-
公开(公告)号：USD743903S1
公开(公告)日：2015-11-24
申请号：US29510310
申请日：2014-11-26
Applicant: General Electric Company
Designer： Andrew Louis Krivonak , Mark Allen Murphy , Frank Dolski
-
公开(公告)号：USD743897S1
公开(公告)日：2015-11-24
申请号：US29509884
申请日：2014-11-21
Applicant: General Electric Company
-
13.发明授权Method and apparatus for mechanical load reduction on the electrical terminals of a capacitor 有权用于在电容器的电端子上进行机械负载降低的方法和装置公开(公告)号：US09179544B1
公开(公告)日：2015-11-03
申请号：US14263681
申请日：2014-04-28
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Andrew Louis Krivonak , Patrick Lee Jansen , Mark Allen Murphy , Frank Dolski
CPC classification number: H05K1/028 , H01G2/02 , H01G2/065 , H01G2/106 , H01G4/228 , H05K1/181 , H05K3/30 , H05K5/0026 , H05K7/1432 , H05K2201/0397 , H05K2201/10015 , H05K2201/10272
Abstract: In an embodiment, an apparatus for reducing the mechanical load on the electrical terminals of a capacitor includes a plate having a planar body and one or more deflectable tabs connected to the planar body, one or more capacitors respectively mounted to the plate via the one or more deflectable tabs, and a busbar electrically connected to the one or more capacitors such that the one or more capacitors are arranged intermediate the plate and the busbar. The deflectable tabs are configured to support the capacitors, and to move towards and away from the planar body for accommodating size variances in the capacitors relative to a fixed spacing between the busbar and an enclosure.
Abstract translation: 在一个实施例中，用于减小电容器的电端子上的机械负载的装置包括具有平面主体的板和连接到平面主体的一个或多个可偏转突片，一个或多个电容器分别经由一个或多个 更可偏转的接片和与该一个或多个电容器电连接的母线，使得一个或多个电容器布置在板和母线之间。 可偏转突片被构造成支撑电容器，并且朝向和远离平面主体移动，以相对于母线和外壳之间的固定间隔来容纳电容器中的尺寸变化。
-
公开(公告)号：US10383261B2
公开(公告)日：2019-08-13
申请号：US15222478
申请日：2016-07-28
Applicant: General Electric Company
Inventor： Andrew Louis Krivonak , Theodore Clark Brown , Shreenath Shekar Perlaguri , Brian Magann Rush , Rajendra Yammanuru , Naveenan Thiagarajan , Arunpandi Radhakrishnan
IPC: H05K7/20 , H01L23/467 , H01L23/473
Abstract: A system includes a front plate, first and second side plates extending from the front plate, a bridge heat sink coupled to and extending from the front plate between the side plates, and a heat pipe coupled to the front plate. The front plate defines a slot therethrough between the front and back sides. The first side plate includes a fin bank mounted on an outer side thereof. The bridge heat sink defines a fluid channel that is fluidly connected to the slot of the front plate. The fluid channel is configured to receive a first cooling fluid therein to dissipate heat from electronics packages that engage the bridge heat sink. The heat pipe extends to and at least partially through the fin bank. The heat pipe contains a second cooling fluid therein that transfers heat absorbed from the front plate to the fin bank for dissipating heat.
-
公开(公告)号：USD825463S1
公开(公告)日：2018-08-14
申请号：US29628414
申请日：2017-12-05
Applicant: GENERAL ELECTRIC COMPANY
-
Patent Agency Ranking
公开(公告)号：USD807824S1
公开(公告)日：2018-01-16
申请号：US29571352
申请日：2016-07-18
Applicant: GENERAL ELECTRIC COMPANY
-
公开(公告)号：US20170112020A1
公开(公告)日：2017-04-20
申请号：US14918082
申请日：2015-10-20
Applicant: General Electric Company
Inventor： Andrew Louis Krivonak , Shreenath Shekar Perlaguri , Rajendra Yammanuru , Arunpandi Radhakrishnan , Theodore Clark Brown
CPC classification number: H01L23/467 , B23K1/00 , B23K1/0012 , B23K2101/14 , B23K2101/36 , H01L23/473 , H05K7/20918 , H05K7/20927
Abstract: A system includes a front plate, a manifold cover, and bridge heat sinks. The manifold cover is secured to the front plate to define a fluid distribution chamber along a front side of the front plate. The manifold cover defines a port opening through which a cooling fluid is received from outside of the manifold cover. The bridge heat sinks extend rearward from a back side of the front plate. The bridge heat sinks define fluid channels that are fluidly connected with the fluid distribution chamber through corresponding slots in the front plate. The fluid distribution chamber is configured to distribute the cooling fluid received from outside of the manifold cover through the fluid channels of the bridge heat sinks in order to cool one or more electronics packages disposed along the bridge heat sinks without the cooling fluid engaging the one or more electronics packages.
-
公开(公告)号：US20170112018A1
公开(公告)日：2017-04-20
申请号：US15222478
申请日：2016-07-28
Applicant: General Electric Company
Inventor： Andrew Louis Krivonak , Theodore Clark Brown , Shreenath Shekar Perlaguri , Brian Magann Rush , Rajendra Yammanuru , Naveenan Thiagarajan , Arunpandi Radhakrishnan
IPC: H05K7/20
CPC classification number: H05K7/20927 , H01L23/467 , H01L23/473 , H05K7/20263 , H05K7/20336 , H05K7/20881
Abstract: A system includes a front plate, first and second side plates extending from the front plate, a bridge heat sink coupled to and extending from the front plate between the side plates, and a heat pipe coupled to the front plate. The front plate defines a slot therethrough between the front and back sides. The first side plate includes a fin bank mounted on an outer side thereof. The bridge heat sink defines a fluid channel that is fluidly connected to the slot of the front plate. The fluid channel is configured to receive a first cooling fluid therein to dissipate heat from electronics packages that engage the bridge heat sink. The heat pipe extends to and at least partially through the fin bank. The heat pipe contains a second cooling fluid therein that transfers heat absorbed from the front plate to the fin bank for dissipating heat.
-
公开(公告)号：USD777666S1
公开(公告)日：2017-01-31
申请号：US29547602
申请日：2015-12-04
Applicant: General Electric Company
Designer： Andrew Louis Krivonak , Theodore Clark Brown , Mark Allen Murphy , Frank Dolski , Michael Grutkowski
-
公开(公告)号：USD777665S1
公开(公告)日：2017-01-31
申请号：US29547600
申请日：2015-12-04
Applicant: General Electric Company
Designer： Andrew Louis Krivonak , Theodore Clark Brown , Mark Allen Murphy , Frank Dolski , Michael Grutkowski
-
-
-
-
-
-
-
-
-
Search Results
21
records
(took 0.017 seconds)
