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11.发明申请公开(公告)号：US20200063912A1
公开(公告)日：2020-02-27
申请号：US16532239
申请日：2019-08-05
Applicant: GOOGLE LLC
Inventor： Rochus Jacob , Francois Rybarczyk , Adam Scott Kilgore , Adam Duckworth Mittleman , Jason Evans Goulden
IPC: F16M11/20 , G03B17/56 , H04N5/225 , F16M11/04 , F16M11/10 , F16M13/02 , A47B97/00 , F16B1/00 , F16M11/08 , F16M11/16 , F16M11/22 , F16M11/24
Abstract: This application discloses a stand assembly that includes a receiving element for physically receiving a module, and a base assembly for supporting the receiving element. The receiving element further includes a module holding structure, an extended portion, and a first fastener structure coupled to an end of the extended portion. The base assembly includes a base, and a second fastener structure coupled to the base at a joint and configured to mate with the first fastener structure. The first fastener structure and the joint are configured to respectively provide a first degree of freedom of motion and a second degree of freedom of motion of the receiving element with respect to the base. The movement of the receiving element at the first degree of freedom has substantially consistent resistance through first part of a first full range of motion associated with the first degree of freedom of motion.
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公开(公告)号：US20180210521A1
公开(公告)日：2018-07-26
申请号：US15934773
申请日：2018-03-23
Applicant: Google LLC
Inventor： Adam Scott Kilgore , Andrea Chantal Ashwood
CPC classification number: G06F1/203 , G05B2219/2614 , G08B13/19619 , H04N5/2252 , H04N5/2254 , H04N5/2257
Abstract: The various implementations described herein include systems and devices that comprise a cooling structure. In one aspect, a camera system comprises a cooling structure made from a thermally conductive material. The cooling structure has an exterior surface, an interior surface, a hollow portion, and a sidewall. The sidewall includes a through hole that penetrates the sidewall. The exterior surface includes surface features and is configured to radiate away from the cooling structure heat generated within the hollow portion that is transmitted from the interior surface to the exterior surface. The camera system further comprises a camera contained within the hollow portion of the cooling structure, a first electrical component that is embedded in the through hole, electrical components contained within the hollow portion, and an external housing that at least partially encloses the cooling structure.
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公开(公告)号：US20210278030A1
公开(公告)日：2021-09-09
申请号：US17328501
申请日：2021-05-24
Applicant: Google LLC
Inventor： Arun Raghupathy , Benjamin Niewood , Cheng-Jung Lee , Adam Scott Kilgore
IPC: F16M11/20 , F16M13/00 , F16M11/10 , F16M13/02 , F16M11/14 , G03B17/08 , G03B17/55 , H04N5/225 , H04N7/18 , H05K7/20
Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing, and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.
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公开(公告)号：US20200332947A1
公开(公告)日：2020-10-22
申请号：US16903049
申请日：2020-06-16
Applicant: GOOGLE LLC
Inventor： Arun Raghupathy , Benjamin Niewood , Cheng-Jung Lee , Adam Scott Kilgore
IPC: F16M11/20 , F16M13/00 , F16M11/10 , F16M13/02 , F16M11/14 , G03B17/08 , G03B17/55 , H04N5/225 , H04N7/18 , H05K7/20
Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing, and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.
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公开(公告)号：US10683962B2
公开(公告)日：2020-06-16
申请号：US15607387
申请日：2017-05-26
Applicant: GOOGLE LLC
Inventor： Arun Raghupathy , Benjamin Niewood , Cheng-Jung Lee , Adam Scott Kilgore
IPC: H04N5/225 , F16M11/20 , F16M13/00 , F16M11/10 , F16M13/02 , F16M11/14 , G03B17/08 , G03B17/55 , H04N7/18 , H05K7/20 , F16M11/04 , F16M11/06 , A47B97/00 , G03B17/56 , F21V21/30 , F21V21/088 , F16M11/38
Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing, and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.
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Patent Agency Ranking
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公开(公告)号：US20180364538A1
公开(公告)日：2018-12-20
申请号：US16112284
申请日：2018-08-24
Applicant: GOOGLE LLC
Inventor： Adam Scott Kilgore , Amber Luttmann Volmering
IPC: G02F1/155 , H04N5/33 , H04N5/235 , H04N5/232 , H04N5/225 , G02B5/20 , G06K9/00 , G02F1/163 , G02F1/157 , G02F1/15
Abstract: This application is directed to a lens assembly configured to focus light on a sensor array of an optical device. The lens assembly comprises one or more optical lenses and an electrochromic layer positioned between the one or more optical lenses and the sensor array. The electrochromic layer has one or more optical properties that are responsive to voltage applied to the layer, including a first optical property related to optical transmissivity. The first optical property includes a first state, responsive to a first applied voltage, in which the layer is substantially opaque to a predefined band of IR wavelengths. The first optical property also includes a second state, responsive to a second applied voltage distinct from the first applied voltage, in which the layer is substantially transparent to the predefined band of IR wavelengths and visible wavelengths.
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公开(公告)号：US11680677B2
公开(公告)日：2023-06-20
申请号：US17657733
申请日：2022-04-01
Applicant: Google LLC
Inventor： Arun Raghupathy , Benjamin Niewood , Cheng-Jung Lee , Adam Scott Kilgore
IPC: H04N5/225 , F16M11/20 , F16M13/00 , F16M11/10 , F16M13/02 , F16M11/14 , G03B17/08 , H04N23/51 , G03B17/55 , H04N7/18 , H05K7/20 , F16M11/04 , F16M11/06 , A47B97/00 , G03B17/56 , F21V21/30 , F21V21/088 , F16M11/38 , H04N23/55
CPC classification number: F16M11/2035 , F16M11/105 , F16M11/14 , F16M13/00 , F16M13/005 , F16M13/02 , F16M13/022 , G03B17/08 , G03B17/55 , H04N7/181 , H04N23/51 , H05K7/20445 , A47B2097/003 , F16M11/041 , F16M11/06 , F16M11/2007 , F16M11/2064 , F16M11/38 , F21V21/088 , F21V21/30 , G03B17/561 , H04N23/55
Abstract: This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.
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公开(公告)号：US10678108B2
公开(公告)日：2020-06-09
申请号：US16112284
申请日：2018-08-24
Applicant: GOOGLE LLC
Inventor： Adam Scott Kilgore , Amber Luttmann Volmering
IPC: G02F1/155 , G02F1/1506 , G02F1/163 , G02F1/157 , H04N5/232 , H04N5/33 , G06K9/00 , H04N5/225 , H04N5/235 , G02F1/15 , G02B5/20
Abstract: This application is directed to a lens assembly configured to focus light on a sensor array of an optical device. The lens assembly comprises one or more optical lenses and an electrochromic layer positioned between the one or more optical lenses and the sensor array. The electrochromic layer has one or more optical properties that are responsive to voltage applied to the layer, including a first optical property related to optical transmissivity. The first optical property includes a first state, responsive to a first applied voltage, in which the layer is substantially opaque to a predefined band of IR wavelengths. The first optical property also includes a second state, responsive to a second applied voltage distinct from the first applied voltage, in which the layer is substantially transparent to the predefined band of IR wavelengths and visible wavelengths.
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公开(公告)号：US10656689B2
公开(公告)日：2020-05-19
申请号：US15934773
申请日：2018-03-23
Applicant: Google LLC
Inventor： Adam Scott Kilgore , Andrea Chantal Ashwood
IPC: H04N5/225 , G06F1/20 , G08B13/196 , H05K7/20
Abstract: The various implementations described herein include systems and devices that comprise a cooling structure. In one aspect, a camera system comprises a cooling structure made from a thermally conductive material. The cooling structure has an exterior surface, an interior surface, a hollow portion, and a sidewall. The sidewall includes a through hole that penetrates the sidewall. The exterior surface includes surface features and is configured to radiate away from the cooling structure heat generated within the hollow portion that is transmitted from the interior surface to the exterior surface. The camera system further comprises a camera contained within the hollow portion of the cooling structure, a first electrical component that is embedded in the through hole, electrical components contained within the hollow portion, and an external housing that at least partially encloses the cooling structure.
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