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公开(公告)号：US08269677B2
公开(公告)日：2012-09-18
申请号：US12553943
申请日：2009-09-03
申请人： Jerzy Guterman , Eduardo Lopez Camacho , Mattia Pascolini , Enrique Ayala Vazquez , Robert W. Schlub , Ruben Caballero
发明人： Jerzy Guterman , Eduardo Lopez Camacho , Mattia Pascolini , Enrique Ayala Vazquez , Robert W. Schlub , Ruben Caballero
CPC分类号： H01Q1/44 , H01Q1/2266 , H01Q5/378 , H01Q9/0407
摘要： An electronic device may have a housing with conductive housing walls. A dielectric antenna window may be formed in an opening in one of the conductive housing walls. A dielectric logo may form the dielectric antenna window. A dielectric support structure may have an outline that matches the dielectric logo. An antenna resonating element for an antenna may be formed on the dielectric support structure. An antenna cavity for the antenna may be formed by a conductive cavity structure. A pattern of voids in the dielectric support structure may reduce dielectric loading for the antenna. The conductive cavity structure may be formed from solderable plated metal. The conductive cavity structure may have a planar lip that is attached to the conductive housing walls using conductive adhesive. Rear wall portions of the conductive cavity structure may be oriented at a non-perpendicular non-zero angle with respect to the planar lip.
摘要翻译： 电子设备可以具有带有导电外壳壁的壳体。 电介质天线窗可以形成在一个导电外壳壁中的开口中。 电介质标识可形成电介质天线窗。 电介质支撑结构可以具有与电介质标志相匹配的轮廓。 用于天线的天线谐振元件可以形成在电介质支撑结构上。 用于天线的天线腔可以由导电腔结构形成。 电介质支撑结构中空隙的图案可以减小天线的介电负载。 导电腔结构可以由可焊接的电镀金属形成。 导电腔结构可以具有使用导电粘合剂附接到导电壳体壁的平面唇缘。 导电腔结构的后壁部分可以相对于平面唇缘以非垂直非零角度定向。
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公开(公告)号：US20110050508A1
公开(公告)日：2011-03-03
申请号：US12553943
申请日：2009-09-03
申请人： Jerzy Guterman , Eduardo Lopez Camacho , Mattia Pascolini , Enrique Ayala Vazquez , Robert W. Schlub , Ruben Caballero
发明人： Jerzy Guterman , Eduardo Lopez Camacho , Mattia Pascolini , Enrique Ayala Vazquez , Robert W. Schlub , Ruben Caballero
CPC分类号： H01Q1/44 , H01Q1/2266 , H01Q5/378 , H01Q9/0407
摘要： An electronic device may have a housing with conductive housing walls. A dielectric antenna window may be formed in an opening in one of the conductive housing walls. A dielectric logo may form the dielectric antenna window. A dielectric support structure may have an outline that matches the dielectric logo. An antenna resonating element for an antenna may be formed on the dielectric support structure. An antenna cavity for the antenna may be formed by a conductive cavity structure. A pattern of voids in the dielectric support structure may reduce dielectric loading for the antenna. The conductive cavity structure may be formed from solderable plated metal. The conductive cavity structure may have a planar lip that is attached to the conductive housing walls using conductive adhesive. Rear wall portions of the conductive cavity structure may be oriented at a non-perpendicular non-zero angle with respect to the planar lip.
摘要翻译： 电子设备可以具有带有导电外壳壁的壳体。 电介质天线窗可以形成在一个导电外壳壁中的开口中。 电介质标识可形成电介质天线窗。 电介质支撑结构可以具有与电介质标志相匹配的轮廓。 用于天线的天线谐振元件可以形成在电介质支撑结构上。 用于天线的天线腔可以由导电腔结构形成。 电介质支撑结构中空隙的图案可以减小天线的介电负载。 导电腔结构可以由可焊接的电镀金属形成。 导电腔结构可以具有使用导电粘合剂附接到导电壳体壁的平面唇缘。 导电腔结构的后壁部分可以相对于平面唇缘以非垂直非零角度定向。
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公开(公告)号：US09000989B2
公开(公告)日：2015-04-07
申请号：US13212108
申请日：2011-08-17
CPC分类号： G01R29/10 , G01R31/2824
摘要： Electronic device structures may be tested using a radio-frequency test system. The radio-frequency test system may include radio-frequency test equipment and an associated test fixture. The radio-frequency test equipment may be used in generating and measuring radio-frequency signals. The test fixture may contain adjustable structures that allow the positions of radio-frequency test probes to be adjusted. The test system may be configured to position radio-frequency probes in the test fixture so that some probe contacts form electrical connections with conductive antenna structures. The radio-frequency probes may contain other contacts that are positioned to form electrical connections with conductive electronic device housing structures. During radio-frequency testing, the test equipment in the test system may apply radio-frequency test signals to the device structures under test using the test probes. Corresponding radio-frequency test signals may be measured by the test equipment.
摘要翻译： 可以使用射频测试系统来测试电子设备结构。 射频测试系统可以包括射频测试设备和相关的测试夹具。 射频测试设备可用于产生和测量射频信号。 测试夹具可能包含允许调整射频测试探头位置的可调结构。 测试系统可以被配置为将射频探针放置在测试夹具中，使得一些探针触点与导电天线结构形成电连接。 射频探头可以包含定位成与导电电子器件壳体结构形成电连接的其它触点。 在射频测试期间，测试系统中的测试设备可以使用测试探针将射频测试信号应用于被测设备结构。 相应的射频测试信号可以由测试设备测量。
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公开(公告)号：US20130044033A1
公开(公告)日：2013-02-21
申请号：US13212108
申请日：2011-08-17
IPC分类号： G01R29/08
CPC分类号： G01R29/10 , G01R31/2824
摘要： Electronic device structures may be tested using a radio-frequency test system. The radio-frequency test system may include radio-frequency test equipment and an associated test fixture. The radio-frequency test equipment may be used in generating and measuring radio-frequency signals. The test fixture may contain adjustable structures that allow the positions of radio-frequency test probes to be adjusted. The test system may be configured to position radio-frequency probes in the test fixture so that some probe contacts form electrical connections with conductive antenna structures. The radio-frequency probes may contain other contacts that are positioned to form electrical connections with conductive electronic device housing structures. During radio-frequency testing, the test equipment in the test system may apply radio-frequency test signals to the device structures under test using the test probes. Corresponding radio-frequency test signals may be measured by the test equipment.
摘要翻译： 可以使用射频测试系统来测试电子设备结构。 射频测试系统可以包括射频测试设备和相关的测试夹具。 射频测试设备可用于产生和测量射频信号。 测试夹具可能包含允许调整射频测试探头位置的可调结构。 测试系统可以被配置为将射频探针放置在测试夹具中，使得一些探针触点与导电天线结构形成电连接。 射频探头可以包含定位成与导电电子器件壳体结构形成电连接的其它触点。 在射频测试期间，测试系统中的测试设备可以使用测试探针将射频测试信号应用于被测设备结构。 相应的射频测试信号可以由测试设备测量。
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15.发明申请ANTENNA STRUCTURES HAVING RESONATING ELEMENTS AND PARASITIC ELEMENTS WITHIN SLOTS IN CONDUCTIVE ELEMENTS 有权具有传导元件中的共振元件和PARASITIC元件的天线结构公开(公告)号：US20120068893A1
公开(公告)日：2012-03-22
申请号：US12888350
申请日：2010-09-22
申请人： Jerzy Guterman , Hao Xu , Douglas Blake Kough , Eduardo Lopez Camacho , Mattia Pascolini , Robert W. Schlub , Ruben Caballero
发明人： Jerzy Guterman , Hao Xu , Douglas Blake Kough , Eduardo Lopez Camacho , Mattia Pascolini , Robert W. Schlub , Ruben Caballero
CPC分类号： H01Q5/357 , H01Q1/2266 , H01Q5/378
摘要： Electronic devices may include radio-frequency transceiver circuitry and antenna structures. The antenna structures may include antenna resonating elements such as dual-band antenna resonating elements that resonate in first and second communications bands. The antenna structures may also contain parasitic antenna elements such as elements that are operative in only the first or second communications band and elements that are operative in both the first and second communications bands. The antenna resonating elements and parasitic elements may be mounted on a common dielectric carrier. The dielectric carrier may be mounted within a slot or other opening in a conductive element. The conductive element may be formed from conductive housing structures in an electronic device such as a portable computer. The portable computer may have a clutch barrel with a dielectric cover. The dielectric cover may overlap and cover the slot and the dielectric carrier.
摘要翻译： 电子设备可以包括射频收发器电路和天线结构。 天线结构可以包括诸如在第一和第二通信频带中共振的双频天线谐振元件的天线谐振元件。 天线结构还可以包含诸如仅在第一或第二通信频带中操作的元件的寄生天线元件和在第一和第二通信频带中都可操作的元件。 天线谐振元件和寄生元件可以安装在公共介电载体上。 电介质载体可以安装在导电元件中的槽或其它开口内。 导电元件可以由诸如便携式计算机的电子设备中的导电外壳结构形成。 便携式计算机可以具有带电介质盖的离合器筒。 电介质盖可以重叠并覆盖槽和电介质载体。
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公开(公告)号：US08854266B2
公开(公告)日：2014-10-07
申请号：US13216012
申请日：2011-08-23
申请人： Jiang Zhu , Jerzy Guterman , Mattia Pascolini , Jayesh Nath , Robert W. Schlub
发明人： Jiang Zhu , Jerzy Guterman , Mattia Pascolini , Jayesh Nath , Robert W. Schlub
CPC分类号： H01Q1/523 , H01Q1/2266
摘要： Electronic devices may be provided with antenna structures and antenna isolation element structures. An antenna array may be located within an electronic device. The antenna array may have multiple antennas and interposed antenna isolation element structures for isolating the antennas from each other. An antenna isolation element structure may have a dielectric carrier with a longitudinal axis. A sheet of conductive material may extend around the longitudinal axis to form a conductive loop structure. The loop structure in the antenna isolation element may have a gap that spans the sheet of conductive material parallel to the longitudinal axis. Electronic components may bridge the gap. Control circuitry may adjust the electronic components to tune the antenna isolation element.
摘要翻译： 电子设备可以设置有天线结构和天线隔离元件结构。 天线阵列可以位于电子设备内。 天线阵列可以具有多个天线和插入的天线隔离元件结构，用于将天线彼此隔离。 天线隔离元件结构可以具有具有纵向轴线的介电载体。 导电材料片可以围绕纵向轴线延伸以形成导电环结构。 天线隔离元件中的环路结构可以具有跨越平行于纵向轴线的导电材料片的间隙。 电子元件可能弥合差距。 控制电路可以调整电子部件以调谐天线隔离元件。
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公开(公告)号：US20130050050A1
公开(公告)日：2013-02-28
申请号：US13216073
申请日：2011-08-23
申请人： Jiang Zhu , Jerzy Guterman , Mattia Pascolini , Jayesh Nath , Robert W. Schlub
发明人： Jiang Zhu , Jerzy Guterman , Mattia Pascolini , Jayesh Nath , Robert W. Schlub
IPC分类号： H01Q7/00
CPC分类号： H01Q1/243 , H01Q1/2283 , H01Q1/2291 , H01Q21/30
摘要： Electronic devices may be provided with antenna structures such as distributed loop antenna resonating element structures. A distributed loop antenna may be formed on an elongated dielectric carrier and may have a longitudinal axis. The distributed loop antenna may include a loop antenna resonating element formed from a sheet of conductive material that extends around the longitudinal axis. A gap may be formed in the sheet of conductive material. The loop antenna resonating element may be directly fed or indirectly fed. In indirect feeding arrangements, an antenna feed structure for indirectly feeding the loop antenna resonating element may be formed from a directly fed loop antenna structure on the elongated dielectric carrier.
摘要翻译： 电子设备可以设置有诸如分布式环形天线谐振元件结构的天线结构。 分布式环形天线可以形成在细长介质载体上并且可以具有纵向轴线。 分布式环形天线可以包括由围绕纵向轴线延伸的导电材料片形成的环形天线谐振元件。 可以在导电材料片中形成间隙。 环形天线谐振元件可以直接馈送或间接馈送。 在间接馈送装置中，用于间接馈送环形天线谐振元件的天线馈送结构可以由细长电介质载体上的直接馈送的环形天线结构形成。
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公开(公告)号：US09937526B2
公开(公告)日：2018-04-10
申请号：US13250784
申请日：2011-09-30
申请人： Boon W. Shiu , Peter Bevelacqua , Jiang Zhu , Jerzy Guterman , Robert W. Schlub , Ruben Caballero
发明人： Boon W. Shiu , Peter Bevelacqua , Jiang Zhu , Jerzy Guterman , Robert W. Schlub , Ruben Caballero
摘要： Electronic devices may be provided with antenna structures. The antenna structures may be used in wirelessly transmitting and receiving radio-frequency signals. Antenna structures may be formed from molded dielectric substrates. Patterned conductive material may be formed on the dielectric substrates. The dielectric substrates may be formed from molded materials such as glass or ceramic. Sheets of dielectric or dielectric powder may be compressed to form a dielectric substrate of a desired shape. The patterned conductive material may be formed from metallic paint or other conductors. A hollow antenna chamber may be formed by joining molded dielectric structures. An antenna such as an indirectly-fed loop antenna or other antennas may be formed from the molded dielectric substrates and patterned conductors.
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19.发明授权Antenna structures having resonating elements and parasitic elements within slots in conductive elements 有权天线结构在导电元件的槽中具有谐振元件和寄生元件公开(公告)号：US09236648B2
公开(公告)日：2016-01-12
申请号：US12888350
申请日：2010-09-22
申请人： Jerzy Guterman , Hao Xu , Douglas Blake Kough , Eduardo Lopez Camacho , Mattia Pascolini , Robert W. Schlub , Ruben Caballero
发明人： Jerzy Guterman , Hao Xu , Douglas Blake Kough , Eduardo Lopez Camacho , Mattia Pascolini , Robert W. Schlub , Ruben Caballero
CPC分类号： H01Q5/357 , H01Q1/2266 , H01Q5/378
摘要： Electronic devices may include radio-frequency transceiver circuitry and antenna structures. The antenna structures may include antenna resonating elements such as dual-band antenna resonating elements that resonate in first and second communications bands. The antenna structures may also contain parasitic antenna elements such as elements that are operative in only the first or second communications band and elements that are operative in both the first and second communications bands. The antenna resonating elements and parasitic elements may be mounted on a common dielectric carrier. The dielectric carrier may be mounted within a slot or other opening in a conductive element. The conductive element may be formed from conductive housing structures in an electronic device such as a portable computer. The portable computer may have a clutch barrel with a dielectric cover. The dielectric cover may overlap and cover the slot and the dielectric carrier.
摘要翻译： 电子设备可以包括射频收发器电路和天线结构。 天线结构可以包括诸如在第一和第二通信频带中共振的双频天线谐振元件的天线谐振元件。 天线结构还可以包含诸如仅在第一或第二通信频带中操作的元件的寄生天线元件和在第一和第二通信频带中都可操作的元件。 天线谐振元件和寄生元件可以安装在公共介电载体上。 电介质载体可以安装在导电元件中的槽或其它开口内。 导电元件可以由诸如便携式计算机的电子设备中的导电外壳结构形成。 便携式计算机可以具有带电介质盖的离合器筒。 电介质盖可以重叠并覆盖槽和电介质载体。
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公开(公告)号：US20130321216A1
公开(公告)日：2013-12-05
申请号：US13484040
申请日：2012-05-30
申请人： James W. Jervis , Jayesh Nath , Erdinc Irci , Jerzy Guterman , Mattia Pascolini , Robert W. Schlub
发明人： James W. Jervis , Jayesh Nath , Erdinc Irci , Jerzy Guterman , Mattia Pascolini , Robert W. Schlub
IPC分类号： H01Q1/24
CPC分类号： G06F1/1616 , H01Q1/2266 , H01Q1/2291 , H01Q1/38 , H01Q1/42 , H04M1/0216
摘要： Electronic devices may include radio-frequency transceiver circuitry and antenna structures. The antenna structures may include antenna resonating elements, parasitic antenna resonating elements, and antenna ground structures. The antenna structures may include metal traces that are wrapped around an elongated plastic carrier. The plastic carrier may have metal traces that are coupled to a metal bracket using solder that protrudes through a hole in the metal bracket. A printed circuit board may be mounted between the metal bracket and a metal housing. The metal housing may have a protruding ridge portion that is gripped between prongs on the metal bracket. A cover may cover the metal traces on the elongated plastic carrier. The antenna structures may be mounted between hinge structures that couple upper and lower housing structures. The antenna structures may be configured to operate with comparable performance when the upper and lower housing structures are open and closed.
摘要翻译： 电子设备可以包括射频收发器电路和天线结构。 天线结构可以包括天线谐振元件，寄生天线谐振元件和天线地面结构。 天线结构可以包括围绕细长塑料载体缠绕的金属迹线。 塑料载体可以具有金属迹线，其使用通过金属支架中的孔突出的焊料耦合到金属支架。 印刷电路板可以安装在金属支架和金属外壳之间。 金属壳体可以具有突出的脊部，该脊部被夹在金属支架上的尖头之间。 盖可以覆盖细长塑料载体上的金属迹线。 天线结构可以安装在耦合上部和下部壳体结构的铰链结构之间。 天线结构可以被配置为当上部和下部壳体结构打开和关闭时以相当的性能运行。
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