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公开(公告)号：US10359586B2
公开(公告)日：2019-07-23
申请号：US14873743
申请日：2015-10-02
Applicant: FINISAR CORPORATION
Inventor： Tat Ming Teo , John Hsieh , William H. Wang , Jinxiang Liu , Hon Siu Wee , Troy Wy Piew Chiang
Abstract: An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.
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公开(公告)号：US10295768B2
公开(公告)日：2019-05-21
申请号：US15644494
申请日：2017-07-07
Applicant: Finisar Corporation
Inventor： Wendy Pei Fen Lau , Paul Thien Vui Chia , Yunpeng Song , Tat Ming Teo , Yew-Tai Chieng
IPC: G02B6/42
Abstract: One example embodiment includes an optical subassembly (OSA). The OSA includes a leadframe circuit, an optical port, and an active optical component subassembly. The active optical component subassembly is mounted to the leadframe circuit. The optical port is mechanically coupled to the leadframe circuit.
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公开(公告)号：US20190101962A1
公开(公告)日：2019-04-04
申请号：US15925620
申请日：2018-03-19
Applicant: FINISAR CORPORATION
Inventor： Tat Ming Teo , Chris Kiyoshi Togami
IPC: G06F1/18
Abstract: An example embodiment includes an electromagnetic radiation (EMR) shield. The EMR shield is configured to reduce EMR from escaping a host device. The EMR shield includes a structure, two or more module-grounding tabs, and multiple fingers. The structure is configured to substantially surround two or more adjacent transceiver modules positioned in an opening defined in a bezel. The two or more module-grounding tabs extend from the structure. Each of the module-grounding tabs is configured to contact one of the transceiver modules. The fingers extend from the structure and are configured to contact the bezel at multiple contact areas substantially surrounding the opening.
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公开(公告)号：US09354407B2
公开(公告)日：2016-05-31
申请号：US13963900
申请日：2013-08-09
Applicant: FINISAR CORPORATION
Inventor： Tat Ming Teo , Chris K. Togami , Frank J. Flens
IPC: G02B6/42
CPC classification number: G02B6/4261 , G02B6/4204 , G02B6/4249 , G02B6/4278 , G02B6/428 , G02B6/4284 , H01R13/62933 , Y10T29/49863
Abstract: An example embodiment includes a communication module. The communication module includes a shell, a printed circuit board assembly (“PCBA”) at least partially positioned within the shell, an optical transmitter electrically coupled to the PCBA, an optical receiver electrically coupled to the PCBA, and a biasing assembly. The biasing assembly includes a latch cover configured to be attached to the shell, a slider, and a spring. The slider is configured to operate a latching mechanism that releasably connects the module to a host device through a mechanical connection. The slider includes a main body including a first end, an arm extending from the first end, and a stopper feature extending from the arm. The spring is positioned between the latch cover and the stopper feature to bias the latching mechanism.
Abstract translation: 示例性实施例包括通信模块。 通信模块包括壳体，至少部分地定位在壳体内的印刷电路板组件（“PCBA”），电耦合到PCBA的光学发射器，电耦合到PCBA的光学接收器以及偏置组件。 偏压组件包括构造成连接到壳体上的闩锁盖，滑块和弹簧。 该滑块构造成操作一个通过机械连接将模块可释放地连接到主机设备的闭锁机构。 滑块包括主体，其包括第一端，从第一端延伸的臂以及从臂延伸的止动件。 弹簧定位在闩锁盖和止动器特征之间以偏压闩锁机构。
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公开(公告)号：US20140064677A1
公开(公告)日：2014-03-06
申请号：US14071511
申请日：2013-11-04
Applicant: FINISAR CORPORATION
Inventor： Tat Ming Teo
CPC classification number: H04B10/40 , G02B6/36 , G02B6/4201 , G02B6/4246
Abstract: A pluggable ONU transceiver module comprises a top shell, a bottom shell configured to mate with the top shell to form a cavity, and a PCB disposed within the cavity. A plurality of pins are coupled to the PCB and are configured to be inserted into a protruding socket of a host device through the bottom shell. The protruding socket is mounted on a PCB of the host device. The pluggable ONU transceiver module further comprises one or more guiding features integrated with the bottom shell and configured to ensure that the pins are inserted correctly into the protruding socket, and means for positioning the top shell at a predetermined height above the PCB of the host device to allow coupling of the top shell to a heatsink of the host device.
Abstract translation: 可插拔ONU收发器模块包括顶壳，被配置为与顶壳匹配以形成空腔的底壳以及设置在腔内的PCB。 多个引脚耦合到PCB，并且被配置成通过底壳插入主机设备的突出插座中。 突出的插座安装在主机设备的PCB上。 可插拔ONU收发器模块还包括与底部壳体集成的一个或多个引导特征并且被配置为确保销被正确地插入到突出插座中，以及用于将顶部壳体定位在主机设备的PCB上方的预定高度的装置 以允许顶壳与主机设备的散热器耦合。
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Patent Agency Ranking
公开(公告)号：US10802232B2
公开(公告)日：2020-10-13
申请号：US16519729
申请日：2019-07-23
Applicant: FINISAR CORPORATION
Inventor： Tat Ming Teo , John Hsieh , William H. Wang , Jinxiang Liu , Hon Siu Wee , Troy Wy Piew Chiang
Abstract: An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.
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公开(公告)号：US20190339467A1
公开(公告)日：2019-11-07
申请号：US15969567
申请日：2018-05-02
Applicant: FINISAR CORPORATION
Inventor： Derek Soon , Tat Ming Teo , William H. Wang , Siu Wee Hon
Abstract: A communication module handle may include a base, a grasp, a hinge, and a detent. The hinge may connect the base and the grasp. The detent may be configured to maintain a position of the grasp relative to the base in an extended position. In response to the detent being subjected to a detent-releasing force, the detent may release the grasp from the extended position to a collapsed position. The grasp may be rotatable relative to the base by way of the hinge in the collapsed position.
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公开(公告)号：US20180011267A1
公开(公告)日：2018-01-11
申请号：US15644494
申请日：2017-07-07
Applicant: Finisar Corporation
Inventor： Wendy Pei Fen Lau , Paul Thien Vui Chia , Yunpeng Song , Tat Ming Teo , Yew-Tai Chieng
IPC: G02B6/42
CPC classification number: G02B6/4274 , G02B6/4263 , G02B6/4269 , G02B6/4286
Abstract: One example embodiment includes an optical subassembly (OSA). The OSA includes a leadframe circuit, an optical port, and an active optical component subassembly. The active optical component subassembly is mounted to the leadframe circuit. The optical port is mechanically coupled to the leadframe circuit.
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公开(公告)号：US20170261711A1
公开(公告)日：2017-09-14
申请号：US15457717
申请日：2017-03-13
Applicant: FINISAR CORPORATION
Inventor： Troy Wy Piew Chiang , Julia Koh , Tat Ming Teo , William H. Wang
CPC classification number: G02B6/4267 , G02B6/4246 , G02B6/4269 , G02B6/4271 , G02B6/4273 , G02B6/4292 , H04B10/40 , H04B10/50 , H04B10/501 , H05K7/2039
Abstract: A thermal interface may include a thermally conductive cap. The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings.
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公开(公告)号：US09572283B2
公开(公告)日：2017-02-14
申请号：US14571071
申请日：2014-12-15
Applicant: FINISAR CORPORATION
Inventor： Tat Ming Teo , Troy Wy Piew Chiang , JianBing Zhao
CPC classification number: H05K7/2039 , F28F3/02 , G02B6/4266 , G02B6/4281 , H05K7/20
Abstract: An example embodiment includes a thermal conduction system for dissipating thermal energy generated by operation of an optical subassembly that is disposed within a shell of a communication module. The thermal conduction system can include a thermally conductive flexible member that contacts the optical subassembly and the shell of the communication module. By contacting the optical subassembly and the shell, the thermal energy generated by operation of the optical subassembly can transfer from the optical subassembly to the shell. The thermally conductive flexible member defines thermally conductive flexible member holes that correspond to pins extending from the optical subassembly. The pins pass through the thermally conductive flexible member holes enabling the thermally conductive flexible member to contact the optical subassembly.
Abstract translation: 示例性实施例包括用于消散由设置在通信模块的外壳内的光学子组件的操作产生的热能的热传导系统。 热传导系统可以包括接触光学子组件和通信模块的外壳的导热柔性构件。 通过接触光学子组件和壳体，由光学子组件的操作产生的热能可以从光学子组件转移到壳体。 导热柔性构件限定对应于从光学子组件延伸的销的导热柔性构件孔。 销穿过导热柔性构件孔，使得导热柔性构件能够接触光学子组件。
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