公开(公告)号：US08422288B2

公开(公告)日：2013-04-16

申请号：US12937257

申请日：2010-07-14

申请人： Deyuan Xiao ,  Xiaolu Huang ,  Jing Chen ,  Xi Wang

发明人： Deyuan Xiao ,  Xiaolu Huang ,  Jing Chen ,  Xi Wang

IPC分类号： G11C11/34

CPC分类号： H01L29/7841 ,  G11C11/404 ,  G11C2211/4016 ,  H01L27/10802

摘要： The present invention discloses a DRAM cell utilizing floating body effect and a manufacturing method thereof. The DRAM cell includes a P type semiconductor region provided on a buried oxide layer, an N type semiconductor region provided on the P type semiconductor region, a gate region provided on the N type semiconductor region, and an electrical isolation region surrounding the P type semiconductor region and the N type semiconductor region. A diode of floating body effect is taken as a storage node. Via a tunneling effect between bands, electrons gather in the floating body, which is defined as a first storage state; via forward bias of PN junction, electrons are emitted out from the floating body or holes are injected into the floating body, which is defined as a second storage state. The present invention provides a highly efficient DRAM cell utilizing floating body effect with high density, which has low power consumption, has simple manufacturing process, and is compatible to the conventional CMOS and conventional logic circuit manufacturing process.

摘要翻译： 本发明公开了一种利用浮体效应的DRAM单元及其制造方法。 DRAM单元包括设置在掩埋氧化物层上的P型半导体区域，设置在P型半导体区域上的N型半导体区域，设置在N型半导体区域上的栅极区域和围绕P型半导体的电隔离区域 区域和N型半导体区域。 将浮体效应的二极管作为存储节点。 通过带之间的隧道效应，电子聚集在浮体中，其被定义为第一存储状态; 通过PN结的正向偏压，电子从浮体发出，或者将空穴注入到浮动体中，其被定义为第二存储状态。 本发明提供一种利用高密度的浮体效应的高效率DRAM单元，其具有低功耗，制造工艺简单，并且与常规CMOS和常规逻辑电路制造工艺兼容。

公开(公告)号：US08330228B2

公开(公告)日：2012-12-11

申请号：US12810694

申请日：2010-02-11

申请人： Deyuan Xiao ,  Xi Wang ,  Miao Zhang ,  Jing Chen ,  Zhongying Xue

发明人： Deyuan Xiao ,  Xi Wang ,  Miao Zhang ,  Jing Chen ,  Zhongying Xue

IPC分类号： H01L27/092

CPC分类号： H01L27/1211 ,  H01L21/823807 ,  H01L21/823821 ,  H01L21/845 ,  H01L29/42392

摘要： A Ge and Si hybrid material inversion mode GAA (Gate-All-Around) CMOSFET includes a PMOS region having a first channel, an NMOS region having a second channel and a gate region. The first channel and the second channel have a circular-shaped cross section and are formed of n-type Ge and p-type Si, respectively; the surfaces of the first channel and the second channel are substantially surrounded by the gate region; a buried oxide layer is disposed between the PMOS region and the NMOS region and between the PMOS or NMOS region and the Si substrate to isolate them from one another. In an inversion mode, current flows through the overall cylindrical channel, so as to achieve high carrier mobility, reduce low-frequency noises, prevent polysilicon gate depletion and short channel effects and increase the threshold voltage of the device.

摘要翻译： Ge和Si混合材料反转模式GAA（Gate-All-Around）CMOSFET包括具有第一沟道的PMOS区域，具有第二沟道的NMOS区域和栅极区域。 第一通道和第二通道具有圆形截面并分别由n型Ge和p型Si形成; 第一通道和第二通道的表面基本上被栅极区域包围; 在PMOS区域和NMOS区域之间以及在PMOS或NMOS区域和Si衬底之间设置掩埋氧化物层以将它们彼此隔离。 在反相模式下，电流流过整个圆柱形通道，以实现高载流子迁移率，降低低频噪声，防止多晶硅栅极耗尽和短沟道效应，并增加器件的阈值电压。

公开(公告)号：US20110292723A1

公开(公告)日：2011-12-01

申请号：US12937257

申请日：2010-07-14

申请人： Deyuan Xiao ,  Xiaolu Huang ,  Jing Chen ,  Xi Wang

发明人： Deyuan Xiao ,  Xiaolu Huang ,  Jing Chen ,  Xi Wang

IPC分类号： G11C11/38 ,  H01L21/336 ,  H01L29/772

CPC分类号： H01L29/7841 ,  G11C11/404 ,  G11C2211/4016 ,  H01L27/10802

摘要： The present invention discloses a DRAM cell utilizing floating body effect and a manufacturing method thereof. The DRAM cell includes a P type semiconductor region provided on a buried oxide layer, an N type semiconductor region provided on the P type semiconductor region, a gate region provided on the N type semiconductor region, and an electrical isolation region surrounding the P type semiconductor region and the N type semiconductor region. A diode of floating body effect is taken as a storage node. Via a tunneling effect between bands, electrons gather in the floating body, which is defined as a first storage state; via forward bias of PN junction, electrons are emitted out from the floating body or holes are injected into the floating body, which is defined as a second storage state. The present invention provides a highly efficient DRAM cell utilizing floating body effect with high density, which has low power consumption, has simple manufacturing process, and is compatible to the conventional CMOS and conventional logic circuit manufacturing process.

摘要翻译： 本发明公开了一种利用浮体效应的DRAM单元及其制造方法。 DRAM单元包括设置在掩埋氧化物层上的P型半导体区域，设置在P型半导体区域上的N型半导体区域，设置在N型半导体区域上的栅极区域和围绕P型半导体的电隔离区域 区域和N型半导体区域。 将浮体效应的二极管作为存储节点。 通过带之间的隧道效应，电子聚集在浮体中，其被定义为第一存储状态; 通过PN结的正向偏压，电子从浮体发出，或者将空穴注入到浮动体中，其被定义为第二存储状态。 本发明提供一种利用高密度的浮体效应的高效率DRAM单元，其具有低功耗，制造工艺简单，并且与常规CMOS和常规逻辑电路制造工艺兼容。

公开(公告)号：US20110254101A1

公开(公告)日：2011-10-20

申请号：US12810694

申请日：2010-02-11

申请人： Deyuan Xiao ,  Xi Wang ,  Miao Zhang ,  Jing Chen ,  Zhongying Xue

发明人： Deyuan Xiao ,  Xi Wang ,  Miao Zhang ,  Jing Chen ,  Zhongying Xue

IPC分类号： H01L27/092

CPC分类号： H01L27/1211 ,  H01L21/823807 ,  H01L21/823821 ,  H01L21/845 ,  H01L29/42392

摘要： A Ge and Si hybrid material inversion mode GAA (Gate-All-Around) CMOSFET includes a PMOS region having a first channel, an NMOS region having a second channel and a gate region. The first channel and the second channel have a circular-shaped cross section and are formed of n-type Ge and p-type Si, respectively; the surfaces of the first channel and the second channel are substantially surrounded by the gate region; a buried oxide layer is disposed between the PMOS region and the NMOS region and between the PMOS or NMOS region and the Si substrate to isolate them from one another. In an inversion mode, current flows through the overall cylindrical channel, so as to achieve high carrier mobility, reduce low-frequency noises, prevent polysilicon gate depletion and short channel effects and increase the threshold voltage of the device.

摘要翻译： Ge和Si混合材料反转模式GAA（Gate-All-Around）CMOSFET包括具有第一沟道的PMOS区域，具有第二沟道的NMOS区域和栅极区域。 第一通道和第二通道具有圆形截面并分别由n型Ge和p型Si形成; 第一通道和第二通道的表面基本上被栅极区域包围; 在PMOS区域和NMOS区域之间以及在PMOS或NMOS区域和Si衬底之间设置掩埋氧化物层以将它们彼此隔离。 在反相模式下，电流流过整个圆柱形通道，以实现高载流子迁移率，降低低频噪声，防止多晶硅栅极耗尽和短沟道效应，并增加器件的阈值电压。

公开(公告)号：US08354721B2

公开(公告)日：2013-01-15

申请号：US12810578

申请日：2010-02-11

申请人： Deyuan Xiao ,  Xi Wang

发明人： Deyuan Xiao ,  Xi Wang

IPC分类号： H01L27/092 ,  H01L21/84 ,  H01L27/12

CPC分类号： H01L27/1211 ,  H01L21/823821 ,  H01L21/845 ,  H01L29/42392 ,  H01L29/78696

摘要： A GAA (Gate-All-Around) CMOSFET device includes a semiconductor substrate, a PMOS region having a first channel, an NMOS region having a second channel and a gate region. The surfaces of the first channel and the second channel are substantially surrounded by the gate region. A buried insulation layer is disposed between the PMOS region and the NMOS region and between the PMOS or NMOS region and the semiconductor substrate to isolate them from one another. The structure is simple, compact and highly integrated, has high carrier mobility, and avoids polysilicon gate depletion and short channel effect.

摘要翻译： GAA（Gate-All-Around）CMOSFET器件包括半导体衬底，具有第一沟道的PMOS区，具有第二沟道的NMOS区和栅极区。 第一通道和第二通道的表面基本上被栅极区域包围。 掩埋绝缘层设置在PMOS区域和NMOS区域之间以及PMOS或NMOS区域与半导体衬底之间以将它们彼此隔离。 结构简单，紧凑，高度集成，具有高载流子迁移率，避免了多晶硅栅极耗尽和短沟道效应。

公开(公告)号：US08274119B2

公开(公告)日：2012-09-25

申请号：US12810648

申请日：2010-02-11

申请人： Deyuan Xiao ,  Xi Wang ,  Miao Zhang ,  Jing Chen ,  Zhongying Xue

发明人： Deyuan Xiao ,  Xi Wang ,  Miao Zhang ,  Jing Chen ,  Zhongying Xue

IPC分类号： H01L21/70

CPC分类号： H01L21/845 ,  H01L21/823807 ,  H01L21/823821 ,  H01L27/1211 ,  H01L29/42392 ,  H01L29/78696

摘要： A Ge and Si hybrid material accumulation mode GAA (Gate-All-Around) CMOSFET includes a PMOS region having a first channel, an NMOS region having a second channel and a gate region. The first channel and the second channel have a racetrack-shaped cross section and are formed of p-type Ge and n-type Si, respectively; the surfaces of the first channel and the second channel are substantially surrounded by the gate region; a buried oxide layer is disposed between the PMOS region and the NMOS region and between the PMOS or NMOS region and the Si substrate to isolate them from one another. In an accumulation mode, current flows through the overall racetrack-shaped channel. The disclosed device has high carrier mobility, high device drive current, and maintains the electrical integrity of the device. Meanwhile, polysilicon gate depletion and short channel effects are prevented.

摘要翻译： Ge和Si混合材料堆积模式GAA（Gate-All-Around）CMOSFET包括具有第一沟道的PMOS区域，具有第二沟道的NMOS区域和栅极区域。 第一通道和第二通道具有跑道形横截面并分别由p型Ge和n型Si形成; 第一通道和第二通道的表面基本上被栅极区域包围; 在PMOS区域和NMOS区域之间以及在PMOS或NMOS区域和Si衬底之间设置掩埋氧化物层以将它们彼此隔离。 在积累模式中，电流流过整个跑道状通道。 所公开的器件具有高的载流子迁移率，高的器件驱动电流，并且保持器件的电气完整性。 同时，防止了多晶硅栅极耗尽和短沟道效应。

公开(公告)号：US08274118B2

公开(公告)日：2012-09-25

申请号：US12810594

申请日：2010-02-11

申请人： DEYuan Xiao ,  Xi Wang ,  Miao Zhang ,  Jing Chen ,  Zhongying Xue

发明人： DEYuan Xiao ,  Xi Wang ,  Miao Zhang ,  Jing Chen ,  Zhongying Xue

IPC分类号： H01L21/70

CPC分类号： H01L21/84 ,  H01L21/823807 ,  H01L21/823821 ,  H01L27/12 ,  H01L29/42392 ,  H01L29/78696

摘要： A Ge and Si hybrid material accumulation mode GAA (Gate-All-Around) CMOSFET includes a PMOS region having a first channel, an NMOS region having a second channel and a gate region. The first channel and the second channel have a circular-shaped cross section and are formed of p-type Ge and n-type Si, respectively; the surfaces of the first channel and the second channel are substantially surrounded by the gate region; a buried oxide layer is disposed between the PMOS region and the NMOS region and between the PMOS or NMOS region and the Si substrate to isolate them from one another. In an accumulation mode, current flows through the overall cylindrical channel, so as to achieve high carrier mobility, reduce low-frequency noises, prevent polysilicon gate depletion and short channel effects and increase the threshold voltage of the device.

摘要翻译： Ge和Si混合材料堆积模式GAA（Gate-All-Around）CMOSFET包括具有第一沟道的PMOS区域，具有第二沟道的NMOS区域和栅极区域。 第一通道和第二通道具有圆形截面并分别由p型Ge和n型Si形成; 第一通道和第二通道的表面基本上被栅极区域包围; 在PMOS区域和NMOS区域之间以及在PMOS或NMOS区域和Si衬底之间设置掩埋氧化物层以将它们彼此隔离。 在累积模式下，电流流过整个圆柱形通道，以实现高载流子迁移率，降低低频噪声，防止多晶硅栅极耗尽和短沟道效应，并增加器件的阈值电压。

公开(公告)号：US20120018809A1

公开(公告)日：2012-01-26

申请号：US13127276

申请日：2010-09-08

申请人： Xiaolu Huang ,  Jing Chen ,  Xi Wang ,  Deyuan Xiao

发明人： Xiaolu Huang ,  Jing Chen ,  Xi Wang ,  Deyuan Xiao

IPC分类号： H01L29/78 ,  H01L21/336

CPC分类号： H01L21/84 ,  H01L21/76264 ,  H01L21/823807 ,  H01L21/823878 ,  H01L27/1207 ,  H01L29/1054

摘要： A MOS device having low floating charge and low self-heating effects are disclosed. The device includes a connective layer coupling the active gate channel to the Si substrate. The connective layer provides electrical and thermal passages during device operation, which could eliminate floating effects and self-heating effects. An example of a MOS device having a SiGe connector between a Si active channel and a Si substrate is disclosed in detail and a manufacturing process is provided.

摘要翻译： 公开了具有低浮动电荷和低自热效应的MOS器件。 该器件包括将有源栅极沟道耦合到Si衬底的连接层。 连接层在器件操作期间提供电和热通道，可以消除浮动效应和自热效应。 详细公开了在Si活性通道和Si衬底之间具有SiGe连接器的MOS器件的实例，并提供了制造工艺。

公开(公告)号：US20110254102A1

公开(公告)日：2011-10-20

申请号：US12810740

申请日：2010-02-11

申请人： Deyuan Xiao ,  Xi Wang ,  Miao Zhang ,  Jing Chen ,  Zhongying Xue

发明人： Deyuan Xiao ,  Xi Wang ,  Miao Zhang ,  Jing Chen ,  Zhongying Xue

IPC分类号： H01L27/092

CPC分类号： H01L27/1211 ,  H01L21/823807 ,  H01L21/823821 ,  H01L21/845 ,  H01L27/1203 ,  H01L29/42392 ,  H01L29/78696

摘要： A hybrid orientation inversion mode GAA (Gate-All-Around) CMOSFET includes a PMOS region having a first channel, an NMOS region having a second channel and a gate region. The first channel and the second channel have a racetrack-shaped cross section and are formed of n-type Si (110) and p-type Si(100), respectively; the surfaces of the first channel and the second channel are substantially surrounded by the gate region; a buried oxide layer is disposed between the PMOS region and the NMOS region and between the PMOS or NMOS region and the Si substrate to isolate them from one another. The device structure according to the prevent invention is quite simple, compact and highly integrated. In an inversion mode, the devices have different orientation channels, the GAA structure with the racetrack-shaped, high-k gate dielectric layer and metal gate, so as to achieve high carrier mobility, and prevent polysilicon gate depletion and short channel effects.

摘要翻译： 混合取向反转模式GAA（Gate-All-Around）CMOSFET包括具有第一通道的PMOS区域，具有第二通道的NMOS区域和栅极区域。 第一通道和第二通道具有跑道形横截面并分别由n型Si（110）和p型Si（100）形成; 第一通道和第二通道的表面基本上被栅极区域包围; 在PMOS区域和NMOS区域之间以及在PMOS或NMOS区域和Si衬底之间设置掩埋氧化物层以将它们彼此隔离。 根据本发明的装置结构相当简单，紧凑且高度集成。 在反转模式中，器件具有不同的取向通道，GAA结构具有跑道形，高k栅介质层和金属栅极，从而实现高载流子迁移率，并防止多晶硅栅极耗尽和短沟道效应。

公开(公告)号：US20110254099A1

公开(公告)日：2011-10-20

申请号：US12810594

申请日：2010-02-11

申请人： Deyuan Xiao ,  Xi Wang ,  Miao Zhang ,  Jing Chen ,  Zhongying Xue

发明人： Deyuan Xiao ,  Xi Wang ,  Miao Zhang ,  Jing Chen ,  Zhongying Xue

IPC分类号： H01L27/092

CPC分类号： H01L21/84 ,  H01L21/823807 ,  H01L21/823821 ,  H01L27/12 ,  H01L29/42392 ,  H01L29/78696

摘要： A Ge and Si hybrid material accumulation mode GAA (Gate-All-Around) CMOSFET includes a PMOS region having a first channel, an NMOS region having a second channel and a gate region. The first channel and the second channel have a circular-shaped cross section and are formed of p-type Ge and n-type Si, respectively; the surfaces of the first channel and the second channel are substantially surrounded by the gate region; a buried oxide layer is disposed between the PMOS region and the NMOS region and between the PMOS or NMOS region and the Si substrate to isolate them from one another. In an accumulation mode, current flows through the overall cylindrical channel, so as to achieve high carrier mobility, reduce low-frequency noises, prevent polysilicon gate depletion and short channel effects and increase the threshold voltage of the device.

摘要翻译： Ge和Si混合材料堆积模式GAA（Gate-All-Around）CMOSFET包括具有第一沟道的PMOS区域，具有第二沟道的NMOS区域和栅极区域。 第一通道和第二通道具有圆形截面并分别由p型Ge和n型Si形成; 第一通道和第二通道的表面基本上被栅极区域包围; 在PMOS区域和NMOS区域之间以及在PMOS或NMOS区域和Si衬底之间设置掩埋氧化物层以将它们彼此隔离。 在累积模式下，电流流过整个圆柱形通道，以实现高载流子迁移率，降低低频噪声，防止多晶硅栅极耗尽和短沟道效应，并增加器件的阈值电压。