公开(公告)号：US20240076503A1

公开(公告)日：2024-03-07

申请号：US18262512

申请日：2022-01-21

Applicant: Denka Company Limited

Inventor： Tetsuya ITO ,  Yusaku HARADA ,  Kosuke TANAKA ,  Tatsuya NAGAI

IPC: C09C1/54 ,  C09C1/56

CPC classification number: C09C1/54 ,  C09C1/56 ,  C01P2006/12 ,  C01P2006/42

Abstract: Carbon black in which an oil absorption amount is 150 mL/100 g or more and 400 mL/100 g or less and a cobalt content that is measured by induced coupled plasma-mass spectrometry is 20 ppb or less.

公开(公告)号：US20210176860A1

公开(公告)日：2021-06-10

申请号：US16616902

申请日：2018-05-29

Applicant: DENKA COMPANY LIMITED

Inventor： Yuta TSUGAWA ,  Kouji NISHIMURA ,  Yusaku HARADA ,  Ryota AONO ,  Shoji IWAKIRI

IPC: H05K1/03 ,  B23K35/30 ,  C22C5/08 ,  C04B37/02

Abstract: A ceramic circuit substrate having high bonding performance and excellent thermal cycling resistance properties, wherein a ceramic substrate and a copper plate are bonded by a braze material containing Ag and Cu, at least one active metal component selected from Ti and Zr, and at least one element selected from among In, Zn, Cd, and Sn, wherein a braze material layer, after bonding, has a continuity ratio of 80% or higher and a Vickers hardness of 60 to 85 Hv.

公开(公告)号：US20210176859A1

公开(公告)日：2021-06-10

申请号：US16616837

申请日：2018-05-29

Applicant: DENKA COMPANY LIMITED

Inventor： Akimasa YUASA ,  Yusaku HARADA ,  Takahiro NAKAMURA ,  Shuhei MORITA ,  Kouji NISHIMURA

IPC: H05K1/03 ,  B32B9/04 ,  B32B15/04 ,  B32B15/20 ,  B23K1/00 ,  C04B37/02

Abstract: A ceramic circuit substrate having a metal plate bonded, by a bonding braze material, to at least one main surface of a ceramic substrate, wherein the bonding braze material contains, as metal components, 0.5 to 4.0 parts by mass of at least one active metal selected from among titanium, zirconium, hafnium, and niobium, with respect to 100 parts by mass, in total, of 93.0 to 99.4 parts by mass of Ag, 0.1 to 5.0 parts by mass of Cu, and 0.5 to 2.0 parts by mass of Sn; and Cu-rich phases in a bonding braze material layer structure between the ceramic substrate and the metal plate have an average size of 3.5 μm or less and a number density of 0.015/μm2 or higher. A method for producing a ceramic circuit substrate includes bonding at a temperature of 855 to 900° C. for a retention time of 10 to 60 minutes.

公开(公告)号：US20190030514A1

公开(公告)日：2019-01-31

申请号：US15779674

申请日：2016-11-28

Applicant: University of Yamanashi ,  Denka Company Limited

Inventor： Makoto UCHIDA ,  Katsuyoshi KAKINUMA ,  Daiki IKEDA ,  Yusaku HARADA ,  Takeshi MIYAKAWA

IPC: B01J23/42 ,  B01J32/00 ,  B01J37/08 ,  C09C1/48 ,  H01M4/96 ,  H01M8/10

Abstract: An electrode catalyst support, capable of improving the power of a fuel cell, and an electrode catalyst and a solid polymer fuel cell using the same.Provided is carbon black wherein pores which are at most 6 nm in pore diameter have a cumulative pore volume of less than 0.25 cm3/g, a specific surface area by BET is 500 to 900 m2/g, and a volatile matter content is 1.0 to 10.0%. Also provided are an electrode catalyst for a fuel cell comprising a support which includes this carbon black, and a solid polymer fuel cell having the electrode catalyst.