公开(公告)号：US09851397B2

公开(公告)日：2017-12-26

申请号：US14635125

申请日：2015-03-02

Applicant: GLOBALFOUNDRIES INC.

Inventor： Fen Chen ,  Cathryn J. Christiansen ,  Deborah M. Massey ,  Prakash Periasamy ,  Michael A. Shinosky

IPC: G01R31/00 ,  G01R31/28 ,  H01L21/00 ,  G01N1/00

CPC classification number: G01R31/2858 ,  G01N1/00 ,  H01L21/00 ,  H01L2221/00

Abstract: A system for electromigration testing is disclosed. The system includes a conductive member, a cap layer of insulative material over at least a portion of a top surface of the conductive member, a cathode conductively connected to a first end of the conductive member; an anode conductively connected to a second end of the conductive member, and a current source conductively connected to the cathode and the anode. A plurality of sensory pins are disposed along a length of the conductive member between the first end and the second end of the conductive member. The sensory pins are conductively connected to a bottom surface of the conductive member. At least one measurement device is conductively connected to at least one sensory pin of the plurality of sensory pins. The at least one measurement device determines a resistance of at least one portion of the conductive member.

公开(公告)号：US09831194B1

公开(公告)日：2017-11-28

申请号：US15203326

申请日：2016-07-06

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Tom C. Lee ,  Cathryn J. Christiansen ,  Ian A. McCallum-Cook ,  Anthony K. Stamper

IPC: H01L23/00 ,  H01L23/544 ,  H01L21/78

CPC classification number: H01L23/562 ,  H01L21/78 ,  H01L23/544 ,  H01L23/585 ,  H01L2223/54426 ,  H01L2223/5446

Abstract: Structures for a chip, as well as methods of fabricating such chip structures. The chip including a portion of a substrate, an active circuit region associated with the portion of the substrate, an interconnect structure on the active circuit region, and a crackstop extending through the interconnect structure. A groove extends through the interconnect structure to the substrate at a location exterior of the crackstop. A stress-containing layer is formed on at least a portion of the groove.