CERAMIC CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR

    公开(公告)号:US20200163210A1

    公开(公告)日:2020-05-21

    申请号:US16630232

    申请日:2018-07-25

    IPC分类号: H05K1/03 H05K3/10

    摘要: A ceramic circuit substrate having high bonding performance and excellent thermal cycling resistance properties, having a circuit pattern provided on a ceramic substrate with a braze material layer interposed therebetween, and a protruding portion formed by the braze material layer protruding from the outer edge of the circuit pattern, wherein: the braze material layer includes Ag, Cu, Ti, and Sn or In; and an Ag-rich phase is formed continuously for 300 μm or more, towards the inside, from an outer edge of the protruding portion, along a bonding interface between the ceramic substrate and the circuit pattern, and has a bonding void ratio of 1.0% or less.