Zhou ,  Shouyu Hong ,  Tao Wang ,  Jianhong Zeng ,  Zhangnan Xin

IPC: H01F27/29 ,  H05K1/18 ,  H01F27/24 ,  H05K1/11

CPC classification number: H01F27/29 ,  H01F27/24 ,  H01F27/2847 ,  H01F27/306 ,  H01L27/02 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/1003

Abstract: A power module including a power device and a magnetic component is provided. The magnetic component is stacked with the power device and a vertical projection of the magnetic component is at least partially overlapping with the power device. The magnetic component includes a magnetic core and a winding set. The magnetic core includes a first surface, a second surface and at least one window. The window is located between the first surface and the second surface, and includes a passing-through axis vertical to a surface of the power device, where at least one leading pin or pad is disposed on the surface of the power device. The winding set includes at least one winding portion. The winding portion passes through the window and electrically connected to the power device. Each winding set and the magnetic core are configured to form an inductor, and the winding set is preformed.