公开(公告)号：US20070089584A1

公开(公告)日：2007-04-26

申请号：US11254904

申请日：2005-10-20

Applicant: David Howard

Inventor： David Howard

IPC: B23D45/06

CPC classification number: B23D45/06 ,  B23D47/025 ,  B27B5/165 ,  B27B5/222 ,  Y10T83/773 ,  Y10T83/8763

Abstract: A saw table apparatus comprises a table and a saw mounting structure. The table includes a base and a tabletop attached to the base. The tabletop has a work-piece support surface. The saw mounting structure is engaged with the tabletop. The saw mounting structure is configured for having a hand-held circular saw attached thereto such that, when the saw mounting structure is in a use position with respect to the tabletop, a blade of the hand-held circular saw extends above a work-piece support surface of the tabletop and a work-piece engagement surface of the saw mounting structure lies substantially flush with the work-piece support surface of the tabletop. An engagement portion of the electrical plug receptacle is expose within an interior space of the base and a control portion of the electrical switch is exposed an exterior surface of the base.

Abstract translation: 锯台装置包括台和锯安装结构。 桌子包括一个底座和一个连接到底座的桌面。 桌面有一个工件支撑表面。 锯安装结构与台面接合。 锯安装结构构造成具有附接到其上的手持式圆锯，使得当锯安装结构相对于桌面处于使用位置时，手持式圆锯的刀片在工件上方延伸 桌面的支撑表面和锯安装结构的工件接合表面基本上与桌面的工件支撑表面齐平。 电插头插座的接合部分暴露在基座的内部空间内，电开关的控制部分露出基座的外表面。

公开(公告)号：US20060152268A1

公开(公告)日：2006-07-13

申请号：US11032225

申请日：2005-01-11

Applicant: David Flynn ,  David Howard

Inventor： David Flynn ,  David Howard

IPC: H03K3/037

CPC classification number: H03K3/0375 ,  G01R31/3172 ,  G01R31/318541 ,  G01R31/318572

Abstract: A latch circuit 2 is described including a function path latch 4, 6, which may be in the form of a standard flip-flop, together with a data retention latch 12, 14. The reset signal nreset and the scan enable signal SE are used to control these latches to perform reset, scan, save and restore functions. The save and restore functions serve to save a data value dv from the functional path latch 4, 6 into the data retention latch 12, 14 and restore this value such that the functional path latch can be powered down without a loss of data.

公开(公告)号：US20060110889A1

公开(公告)日：2006-05-25

申请号：US10997638

申请日：2004-11-23

Applicant: Dieter Dornisch ,  Kenneth Ring ,  Tinghao Wang ,  David Howard ,  Guangming Li

Inventor： Dieter Dornisch ,  Kenneth Ring ,  Tinghao Wang ,  David Howard ,  Guangming Li

IPC: H01L21/20

CPC classification number: H01L28/40

Abstract: According to one embodiment of the invention, a method for fabricating a MIM capacitor in a semiconductor die includes a step of depositing a first interconnect metal layer. The method further includes depositing a layer of silicon nitride on the first interconnect layer. The layer of silicon nitride is deposited in a deposition process using an ammonia-to-silane ratio of at least 12.5. The method further includes depositing a layer of MIM capacitor metal on the layer of silicon nitride. The method further includes etching the layer of MIM capacitor metal to form an upper electrode of the MIM capacitor. According to this exemplary embodiment, the method further includes etching the layer of silicon nitride to form a MIM capacitor dielectric segment and etching the first interconnect metal layer to form a lower electrode of the MIM capacitor. The MIM capacitor has a capacitance density of at least 2.0 fF/um2.

Abstract translation: 根据本发明的一个实施例，在半导体管芯中制造MIM电容器的方法包括沉积第一互连金属层的步骤。 该方法还包括在第一互连层上沉积氮化硅层。 氮化硅层在沉积过程中使用至少12.5的氨 - 硅烷比沉积。 该方法还包括在氮化硅层上沉积MIM电容器金属层。 该方法还包括蚀刻MIM电容器金属层以形成MIM电容器的上电极。 根据该示例性实施例，该方法还包括蚀刻氮化硅层以形成MIM电容器电介质段并蚀刻第一互连金属层以形成MIM电容器的下电极。 MIM电容器具有至少2.0fF / um 2的电容密度。

公开(公告)号：US07041569B1

公开(公告)日：2006-05-09

申请号：US10712067

申请日：2003-11-13

Applicant: Arjun Kar-Roy ,  Marco Racanelli ,  David Howard

Inventor： Arjun Kar-Roy ,  Marco Racanelli ,  David Howard

IPC: H01L21/20

CPC classification number: H01L28/40 ,  H01L21/76838 ,  H01L27/0805

Abstract: According to a disclosed embodiment, a composite MIM capacitor comprises a lower electrode of a lower MIM capacitor situated in a lower interconnect metal layer of a semiconductor die. The composite MIM capacitor further comprises an upper electrode of the lower MIM capacitor situated within a lower interlayer dielectric, where the lower interlayer dielectric separates the lower interconnect metal layer from an upper interconnect metal layer. A lower electrode of the upper MIM capacitor is situated in the upper interconnect metal layer. An upper electrode of the upper MIM capacitor is situated within the upper interlayer dielectric which is, in turn, situated over the upper interconnect metal layer. The upper electrode of the lower MIM capacitor is connected to the lower electrode of the upper MIM capacitor while the lower electrode of the lower MIM capacitor is connected to the upper electrode of the upper MIM capacitor.

Abstract translation: 根据所公开的实施例，复合MIM电容器包括位于半导体管芯的下互连金属层中的下MIM电容器的下电极。 复合MIM电容器还包括位于下层间电介质中的下MIM电容器的上电极，其中下层间电介质将下互连金属层与上互连金属层分开。 上MIM电容器的下电极位于上互连金属层中。 上MIM电容器的上电极位于上层间电介质中，其又位于上互连金属层上。 下MIM电容器的上电极连接到上MIM电容器的下电极，而下MIM电容器的下电极连接到上MIM电容器的上电极。

公开(公告)号：US06830982B1

公开(公告)日：2004-12-14

申请号：US10290976

申请日：2002-11-07

Applicant: David Howard ,  Marco Racanelli ,  Greg D. U'Ren

Inventor： David Howard ,  Marco Racanelli ,  Greg D. U'Ren

IPC: H01L21331

CPC classification number: H01L29/66287 ,  H01L21/8249 ,  H01L29/1004 ,  H01L29/167 ,  H01L29/66242 ,  H01L29/66272

Abstract: According to one exemplary embodiment, an NPN bipolar transistor comprises a base layer situated over a collector, where the base layer comprises an intrinsic base region and an extrinsic base region. The NPN bipolar transistor may be, for example, an NPN silicon-germanium heterojunction bipolar transistor. The base layer can be, for example, silicon-germanium. According to this exemplary embodiment, the NPN bipolar transistor further comprises a cap layer situated over the base layer, where a portion of the cap layer is situated over the extrinsic base region, and where the portion of the cap layer situated over the extrinsic base region comprises an indium dopant. The cap layer may be, for example, polycrystalline silicon. According to this exemplary embodiment, the NPN bipolar transistor may further comprise an emitter situated over the intrinsic base region. The emitter may be, for example, polycrystalline silicon.

Abstract translation: 根据一个示例性实施例，NPN双极晶体管包括位于集电极上方的基极层，其中基极层包含本征基极区域和外部基极区域。 NPN双极晶体管可以是例如NPN硅 - 锗异质结双极晶体管。 基层可以是例如硅 - 锗。 根据该示例性实施例，NPN双极晶体管还包括位于基极层之上的覆盖层，其中覆盖层的一部分位于外部本体区域之上，并且其中覆盖层的位于外部基极区域之上的部分 包括铟掺杂剂。 盖层可以是例如多晶硅。 根据该示例性实施例，NPN双极晶体管还可以包括位于本征基极区域上方的发射极。 发射极可以是例如多晶硅。

公开(公告)号：US6115781A

公开(公告)日：2000-09-05

申请号：US265269

申请日：1999-03-09

Applicant: David Howard

Inventor： David Howard

IPC: G06F3/06 ,  G06F12/16

CPC classification number: G06F3/0682 ,  G06F3/0613 ,  G06F3/0659 ,  Y10S707/99953 ,  Y10S707/99955

Abstract: A general purpose method is provided for interfacing with a storage device having a tape medium. The method includes receiving data from a first source, and creating a first data packet having at least a portion of the data from the first source. The method also includes receiving data from a second source, and creating a second data packet having at least a portion of the data from the second source. The method further includes receiving additional data from the first source, and creating a third data packet having at least a portion of the additional data from the first source. The method still further includes transmitting the first data packet, the second data packet and the third data packet to the storage device, and storing the first data packet, the second data packet, and the third data packet on the tape medium in an interleaved configuration. A system including control logic is also provided for performing the method.

Abstract translation: 提供了一种与具有带介质的存储设备进行接口的通用方法。 该方法包括从第一源接收数据，以及创建具有来自第一源的数据的至少一部分的第一数据分组。 该方法还包括从第二源接收数据，以及创建具有来自第二源的数据的至少一部分的第二数据分组。 该方法还包括从第一源接收附加数据，以及创建具有来自第一源的附加数据的至少一部分的第三数据分组。 该方法还包括将第一数据分组，第二数据分组和第三数据分组发送到存储设备，并将第一数据分组，第二数据分组和第三数据分组存储在带介质上的交织配置 。 还提供了包括控制逻辑的系统用于执行该方法。

公开(公告)号：US5950218A

公开(公告)日：1999-09-07

申请号：US743526

申请日：1996-11-04

Applicant: David Howard

Inventor： David Howard

IPC: G06F3/06 ,  G06F12/02

CPC classification number: G06F3/0682 ,  G06F3/0613 ,  G06F3/0659 ,  Y10S707/99953 ,  Y10S707/99955

Abstract: A method is provided for interfacing with a storage device having a tape medium. The method includes receiving data from a first source, and creating a first data packet having at least a portion of the data from the first source. The method also includes receiving data from a second source, and creating a second data packet having at least a portion of the data from the second source. The method further includes receiving additional data from the first source, and creating a third data packet having at least a portion of the additional data from the first source. The method still further includes transmitting the first data packet, the second data packet and the third data packet to the storage device, and storing the first data packet, the second data packet, and the third data packet on the tape medium in an interleaved configuration. A system including control logic is also provided for performing the method.

Abstract translation: 提供了一种与具有带介质的存储设备进行接口的方法。 该方法包括从第一源接收数据，以及创建具有来自第一源的数据的至少一部分的第一数据分组。 该方法还包括从第二源接收数据，以及创建具有来自第二源的数据的至少一部分的第二数据分组。 该方法还包括从第一源接收附加数据，以及创建具有来自第一源的附加数据的至少一部分的第三数据分组。 该方法还包括将第一数据分组，第二数据分组和第三数据分组发送到存储设备，并将第一数据分组，第二数据分组和第三数据分组存储在带介质上的交织配置 。 还提供了包括控制逻辑的系统用于执行该方法。

公开(公告)号：US08875621B2

公开(公告)日：2014-11-04

申请号：US12836786

申请日：2010-07-15

Applicant: David Howard

Inventor： David Howard

IPC: A21B1/48 ,  A23L3/18 ,  A47J37/04 ,  A47J37/08 ,  A23L1/325 ,  A23L1/31 ,  A23L1/314 ,  A23L1/01 ,  A23L1/315 ,  F23D14/02

CPC classification number: A23L1/0128 ,  A21B1/48 ,  A23L5/10 ,  A23L5/15 ,  A23L13/03 ,  A23L13/428 ,  A23L13/50 ,  A23L17/00 ,  A23V2002/00 ,  A47J37/044 ,  A47J37/08 ,  F23D14/02 ,  F23D2900/14041

Abstract: An apparatus, a loop burner element, and a method for surface-roasting a food product wherein the roasting apparatus comprises (a) a conveyor which carries the food product and (b) at least one non-linear ribbon flame burner element or element assembly which preferably applies a ribbon flame to at least the upper and side surfaces of the food product as it is conducted through the roasting apparatus.

Abstract translation: 一种装置，环形燃烧器元件和用于表面焙烧食品的方法，其中焙烧装置包括（a）承载食品的输送机和（b）至少一个非线性带状火焰燃烧器元件或元件组件 其优选地，当食品通过焙烧装置传导时，至少将食品的上表面和侧表面施加带状火焰。

公开(公告)号：US08728555B1

公开(公告)日：2014-05-20

申请号：US12631497

申请日：2009-12-04

Applicant: David Howard

Inventor： David Howard

IPC: A23C3/00

CPC classification number: A23L5/13 ,  A23L5/10

Abstract: An apparatus and method for continuously searing and/or branding the surface of and continuously cooking a food product wherein the cooking oven is different from the searing and/or branding apparatus. At least a portion of the vapor product produced in the searing and/or branding apparatus is preferably delivered into the oven such that the food product is cooked in an environment comprising the vapor product from the searing and/or branding apparatus. The vapor extraction rate from the searing and/or branding apparatus is also preferably controlled to maintain a desired vapor product temperature in or flowing from the searing and/or branding apparatus.

Abstract translation: 一种用于连续地烘烤和/或标记食品的表面并连续烹饪食品的设备和方法，其中烹饪炉与灼热和/或品牌设备不同。 在灼热和/或品牌设备中产生的至少一部分蒸气产物优选地被输送到烘箱中，使得食品在包括来自灼热和/或品牌化设备的蒸汽产物的环境中烹饪。 还优选控制来自灼热和/或品牌设备的蒸气提取速率，以保持期望的蒸气产物温度进入或流出灼热和/或品牌设备。

公开(公告)号：US20120148719A1

公开(公告)日：2012-06-14

申请号：US13401167

申请日：2012-02-21

Applicant: David Howard

Inventor： David Howard

IPC: A23L1/31

CPC classification number: A62C3/006 ,  A21B1/00 ,  A23L5/13 ,  A23L5/15 ,  A23L13/00 ,  A23V2002/00 ,  A47J27/16 ,  B65G27/02 ,  F27D11/00

Abstract: A process for producing precooked bacon slices comprising the steps of (a) conveying bacon slices through a spiral oven, (b) indirectly cooking the bacon slices in the spiral oven using a cooking medium which is circulated within the oven at a low rate sufficient to prevent the bacon slices from being displaced on the conveyor, and (c) adding steam to the cooking medium as necessary to at least reduce the percentage or substantially eliminate the presence of air in the cooking medium.

Abstract translation: 一种用于生产预烹饪的培根切片的方法，包括以下步骤：（a）通过螺旋烘箱输送培根切片，（b）使用烹饪介质间接烹饪螺旋烘箱中的培根切片，所述烹饪介质以低的速率在烘箱内循环， 防止培根切片在输送机上移位，以及（c）根据需要向蒸煮介质添加蒸汽以至少降低百分比或基本上消除烹饪介质中空气的存在。