公开(公告)号：US09866971B2

公开(公告)日：2018-01-09

申请号：US15305089

申请日：2014-08-26

Applicant: GOERTEK INC.

Inventor： Quanbo Zou ,  Zhe Wang ,  Jifang Tao ,  Guanxun Qiu

IPC: H04R25/00 ,  H04R19/02 ,  H04R7/06 ,  H04R31/00 ,  H04R19/01 ,  B81B7/00 ,  B81C1/00

CPC classification number: H04R19/02 ,  B81B7/008 ,  B81B2201/0257 ,  B81B2201/032 ,  B81B2203/0127 ,  B81B2207/012 ,  B81C1/00158 ,  B81C2201/0197 ,  H04R7/06 ,  H04R19/013 ,  H04R31/00 ,  H04R31/003 ,  H04R2201/003 ,  H04R2307/025 ,  H04R2307/027

Abstract: The present invention provides a method for manufacturing a thermal bimorph diaphragm and a MEMS speaker with thermal bimorphs, wherein the method comprises the steps of: thermally oxidizing a substrate to obtain an insulating layer thereon and providing a metal layer on the insulating layer; providing a sacrificial layer on the metal layer; providing a first thermal bimorph layer on the sacrificial layer; providing a second thermal bimorph layer on the first thermal bimorph layer; providing a metal connecting layer at the positions on the metal layer where the sacrificial layer is not provided; forming corresponding back holes on the substrate and the insulating layer and releasing the sacrificial layer; forming the thermal bimorph diaphragm which is warped with the first thermal bimorph layer and the second thermal bimorph layer after the sacrificial layer is released.

公开(公告)号：US11388526B2

公开(公告)日：2022-07-12

申请号：US16640009

申请日：2018-09-06

Applicant: GOERTEK, INC.

Inventor： Quanbo Zou ,  Yongwei Dong

IPC: H04R19/00 ,  H04R19/04 ,  B81B7/00 ,  H04R7/00 ,  H01L29/788

Abstract: An MEMS microphone is provided, comprising: a first substrate; a vibration diaphragm supported above the first substrate by a spacing portion, the first substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the first substrate; and a floating gate field effect transistor outputting a varying electrical signal, the floating gate field effect transistor including a source electrode and a drain electrode both provided on the first substrate and a floating gate provided on the vibration diaphragm.

公开(公告)号：US11297414B2

公开(公告)日：2022-04-05

申请号：US16760803

申请日：2018-09-06

Applicant: Goertek, Inc.

Inventor： Quanbo Zou ,  Yongwei Dong

IPC: H04R1/28 ,  B81B3/00 ,  H04R19/04

Abstract: An MEMS microphone is provided, comprising a substrate and a vibration diaphragm supported above the substrate by a spacing portion, the substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the substrate, wherein: a lower electrode forming a capacitor structure with the vibration diaphragm is provided on the substrate, and an electret layer providing an electric field between the vibration diaphragm and the lower electrode is provided on the substrate

公开(公告)号：US11128957B2

公开(公告)日：2021-09-21

申请号：US15769798

申请日：2015-10-21

Applicant: Goertek Inc.

Inventor： Quanbo Zou ,  Zhe Wang ,  Jun Li

IPC: H04R17/00 ,  H04R31/00 ,  H01L41/083 ,  H01L41/29 ,  H04R1/02

Abstract: A micro-speaker, the manufacturing method thereof, a speaker device and an electronic apparatus are described herein. The micro-speaker comprises a case, wherein the case has an opening; and a piezoelectric layer, wherein one or more electrodes are provided on the piezoelectric layer, and wherein the piezoelectric layer is pre-buckled in its rest position, wherein the piezoelectric layer covers the opening and is bonded onto the case, to form a speaker rear cavity together with the case. The micro-speaker of the present invention has a relatively low speaker profile.

公开(公告)号：US11099466B2

公开(公告)日：2021-08-24

申请号：US16475758

申请日：2017-01-09

Applicant: GOERTEK. INC

Inventor： Peixuan Chen ,  Quanbo Zou ,  Xiangxu Feng

IPC: G03B21/20 ,  H04N9/31 ,  G03B21/00

Abstract: A projection module and an electronics apparatus are provided. The projection module comprises: a projection chip, having micro semiconductor light emitting devices thereon; and a projection lens unit, wherein the micro semiconductor light emitting devices produce projection light to create a projection image, and the projection lens unit receives the projection image and projects it to a projection surface.

公开(公告)号：US11024773B2

公开(公告)日：2021-06-01

申请号：US16347603

申请日：2016-11-06

Applicant: GOERTEK. INC

Inventor： Quanbo Zou ,  Peixuan Chen ,  Xiangxu Feng

IPC: H01L33/38 ,  H01L27/32 ,  H01L33/14 ,  H01L33/40 ,  H01L33/52

Abstract: The present invention discloses a micro-LED with vertical structure, display device, electronics apparatus and manufacturing method. The micro-LED with vertical structure comprises: a bottom electrode bonded on a display substrate; a first type doped region provided above the bottom electrode; a second type doped region provided above the first type doped region; and a side-contact electrode covering at least one part of a peripheral of the second type doped region.

公开(公告)号：US10937924B2

公开(公告)日：2021-03-02

申请号：US16339482

申请日：2016-10-08

Applicant: GOERTEK. INC

Inventor： Quanbo Zou ,  Zhe Wang ,  Peixuan Chen ,  Xiangxu Feng

IPC: H01L33/00 ,  H01L33/08 ,  G09F9/33 ,  H01L25/075 ,  H01L33/38 ,  H01L33/42 ,  H01L33/54

Abstract: A display device and an electronics apparatus, the display device comprises: a display substrate; and at least two stacked layers on the display substrate, wherein each stacked layer includes one micro-LED array.

公开(公告)号：US10896927B2

公开(公告)日：2021-01-19

申请号：US16320019

申请日：2016-08-22

Applicant: GOERTEK INC.

Inventor： Quanbo Zou ,  Peixuan Chen ,  Xiangxu Feng

IPC: H01L27/15 ,  H01L33/62 ,  H01L33/60 ,  H01L33/00 ,  H01L25/075

Abstract: A micro-LED transfer method, manufacturing method and device are provided. The micro-LED transfer method comprises: obtaining a laser-transparent carrier substrate having a first surface and a second surface with micro-LEDs; forming a protection layer on at least one of the first surface and the second surface and a third surface of a receiving substrate, wherein the third surface is to receive the micro-LEDs to be transferred via pads; bringing the micro-LEDs to be transferred into contact with the pads on the third surface; and irradiating the micro-LEDs to be transferred with laser from the first surface to lift-off the micro-LEDs to be transferred from the carrier substrate wherein the protection layer configured to protect the third surface from the irradiation of the laser.

公开(公告)号：US10773950B2

公开(公告)日：2020-09-15

申请号：US16339455

申请日：2016-10-08

Applicant: GOERTEK. INC

Inventor： Quanbo Zou

IPC: H04R19/04 ,  B81B7/00

Abstract: An MEMS microphone device and an electronics apparatus are provided. The MEMS microphone device comprises: a substrate; a MEMS microphone element placed on the substrate; a cover encapsulating the MEMS microphone element together with the substrate; and an acoustic port for the MEMS microphone element, wherein a compliant membrane is provided to seal the acoustic port, and the membrane has a mechanical stiffness lower than that of the diaphragm of the MEMS microphone element.

公开(公告)号：US10687147B2

公开(公告)日：2020-06-16

申请号：US16316527

申请日：2016-07-11

Applicant: GOERTEK INC.

Inventor： Quanbo Zou

IPC: H04R17/02 ,  H04R31/00

Abstract: Disclosed are a MEMS microphone and an electronic apparatus. The MEMS microphone comprises: a pressure sensing element, for sensing pressure applied thereon; a diaphragm attached to the pressure sensing element and applying pressure to the pressure sensing element; and a backbone attached to the pressure sensing element and supporting the pressure sensing element.