Abstract:
The disclosed photosensitive matrix comprises, in a standard way, a P type semiconductor substrate, an N type channel layer separated by narrow insulating zones into a plurality of columns and, on a thin layer of insulating oxide placed on the channel layer, a network of transfer gates extending perpendicularly to the insulating zones, dividing the columns into a large number of "pixels". According to the invention, the matrix has, between the substrate and the channel layer, a weakly doped P type base layer, in which are buried anti-blooming diodes consisting of a narrow, strongly doped N type drain extending in a direction parallel to the insulation zones. Beneath the drain, there is a strongly doped, P type protective screen. The arrangement gives an optical aperture of the matrix close to unity and a spectral response that is improved towards the red side of the spectrum owing to the thickness of the base layer.
Abstract:
FIG. 1 is a perspective view of a stretcher bar frame showing my new design; FIG. 2 is an enlarged front perspective view thereof; FIG. 3 is a rear perspective view of FIG. 2; FIG. 4 is a front elevational view of FIG. 2; FIG. 5 is a right-side elevational view of FIG. 2; FIG. 6 is a top plan view of FIG. 2; FIG. 7 is a bottom plan view of FIG. 2; FIG. 8 is an enlarged left-side elevational view of FIG. 2; and, FIG. 9 is an enlarged right-side elevational view of FIG. 2. The broken lines in FIG. 1 depict environment and form no part of the claimed design. The dash-dot lines in the figures depict boundary lines of the design. The additional broken lines depict portions of the stretcher bar frame, which form no part of the claimed design.
Abstract:
A microelectronic device may include a substrate, a plurality of components on the substrate, an insulating layer adjacent the substrate, and a plurality of metallic interconnection levels within the insulating layer and for the plurality of components. The plurality of metallic interconnection levels may include at least one given metallic level including a plurality of conductive lines of a first metallic material, and at least one other metallic level adjacent the at least one given metallic level. The at least one other metallic level may include at least one conductive zone of the first metallic material and coupled to at least one of the plurality of conductive lines of the at least one given metallic level, and at least one other conductive zone of a second metallic material and coupled to at least one other of the plurality of conductive lines of the at least one given metallic level.
Abstract:
An image sensor including a P-type doped layer of a semiconductor material including first and second opposite surfaces; and at least one photodiode formed in the layer on the side of the first surface and intended to be lit through the second surface. The dopant concentration in the layer increases from the first surface to the second surface.
Abstract:
An integrated circuit includes at least one photodiode of the floating substrate type which is associated with a read transistor. The photodiode is formed from a buried layer lying beneath the floating substrate and an upper layer lying on the floating substrate. The upper layer incorporates the source and drain regions of the read transistor. The source and drain regions are produced on either side of the gate of the read transistor. An isolating trench is located alongside the source region and extends from the upper surface of the upper layer down to below the buried layer, so as to isolate the source region from said buried layer.
Abstract:
A method of controlling a MOS-type photodetector includes transferring electrical charge between a photodiode (12) and a sensing node (3) via a transfer transistor. The electrical potential of the sensing node (3) takes an extreme value when a maximum quantity of electrical charge is stored on the sensing node (3). During the electrical charge transfer, an electrical potential is applied to the gate electrode of a transfer transistor in such a way that the electrical potential of the channel (2) of the transfer transistor is brought to a value equal to the extreme value of the electrical potential of the sensing node (3) multiplied by a number greater than or equal to unity.
Abstract:
The photodiode comprises an upper pn junction (D1) formed between an upper layer and an intermediate layer supported by one portion of a semiconductor substrate. A lower junction is formed between the intermediate layer and the substrate portion. The forward bias voltage of the upper junction (D1) is lower than the forward bias voltage of the lower junction (D2). The charges are permitted to be stored in the photodiode until the said upper junction is forward-biased so as to favour (A1) the recombination of the carriers coming from the intermediate layer with the carriers of the upper layer.
Abstract:
The invention relates to a device for tensioning a canvas on a frame, which is for assembling two bars the ends of which comprise a groove. The device comprises: an optional sheath intended to be immobilized in a groove; a spacer comprising a central portion from which extend two lateral portions each having a bearing face coming to abut against the bottom of the sheath; a tensioner comprising a central portion from which extend securing means for securing the tensioner to the bars, via the sheath; a connecting member for connecting the spacer to the tensioner, and means for bringing the spacer closer to the tensioner, wherein the spacer being brought closer to the tensioner will cause each bar to translate along its longitudinal axis so as to space the bars apart from each other while keeping them perpendicular to each other.