Method of forming non-planar membranes using CMP
    14.
    发明授权
    Method of forming non-planar membranes using CMP 有权
    使用CMP形成非平面膜的方法

    公开(公告)号:US08580691B2

    公开(公告)日:2013-11-12

    申请号:US13232012

    申请日:2011-09-14

    CPC classification number: B81C1/00103 B81B2203/0376 B81C2201/0104

    Abstract: A method of shaping a substrate in one embodiment includes providing a first support layer, providing a first shaping pattern on the first support layer, providing a substrate on the first shaping pattern, performing a first chemical mechanical polishing (CMP) process on the substrate positioned on the first shaping pattern, and removing the once polished substrate from the first shaping pattern.

    Abstract translation: 在一个实施例中,成形衬底的方法包括提供第一支撑层,在第一支撑层上提供第一成形图案,在第一成形图案上提供衬底,在定位的衬底上执行第一化学机械抛光(CMP)工艺 在第一成形图案上,并且从第一成形图案去除一次抛光的基板。

    Method of manufacturing a planar electrode with large surface area
    15.
    发明授权
    Method of manufacturing a planar electrode with large surface area 有权
    制造具有大表面积的平面电极的方法

    公开(公告)号:US08317882B2

    公开(公告)日:2012-11-27

    申请号:US12508894

    申请日:2009-07-24

    Abstract: A method for fabricating a pair of large surface area planar electrodes. The method includes forming a first template above a first substrate, the first template having a first plurality of pores, coating the first plurality of pores of the first template with a first layer of conducting material to form a first electrode, placing the first plurality of pores of the first electrode in proximity to a second electrode, thereby forming a gap between the first plurality of pores and the second electrode, and filling the gap with an electrolyte material.

    Abstract translation: 一种制造一对大面积平面电极的方法。 该方法包括在第一基板上形成第一模板,第一模板具有第一多个孔,用第一导电材料层涂覆第一模板的第一多个孔以形成第一电极,将第一多个 在第二电极附近形成第一电极的孔,从而在第一多个孔和第二电极之间形成间隙,并用电解质材料填充间隙。

    WAFER WITH RECESSED PLUG
    16.
    发明申请
    WAFER WITH RECESSED PLUG 有权
    带有接收插头的波形

    公开(公告)号:US20120261800A1

    公开(公告)日:2012-10-18

    申请号:US13232268

    申请日:2011-09-14

    CPC classification number: B81B7/00 B81B2203/0307 B81C1/00126 H01L21/76283

    Abstract: In one embodiment, a method of forming a plug includes providing a base layer, providing an intermediate oxide layer above an upper surface of the base layer, providing an upper layer above an upper surface of the intermediate oxide layer, etching a trench including a first trench portion extending through the upper layer, a second trench portion extending through the oxide layer, and a third trench portion extending into the base layer, depositing a first material portion within the third trench portion, depositing a second material portion within the second trench portion, and depositing a third material portion within the first trench portion.

    Abstract translation: 在一个实施例中,形成插头的方法包括提供基底层,在基底层的上表面上方提供中间氧化物层,在中间氧化物层的上表面上方提供上层,蚀刻包括第一 延伸穿过上层的沟槽部分,延伸穿过氧化物层的第二沟槽部分和延伸到基层中的第三沟槽部分,在第三沟槽部分内沉积第一材料部分,在第二沟槽部分内沉积第二材料部分 并且在第一沟槽部分内沉积第三材料部分。

    Microelectromechanical devices and fabrication methods
    17.
    发明授权
    Microelectromechanical devices and fabrication methods 有权
    微机电装置及制造方法

    公开(公告)号:US07956428B2

    公开(公告)日:2011-06-07

    申请号:US11205702

    申请日:2005-08-16

    Applicant: Gary Yama

    Inventor: Gary Yama

    CPC classification number: B81C1/00333

    Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device, having mechanical structures encapsulated in a chamber prior to final packaging. An embodiment further includes a buried polysilicon layer and a “protective layer” deposited over the buried polysilicon layer to prevent possible erosion of, or damage to the buried polysilicon layer during processing steps. The material that encapsulates the mechanical structures, when deposited, includes one or more of the following attributes: low tensile stress, good step coverage, maintains its integrity when subjected to subsequent processing, does not significantly and/or adversely impact the performance characteristics of the mechanical structures in the chamber (if coated with the material during deposition), and/or facilitates integration with high-performance integrated circuits. In one embodiment, the material that encapsulates the mechanical structures is, for example, silicon (polycrystalline, amorphous or porous, whether doped or undoped), silicon carbide, silicon-germanium, germanium, or gallium-arsenide.

    Abstract translation: 这里描述和说明了许多发明。 在一个方面,本发明涉及MEMS器件,以及制造或制造MEMS器件的技术,其具有在最终封装之前封装在腔室中的机械结构。 实施例还包括沉积在掩埋多晶硅层上的掩埋多晶硅层和“保护层”,以防止在处理步骤期间可能的侵蚀或损坏埋置的多晶硅层。 当沉积时,封装机械结构的材料包括以下属性中的一个或多个:低拉伸应力,良好的阶梯覆盖,在经受后续加工时保持其完整性,不会显着和/或不利地影响 室中的机械结构(如果在沉积期间涂覆材料)和/或促进与高性能集成电路的集成。 在一个实施例中,封装机械结构的材料是例如硅(多晶,无定形或多孔,无论掺杂或未掺杂),碳化硅,硅 - 锗,锗或砷化镓。

    Tri-axis accelerometer having a single proof mass and fully differential output signals
    18.
    发明授权
    Tri-axis accelerometer having a single proof mass and fully differential output signals 有权
    三轴加速度计具有单个检测质量和全差分输出信号

    公开(公告)号:US07757555B2

    公开(公告)日:2010-07-20

    申请号:US11513669

    申请日:2006-08-30

    Abstract: A tri-axis accelerometer includes a proof mass, at least four anchor points arranged in at least two opposite pairs, a first pair of anchor points being arranged opposite one another along a first axis, a second pair of anchor points being arranged opposite one another along a second axis, the first axis and the second axis being perpendicular to one another, and at least four spring units to connect the proof mass to the at least four anchor points, the spring units each including a pair of identical springs, each spring including a sensing unit.

    Abstract translation: 三轴加速度计包括证明质量块,至少四个锚点至少布置在两对相对中,第一对锚定点沿着第一轴线彼此相对布置,第二对固定点彼此相对布置 沿着第二轴线,所述第一轴线和所述第二轴线彼此垂直;以及至少四个弹簧单元,用于将所述证明物质连接到所述至少四个锚定点,所述弹簧单元各自包括一对相同的弹簧,每个弹簧 包括感测单元。

    METHOD OF EPITAXIALLY GROWING PIEZORESISTORS
    19.
    发明申请
    METHOD OF EPITAXIALLY GROWING PIEZORESISTORS 有权
    外延生长方法

    公开(公告)号:US20100176465A1

    公开(公告)日:2010-07-15

    申请号:US12353080

    申请日:2009-01-13

    CPC classification number: G01C19/56 G01P15/0802 G01P15/123 G01P2015/0817

    Abstract: A method of forming a device with a piezoresistor is disclosed herein. In one embodiment, the method includes providing a substrate, etching a trench in the substrate to form a vertical wall, growing a piezoresistor layer epitaxially on the vertical wall, and separating the vertical wall from an underlying layer of the substrate that extends along a horizontal plane such that the piezoresistor layer is movable with respect to the underlying layer within the horizontal plane.

    Abstract translation: 本文公开了一种用压电电阻器形成器件的方法。 在一个实施例中,该方法包括提供衬底,蚀刻衬底中的沟槽以形成垂直壁,在垂直壁上外延生长压敏电阻层,以及将垂直壁与沿着水平延伸的衬底的下层分离 使得压电电阻层相对于水平面内的下层是可移动的。

    Multi-ring resonator system and method
    20.
    发明授权
    Multi-ring resonator system and method 有权
    多环谐振器系统及方法

    公开(公告)号:US07750758B2

    公开(公告)日:2010-07-06

    申请号:US11850625

    申请日:2007-09-05

    Abstract: A system and method are provided which includes ring resonator structures coupled together with beam structure(s). The ring resonators are configured to operate in the contour or breathe mode. The center of the coupling beam structure is used as a nodal anchor point for anchoring the ring resonators and the beam structures, and also provides a reflecting interface. In an embodiment, the coupling beam structure includes two quarter-wavelength matched beams and an anchor located at a nodal point for coupling the two quarter-wavelength matched beams and ring resonator structures. The symmetric ring design also provides a differential drive and sense configuration while balancing the driving forces about the anchor located at the center of the beam structure. The system exhibits low energy losses while providing large sensing signals and a high quality factor (Q) of about 186,000 at a resonant frequency of about twenty-nine (29) MHz.

    Abstract translation: 提供了一种系统和方法,其包括与光束结构耦合在一起的环形谐振器结构。 环形谐振器被配置为在轮廓或呼吸模式下操作。 耦合梁结构的中心用作锚定环形谐振器和梁结构的节点锚点,并且还提供反射界面。 在一个实施例中,耦合波束结构包括两个四分之一波长匹配的波束和位于节点处的用于耦合两个四分之一波长匹配的波束和环形谐振器结构的锚。 对称环设计还提供差速驱动和感测构造,同时平衡位于梁结构中心处的锚的驱动力。 该系统在大约二十九(29)MHz的谐振频率下提供大的感测信号和约186,000的高质量因子(Q),表现出低能量损失。

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