公开(公告)号：US20200163210A1

公开(公告)日：2020-05-21

申请号：US16630232

申请日：2018-07-25

Applicant: DENKA COMPANY LIMITED

Inventor： Akimasa YUASA ,  Yusaku HARADA ,  Takahiro NAKAMURA ,  Shuhei MORITA ,  Kouji NISHIMURA

IPC: H05K1/03 ,  H05K3/10

Abstract: A ceramic circuit substrate having high bonding performance and excellent thermal cycling resistance properties, having a circuit pattern provided on a ceramic substrate with a braze material layer interposed therebetween, and a protruding portion formed by the braze material layer protruding from the outer edge of the circuit pattern, wherein: the braze material layer includes Ag, Cu, Ti, and Sn or In; and an Ag-rich phase is formed continuously for 300 μm or more, towards the inside, from an outer edge of the protruding portion, along a bonding interface between the ceramic substrate and the circuit pattern, and has a bonding void ratio of 1.0% or less.

公开(公告)号：US20220225498A1

公开(公告)日：2022-07-14

申请号：US17418888

申请日：2019-12-26

Applicant: DENKA COMPANY LIMITED

Inventor： Akimasa YUASA ,  Takahiro NAKAMURA ,  Koji NISHIMURA

IPC: H05K1/03 ,  H05K1/09 ,  H05K3/06 ,  H01L23/373 ,  C04B37/02 ,  B23K1/00

Abstract: A ceramic-copper composite having a flat plate shape, including: a ceramic layer; a copper layer; and a brazing material layer present between the ceramic layer and the copper layer, in which a specified Expression (1) is satisfied in a cut surface of the copper layer obtained when the ceramic-copper composite is cut at a plane perpendicular to a main surface of the ceramic-copper composite, where S(102)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (102) plane is within 10°, S(101)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (101) plane is within 10°, S(111)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (111) plane is within 10°, and S(112)% is an area ratio occupied by copper crystals having a crystal orientation of which an inclination from a crystal orientation of (112) plane is within 10°.

公开(公告)号：US20220009842A1

公开(公告)日：2022-01-13

申请号：US17296172

申请日：2019-11-22

Applicant: DENKA COMPANY LIMITED

Inventor： Akimasa YUASA ,  Takahiro NAKAMURA ,  Shuhei MORITA ,  Koji NISHIMURA

IPC: C04B37/02 ,  H05K1/09 ,  H05K1/03 ,  B32B9/04 ,  B32B15/20 ,  B32B7/12

Abstract: A ceramic-copper composite having a flat plate shape, including: a ceramic layer; a copper layer; and a brazing material layer present between the ceramic layer and the copper layer. When a region having a length of 1,700 μm in a long-side direction is a region P on a cut surface of the ceramic-copper composite obtained when the ceramic-copper composite is cut with a plane perpendicular to a main surface of the ceramic-copper composite, an average crystal grain size D1 of copper crystals at least partially present in a region P1 within 50 μm on a side of the copper layer from an interface between the ceramic layer and the brazing material layer in the region P is 30 μm or more and 100 μm or less.

公开(公告)号：US20220098121A1

公开(公告)日：2022-03-31

申请号：US17426930

申请日：2020-01-30

Applicant: DENKA COMPANY LIMITED

Inventor： Akimasa YUASA ,  Yoshiyuki ESHIMA ,  Ryuhei WATANABE ,  Seiji KOBASHI ,  Koji NISHIMURA

IPC: C04B41/00 ,  C04B35/584 ,  B28B11/14 ,  B28B11/24

Abstract: A method for manufacturing a single sheet-type green sheet includes a transporting step of transporting a strip-shaped green sheet that contains ceramic along a longitudinal direction thereof, and an irradiation step of irradiating the transported strip-shaped green sheet with a laser beam to cut the strip-shaped green sheet, thereby obtaining a single sheet-type green sheet.

公开(公告)号：US20210176859A1

公开(公告)日：2021-06-10

申请号：US16616837

申请日：2018-05-29

Applicant: DENKA COMPANY LIMITED

Inventor： Akimasa YUASA ,  Yusaku HARADA ,  Takahiro NAKAMURA ,  Shuhei MORITA ,  Kouji NISHIMURA

IPC: H05K1/03 ,  B32B9/04 ,  B32B15/04 ,  B32B15/20 ,  B23K1/00 ,  C04B37/02

Abstract: A ceramic circuit substrate having a metal plate bonded, by a bonding braze material, to at least one main surface of a ceramic substrate, wherein the bonding braze material contains, as metal components, 0.5 to 4.0 parts by mass of at least one active metal selected from among titanium, zirconium, hafnium, and niobium, with respect to 100 parts by mass, in total, of 93.0 to 99.4 parts by mass of Ag, 0.1 to 5.0 parts by mass of Cu, and 0.5 to 2.0 parts by mass of Sn; and Cu-rich phases in a bonding braze material layer structure between the ceramic substrate and the metal plate have an average size of 3.5 μm or less and a number density of 0.015/μm2 or higher. A method for producing a ceramic circuit substrate includes bonding at a temperature of 855 to 900° C. for a retention time of 10 to 60 minutes.

公开(公告)号：US20220147723A1

公开(公告)日：2022-05-12

申请号：US17434840

申请日：2020-02-28

Applicant: DENKA COMPANY LIMITED

Inventor： Akimasa YUASA ,  Seiji KOBASHI ,  Koji NISHIMURA

IPC: G06K1/12 ,  G06K7/14 ,  H01L23/15

Abstract: A ceramic green sheet including a plurality of substrate forming regions. A barcode or a two-dimensional code is drawn in a portion of the ceramic green sheet. The barcode or the two-dimensional code is obtained by encoding one or more of the following information. Information relating to raw materials used when the ceramic green sheet is produced, information relating to molding conditions of the ceramic green sheet, information relating to a release agent used when a plurality of the ceramic green sheets are stacked, or a serial number.

公开(公告)号：US20190115228A1

公开(公告)日：2019-04-18

申请号：US16097131

申请日：2017-04-25

Applicant: Denka Company Limited

Inventor： Akimasa YUASA ,  Kouji NISHIMURA

IPC: H01L21/48 ,  H01L23/498

Abstract: [Problem] To obtain a ceramic circuit substrate for a power module wherein an insulating resin for preventing solder flow and chip displacement and an insulating resin for preventing partial discharges and lowering of insulation are applied, without lowering productivity or worsening partial discharge properties, or lowering the insulating properties due to positional displacement of the insulating resins. [Solution] A ceramic circuit substrate for a power module is obtained by applying an insulating resin for preventing solder flow and chip displacement and an insulating resin for preventing partial discharges and the lowering of insulation to a main surface of a metal circuit and to the outer periphery of the metal circuit or between metal circuits, respectively.

公开(公告)号：US20220161366A1

公开(公告)日：2022-05-26

申请号：US17438787

申请日：2020-03-12

Applicant: DENKA COMPANY LIMITED

Inventor： Akimasa YUASA ,  Yoshiyuki ESHIMA ,  Daiki FUJIYOSHI ,  Seiji KOBASHI ,  Koji NISHIMURA

IPC: B23K26/364 ,  B28D5/04 ,  C04B41/00 ,  C04B41/53 ,  C04B41/91 ,  C04B35/584 ,  C04B35/581

Abstract: A scribe line is formed on a first surface of a nitride ceramic base material by a laser. Next, the nitride ceramic base material is divided along the scribe line. The scribe line includes a plurality of recessed portions. The plurality of recessed portions are formed in a row on the first surface of the nitride ceramic base material. A depth of each of the plurality of recessed portions is equal to or greater than 0.70 times and equal to or smaller than 1.10 times an opening width of each of the plurality of recessed portions. The opening width of each of the plurality of recessed portions is equal to or greater than 1.00 times and equal to or smaller than 1.10 times an inter-center distance of the plurality of recessed portions.

公开(公告)号：US20180215668A1

公开(公告)日：2018-08-02

申请号：US15748420

申请日：2015-07-31

Applicant: Denka Company Limited

Inventor： Akimasa YUASA ,  Takeshi MIYAKAWA ,  Daisuke GOTO

IPC: C04B35/565 ,  B22D19/14 ,  C04B41/88 ,  C04B38/00 ,  C22C1/10

CPC classification number: C04B35/565 ,  B22D19/00 ,  B22D19/02 ,  B22D19/14 ,  C04B35/573 ,  C04B35/6316 ,  C04B35/645 ,  C04B38/00 ,  C04B38/0032 ,  C04B41/009 ,  C04B41/5155 ,  C04B41/88 ,  C04B2111/00844 ,  C04B2111/00931 ,  C04B2235/3418 ,  C04B2235/3826 ,  C04B2235/401 ,  C04B2235/402 ,  C04B2235/428 ,  C04B2235/5472 ,  C04B2235/6027 ,  C04B2235/616 ,  C04B2235/783 ,  C04B2235/786 ,  C04B2235/9607 ,  C22C1/10 ,  C22C1/1036 ,  C22C1/1068 ,  C22C2001/1021 ,  H01L21/4871 ,  H01L23/3731 ,  H01L23/3736 ,  C04B41/4521 ,  C04B41/4523 ,  C04B41/5096 ,  C04B41/515

Abstract: [Problem to be Solved]Provided are an aluminum-silicon-carbide composite having high thermal conductivity, low thermal expansion, and low specific gravity and a method for producing the composite.[Solution]Provided is an aluminum-silicon-carbide composite formed by impregnating a porous silicon carbide molded body with an aluminum alloy. The ratio of silicon carbide in the composite is 60 vol % or more, and the composite contains 60-75 mass % of silicon carbide having a particle diameter of 80 μm or more and 800 μm or less, 20-30 mass % of silicon carbide having a particle diameter of 8 μm or more and less than 80 μm, and 5-10 mass % of silicon carbide having a particle diameter of less than 8

公开(公告)号：US20170181272A1

公开(公告)日：2017-06-22

申请号：US15327159

申请日：2015-07-29

Applicant: DENKA COMPANY LIMITED

Inventor： Ryota AONO ,  Akimasa YUASA ,  Takeshi MIYAKAWA

IPC: H05K1/02 ,  H05K3/46 ,  B23K1/00 ,  H05K1/03 ,  C04B37/02 ,  C09K5/14

CPC classification number: H05K1/0271 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/3006 ,  C04B37/02 ,  C04B37/026 ,  C04B2237/125 ,  C04B2237/366 ,  C04B2237/407 ,  C04B2237/74 ,  C09K5/14 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/0306 ,  H05K1/053 ,  H05K3/022 ,  H05K3/061 ,  H05K3/067 ,  H05K3/4611 ,  H05K2201/068 ,  H05K2203/0285 ,  H01L2924/00

Abstract: [Problem] To obtain a ceramic circuit board having superior crack-resistance with respect to ultrasonic bonding.[Solution] The abovementioned problem is solved by a ceramic circuit board characterized in that a metal circuit board is bonded to one surface of a ceramic substrate and a metal heat radiation plate is bonded to the other surface of the ceramic substrate, wherein the crystal grain size in the metal circuit board is at least 20 μm and at most 70 μm. This ceramic circuit board can be manufactured by arranging the metal circuit board on one surface of the ceramic substrate and arranging the metal heat radiation plate on the other surface of the ceramic substrate, and bonding in a vacuum of at most 1×10−3 Pa, at a bonding temperature of at least 780° C. and at most 850° C., for a retention time of at least 10 minutes and at most 60 minutes.