Abstract:
A far infrared ray transmitting composition includes a particle having a refractive index of 1.3 to 5.0 at a wavelength of 10 μm and a medium.
Abstract:
Provided are a near-infrared-absorbing composition capable of forming a cured film having excellent heat resistance while maintaining high near-infrared shielding properties, a near-infrared cut-off filter, a production method using the same, and a camera module.Provided are a near-infrared-absorbing composition including a compound obtained from a reaction between a polymer (A1) having an acid group or a salt thereof and a copper component and a near-infrared-absorbing composition including a compound obtained from a reaction between a polymer (A1) having an acid group or a salt thereof and a copper component and a copper complex obtained from a reaction between a low-molecular-weight compound having a coordination site and a copper component.
Abstract:
There is provided a pattern forming method including: (a) a process of forming a film by resin (P) having a repeating unit (a) having a cyclic structure and a partial structure represented by the following Formula (I), (II-1) or (II-2), and a repeating unit (b) having a group which decomposes by the action of an acid to generates a polar group, and an actinic ray-sensitive or radiation-sensitive resin composition containing compound (B) which generates acid upon irradiation with an actinic ray or radiation; (b) a process of exposing the film; and (c) a process of forming a negative-type pattern by performing development using a developer including an organic solvent, an actinic ray-sensitive or radiation-sensitive resin composition used therefor, a resist film, a method of manufacturing an electronic device, and an electronic device.
Abstract:
There is provided a pattern forming method comprising (i) a step of forming a film by using an actinic ray-sensitive or radiation-sensitive composition containing (A) a non-polymeric acid-decomposable compound having an aromatic ring and a molecular weight of 500 to 5,000 and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (ii) a step of exposing the film, and (iii) a step of performing development by using an organic solvent-containing developer to form a negative pattern.
Abstract:
There is provided a pattern forming method, including: (a) forming a film by an actinic ray-sensitive or radiation-sensitive resin composition containing: (A) a resin capable of increasing polarity by an action of an acid to decrease solubility in an organic solvent-containing developer, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (C) a solvent, and (D) a resin, which contains substantially no fluorine atom and silicon atom and is other than the resin (A), (b) exposing the film; and (c) performing development using the organic solvent-containing developer to form a negative type pattern, wherein a receding contact angle of water on the film formed by (a) is 70° or more.
Abstract:
A pattern forming method contains: (i) a step of forming a bottom anti-reflective coating on a substrate by using a first resin composition (I), (ii) a step of forming a resist film on the bottom anti-reflective coating by using a second resin composition (II), (iii) a step of exposing a multi-layered film having the bottom anti-reflective coating and the resist film, and (iv) a step of developing the bottom anti-reflective coating and the resist film in the exposed multi-layered film by using an organic solvent-containing developer to form a negative pattern.
Abstract:
A near-infrared cut filter has a first infrared absorbing layer including an infrared absorber A, a second infrared absorbing layer including an infrared absorber C, and a resin layer disposed between the first infrared absorbing layer and the second infrared absorbing layer.
Abstract:
Provided are a near-infrared-absorbing composition capable of forming a cured film having excellent heat resistance while maintaining high near-infrared-shielding properties, a near-infrared cut filter obtained using the same, a process for producing said cut filter, a camera module and a process for producing the same, and a solid photographing element.The near-infrared-absorbing composition includes a near-infrared-absorbing compound (A1) obtained from a reaction between a low-molecular-weight compound which has two or more coordination sites to a metal component or a coordination site to a metal component and a cross-linking group and has a molecular weight of 1800 or lower or a salt thereof and the metal component and a near-infrared-absorbing compound (B) obtained from a reaction between a high-molecular-weight compound having a repeating unit represented by Formula (II) below or a salt thereof and a metal component.In Formula (II), R2 represents an organic group, Y1 represents a single bond or a divalent linking group, and X2 represents the coordination site to the metal component.
Abstract:
Provided are infrared absorbing compositions that allow for preparing infrared absorption patterns having good adhesiveness to substrates on which the infrared absorbing composition is applied. The infrared absorbing composition contains an infrared absorbing material, and a polymerizable compound containing a partial structure represented by formula (1) below: wherein R1 represents a hydrogen atom or an organic group; the asterisk (*) indicates a point of attachment to another atom.
Abstract:
There is provided a pattern forming method comprising (i) a step of forming a film by using an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a resin capable of increasing the polarity by the action of an acid to decrease the solubility for an organic solvent-containing developer, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (C) a solvent, and (D) a resin substantially free from a fluorine atom and a silicon atom and different from the resin (A), (ii) a step of exposing the film, and (iii) a step of performing development by using an organic solvent-containing developer to form a negative pattern.